MSc thesis project proposal

Monolithic Integration of Quartz Spacers for Novel Imaging Technologies

This project aims to fully integrate the implementation of apertures, pinholes or slits for novel imaging sensor purposes. The current method of realizing the envisioned devices is a manual process that is expensive and labour intensive. To increase the reproducibility and reduce the costs, a CMOS compatible fabrication is desired. The challenge is to find ways of implementing the quartz spacer without covering the entire dies (to allow front-side wire bonding), while not affecting the underlying CMOS electronics.

Assignment

The student will perform the assignment at ECTM:
  • Duration: ~9 months
  • Location: EKL cleanrooms and facilities

The expected activities to be carried out by the student are:
  • Investigation of bonding methods of quartz spacers on die-level
  • Fabrication of bonded chips in EKL facilities
  • Characterization of bonding method on active devices
  • Characterization of light transmittance of bonded chips

Requirements

You are an ambitious master student looking for a challenging thesis project on a practical engineering problem. You have a physics, material science or microelectronics background and an interest in micro fabrication technology. Good communication skills in English and a pro-active attitude are expected.

Contact

MSc Joost Romijn

Electronic Components, Technology and Materials Group

Department of Microelectronics

Last modified: 2019-05-20