MSc thesis project proposal

Double Grating Image Sensor Optimization for Light Source Tracking

This project aims to identify optimized double grating image sensor architectures for light source tracking. The double grating principle is favoured, as this removes the need for apertures, lenses or other optics. This allows for complete fabrication of the sensor on wafer-scale, which cuts down the costs and increases the alignment accuracy dramatically.

The double grating principle typically makes use of the Talbot and moiré effects, which creates 2-dimensional wavefields on the underlying photodiodes. These wavefields vary periodically in intensity, which is related to the direction of the light source. Effectively, a single pixel is a single point in the 2-dimensional planar Fourier domain. By creating unique double grating compositions for each pixel, one can ‘tile’ this 2-dimensional Fourier space. The transfer matrix of the image sensor is used to transform the data in the Fourier domain back to an image. This image is then used to identify where the light source is located at.

The double grating principle might also function for large gratings that do not cause diffraction. This would allow for use in technologies without feature sizes in the targeted wavelength range.

Assignment

The student will perform the assignment at ECTM:
  • Duration: ~9 months
  • Location: EKL cleanrooms and facilities
The expected activities to be carried out by the student are:
  • In-depth simulation of double grating image sensor architectures
  • Analysis of the design parameters
  • Fabrication of the design in EKL facilities
  • Characterization of fabricated devices

Requirements

You are an ambitious master student looking for a challenging thesis project on a sensor architecture optimization. You have a physics, imaging or microelectronics background and an interest in microfabrication technology. Good communication skills in English and a pro-active attitude are expected.

Contact

MSc Joost Romijn

Electronic Components, Technology and Materials Group

Department of Microelectronics

Last modified: 2019-06-25