In the Laboratory of Electronic Components, Technology and Materials (ECTM) of the Department of Microelectronics and Computer Engineering nationally and internationally recognized research and development is carried out in the field of silicon technology. Currently the most important application area's are Organ-on-Cip and Microsystems/MEMS Technology, Flexible and Strechable Electronics, and micro/nano System Integration and Reliability.

Job @ NXP: Mechanical Engineer

Postdoc: Next generation micro-assembly processes


In a large direct collaborative project with the Dutch company Nexperia we research and develop extremely fast and innovative chip assembly processes for the next generation of assembly machines.