personal profile

prof.dr. Lina Sarro

Professor, Chairman

Expertise: Integrated silicon sensor and MEMS technology, electronic material processing and novel microstructures

Themes: MEMS Technology, Micro/Nano System Integration and Reliability

Lina (Pasqualina M.) Sarro received the Laurea degree in Physics (magna cum laude) with specialization in Solid-State Physics, from the University of Naples, Italy, in 1980. From 1979 till 1981 she was a research assistant associated with Professor F.P.Califano in the Semiconductor Devices Group of the Department of Electrical Engineering, working on new low cost fabrication techniques for silicon solar cells and thin film solar cells. From 1981 to 1983, she was a post-doctoral fellow associated with Professor J.J.Loferski in the Photovoltaic Research Group of the Division of Engineering, Brown University, Rhode Island, U.S.A. where she worked on thin-film photovoltaic cell fabrication by chemical spray pyrolysis. In October 1983 she joined the Electronic Instrumentation Laboratory of the Delft University of Technology, Delft, The Netherlands as a research assistant associated with Professor S.Middelhoek, working on infrared sensors based on integrated silicon thermopiles fabricated by IC technology and silicon micromachining. On October 1, 1987, she received the Ph.D. degree in Electrical Engineering and then joined the Delft institute of microsystems and nanoelectronics (Dimes) leading research on integrated silicon sensor and MEMS technology, electronic material processing and novel microstructures. In December 2001 she was appointed A. van Leeuwenhoek Professor in Microsystems Technology. She is currently the Head of the Electronic Components, Technology and Materials (ECTM) Laboratory at the Delft University of Technology. Since October 2009 she is also the Microelectronic Department Chair. The department counts about 35 staff members, 100+ PhD students and 70+ MSc students. She is the recipient of the 2004 Eurosensors Fellow Award, The AISEM Career Award (2007), The IEEE 2012 Sensors Council Meritorious Award and co-recipient of the Rudolph Kingslake Medal (1997). Since 2006 she is a member of the Royal Netherlands Academy of Sciences (KNAW) and IEEE Fellow. She has authored and co-authored more than 500 journal and conference papers. She acts as reviewer for a number of technical journals and is member of the International Steering Committee for several international conferences (IEEE MEMS, IEEE Sensors, Eurosensors, Transducers). She was the Technical Program Chair for the first three IEEE Sensors Conferences (2002- 2004) and the General co-chair of IEEE MEMS 2009 Conference and she will act as General co-chair for IEEE Sensors 2014 and European TPC Chair for Transducers 2015.


EE4C01 Profile orientation and academic skills

Introduction to the EE program and research groups

ET4289 Integrated circuits and MEMS technology

introduction in the fabrication technologies used for Integrated Circuits and MEMS


Artificial Dielectrics for High-frequency On-Chip antennas

Goal: To achieve optimized, reliable, flexible and low-cost manufacturing of the breakthrough technology of Artificial Dielectric (AD) layers, as the solution to the surface-wave problem of high-frequency on-chip antennas.

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

Thermal management in 3d heterogeneous integration

Wafer-scale fabrication of graphene for sensing applications

Sensing Devices for Organ on Chip Technology

Fabrication of Ultrathin Dynodes for Timed Photon Counter

BiopsyPen: A portable coherent tomography scanner

Smart Optics

Piezoelectric Technology for Liquid Applications

Projects history

Artificial Dielectric Layer for Terahertz application

MEMS nanoreactors for atomic-scale microscopy of nanomaterials under industrially relevant conditions

MEMS nanoreactors are used to study chemical reactions in high-resolution microscopes

Carbon nanotube and atomic layer based solid-state supercapacitors

Thin-film encapsulation of MEMS microcavities

With zero-level packaging or thin-film encapsulation, MEMS are already sealed during wafer processing.

Last updated: 21 Apr 2016