dr. V.A. Henneken

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Dec 2008): Product-internal assembly functions: a novel micro-assembly concept applied to optical interconnects
Promotor: Urs Staufer, Lina Sarro

Expertise: Miniaturization-related system integration

Themes: MEMS Technology

Biography

R&D specialist having PhD in mechanical engineering with focus on MEMS development. Direct experience in cleanroom fabrication, microsystem design, modelling and testing. Broad interest in miniaturization-related system integration projects involving silicon and non-silicon components.

Projects history

Sensors and Circuits on Catheters

How to bring highly miniaturized circuits, sensors and actuators to the tip of the catheters and other minimal invasive surgical instruments?

  1. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
    Kawasaki, S.; Giagka, V.; de Haas, M.; Louwerse, M.; Henneken, V.; van Heesch, C.; Dekker, R.;
    In 9th International IEEE/EMBS Conference on Neural Engineering. IEEE,
    2019. DOI: https://doi.org/10.1109/NER.2019.8717064

  2. Generic platform for the miniaturization of bioelectronic implants
    M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
    In Design of Medical Devices Conference (DMD Europe),
    2017.

  3. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,
    2016.

  4. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

  5. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,
    2016.

  6. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
    2016.
    document

  7. Miniaturized Optical Data Link Assembly for 360 �m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

  8. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,
    2015.

  9. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

  10. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

  11. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

  12. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

  13. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

  14. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  15. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

  16. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

  17. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M.Sarro;
    J. Micromech and Microeng.,
    Volume 16, Issue 6, pp. 107-115, 2006.

  18. In-package MEMS-based thermal actuators for micro-assembly
    V.A. Henneken; M. Tichem; P.M. Sarro;
    J. Micromech. Microeng.,
    Volume 16, pp. S107-S115, 2006.

  19. Improved thermal U-beam actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In P.Enoksson (Ed.), Proc. Eurosensors XX,
    Goteborg, Sweden, Sept. 2006.
    document

  20. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In Proc. MME,
    2005.

  21. Design of in-package MST-based actuators for micro-assembly
    V. Henneken; S. van der Bedem; M. Tichem; B. Karpuschewski; P.M. Sarro;
    In Proc SAFE & Prorisc 2004,
    Veldhoven, pp. 747-752, Nov. 2004. ISBN 90-73461-43X.

BibTeX support

Last updated: 16 Jun 2014

Vincent Henneken

Alumnus