Electronic Components, Technology and Materials
Department of Microelectronics

dr. Zhen Cui

Postdoc
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Dec 2021): Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment
Promotor: GuoQi Zhang, Xuejun Fan, Sten Vollebregt

Themes: Micro/Nano System Integration and Reliability

Biography

Zhen Cui received the B.S. degree in engineering mechanics from Taiyuan University of Technology, Shanxi, China, in 2014. Then, he received the M.S. degree in solid mechanics from Tianjin University, Tianjin, China, in 2017. He is currently pursuing a PhD degree at Delft University of Technology, Delft, Netherlands. He mainly focuses on the theoretical breakthrough of electromigration in micro/nanoelectronics, establishing a complete multi-physics and multi-scale model. His research interests also lie in the mechanical failure analysis of electronic devices, multi-physics modelling for electronic components, as well as the multi-scale modelling for materials used in gas sensor, LED packaging and nanoparticle sintering for power devices.

Publications

  1. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
    Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan3, Xuejun Fan4; Guoqi Zhang;
    Journal of Physics: Condensed Matter,
    2022.
    document

  2. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,
    2021.
    document

  3. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  4. Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment
    Zhen Cui;
    PhD thesis, Delft University Technology, 2021.
    document

  5. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: https://doi.org/10.1016/j.apsusc.2020.145251

  6. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

  7. Implementation of General Coupling Model of Electromigration in ANSYS
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    In IEEE 70th Electronic Components and Technology Conference (ECTC),
    2020.
    document

  8. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
    Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; GuoQi Zhang; Rong Sun; Chingping Wong;
    ACS Applied Materials & Interfaces,
    2019.

  9. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019. DOI: https://doi.org/10.1063/1.5065376

  10. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
    Journal of Luminescence,
    Volume 219, pp. 116874, 2019. DOI: https://doi.org/10.1016/j.jlumin.2019.116874
    document

  11. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  12. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
    Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
    In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
    2018. DOI: https://doi.org/10.1109/EDTM.2018.8421434

BibTeX support

Last updated: 20 Dec 2021

Zhen Cui

MSc students