MSc Dong Hu

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Power electronics packaging

Themes: Micro/Nano System Integration and Reliability

Biography

Dong Hu received his M.Sc degree in Nanotechnology from Kungliga Tekniska Högskolan (Sweden), and his Bachelor degree in material science and engineering from Harbin Institute of Technology (China), in 2019 and 2016 respectively.

In January 2019, he joined the Electronic Components, Technology and Materials (ECTM) group as a master thesis student. Currently, he is a PhD researcher and works with Prof. Kouchi Zhang. His main research topic is nanomaterial-based advanced power packages.

Last updated: 20 May 2020