MSc Dong Hu

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Power electronics packaging

Themes: Micro/Nano System Integration and Reliability

Biography

Dong Hu received his M.Sc degree in Nanotechnology from Kungliga Tekniska Högskolan (Sweden), and his Bachelor degree in material science and engineering from Harbin Institute of Technology (China), in 2019 and 2016 respectively.

In January 2019, he joined the Electronic Components, Technology and Materials (ECTM) group as a master thesis student. Currently, he is a PhD researcher and works with Prof. Kouchi Zhang. His main research topic is nanomaterial-based advanced power packages.

Power2Power

European research project Power2Power for more efficient power semiconductors

  1. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,
    2021.
    document

  2. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  3. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
    Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
    Sensors and Actuators A: Physical,
    Volume 314, pp. 112217, 2020.
    document

  4. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

BibTeX support

Last updated: 20 May 2020