MSc Dong Hu
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics
Expertise: Power electronics packagingThemes: Micro/Nano System Integration and Reliability
Dong Hu received his M.Sc degree in Nanotechnology from Kungliga Tekniska Högskolan (Sweden), and his Bachelor degree in material science and engineering from Harbin Institute of Technology (China), in 2019 and 2016 respectively.
In January 2019, he joined the Electronic Components, Technology and Materials (ECTM) group as a master thesis student. Currently, he is a PhD researcher and works with Prof. Kouchi Zhang. His main research topic is nanomaterial-based advanced power packages.
European research project Power2Power for more efficient power semiconductors
- Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
Journal of Physical Chemistry C,
- Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846
- Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
Sensors and Actuators A: Physical,
Volume 314, pp. 112217, 2020.
- Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
Results in Physics,
Last updated: 20 May 2020