Ronald Dekker

1. Modeling and Characterization of Pre-Charged Collapse-Mode CMUTs
   M. Saccher; S. Kawasaki; J. H. Klootwijk; R. Van Schaijk; R. Dekker;
   IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control,
   Volume 3, pp. 14-28, 2023. DOI: 10.1109/OJUFFC.2023.3240699

2. 25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters
   Jian Li; Chenhui Li; Vincent Henneken; Marcus Louwerse; Jeannet Van Rens; Paul Dijkstra; Oded Raz; Ronald Dekker;
   Journal of Lightwave Technology,
   Volume 40, Issue 8, pp. 2456-2464, 2022. DOI: 10.1109/JLT.2021.3137981

3. A Microfluidic Cancer-on-Chip Platform Predicts Drug Response Using Organotypic Tumor Slice Culture
   Sanjiban Chakrabarty; William F. Quiros-Solano; Maayke M.P. Kuijten; Ben Haspels; Sandeep Mallya; Calvin Shun Yu Lo; Amr Othman; Cinzia Silvestri; Anja van de Stolpe; Nikolas Gaio; Hanny Odijk; Marieke van de Ven; Corrina M.A. de Ridder; Wytske M. van Weerden; Jos Jonkers and Ronald Dekker; Nitika Taneja; Roland Kanaar; Dik C. van Gent;
   Cancer Research,
   Volume 82, Issue 3, pp. 510-520, 2022. DOI: 10.1158/0008-5472.CAN-21-0799

4. Focused ultrasound neuromodulation on a multiwell MEA
   Marta Saccher; Shinnosuke Kawasaki; Martina Proietti Onori; Geeske M. van Woerden; Vasiliki Giagka; Ronald Dekker;
   Bioelectronic Medicine,
   Volume 8, 2022. DOI: 10.1186/s42234-021-00083-7

5. Bulk Acoustic Wave Based Microfluidic Particle Sorting With Capacitive Micromachined Ultrasonic Transducers
   Shinnosuke Kawasaki; Jia-Jun Yeh; Marta Saccher; Jian Li; Ronald Dekker;
   In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
   2022. DOI: 10.1109/MEMS51670.2022.9699807

6. Time-efficient low power time/phase-reversal beamforming for the tracking of ultrasound implantable devices
   M. Saccher; S.S. Lolla; S. Kawasaki; R. Dekker;
   In IEEE International Ultrasonics Symposium (IUS),
   2022. DOI: 10.1109/IUS54386.2022.9957652

7. Monolithic Integration of a Smart Temperature Sensor on a Modular Silicon-based Organ-on-a-chip Device
   Ronaldo Martins da Ponte; Nikolas Gaio; Henk van Zeijl; Sten Vollebregt; Paul Dijkstra; Ronald Dekker; Wouter A. Serdijn; Vasiliki Giagka;
   Sensors and Actuators A: Physical,
   Volume 317, pp. 112439, 2021. DOI: 10.1016/j.sna.2020.112439
   document

8. Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication
   Kluba, Marta Maria; Li, Jian; Parkkinen, Katja; Louwerse, Marcus; Snijder, Jaap; Dekker, Ronald;
   Micromachines 2021, 12(4), 414;,
   Volume 12, Issue 4, 2021. DOI: 10.3390/mi12040414
   document

9. A microwatt telemetry protocol for targeting deep implants
   S. Kawasaki; I. Subramaniam; M. Saccher; R. Dekker;
   In Proc. IEEE International Ultrasonics Symposium,
   2021. DOI: 10.1109/IUS52206.2021.9593603

10. Microelectronmechanical organs-on-chip
    Massimo Mastrangeli; Hande Aydogmus; Milica Dostanic; Paul Motreuil-Ragot; Nele Revyn; Bjorn de Wagenaar; Ronald Dekker; Pasqualina M. Sarro;
    In 21st Int. Conf. on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2021),
    online, 20-25 June, 2021.

11. The long-term reliability of pre-charged CMUTs for the powering of deep implanted devices
    M. Saccher; S. Kawasaki; R. Dekker;
    In Proc. IEEE International Ultrasonics Symposium,
    2021. DOI: 10.1109/IUS52206.2021.9593683

12. Pre-charged collapse-mode capacitive micromachined ultrasonic transducer (CMUT) for broadband ultrasound power transfer
    S. Kawasaki; Y. Westhoek; I. Subramaniam; M. Saccher; R. Dekker;
    In Proc. IEEE Wireless Power Transfer Conference,
    2021. DOI: 10.1109/WPTC51349.2021.9458104

13. Low-Impedance PEDOT:PSS MEA Integrated in a Stretchable Organ-on-Chip Device
    Affan K. Waafi; Nikolas Gaio; William F. Quiros-Solano; Paul Dijkstra; Pasqualina M. Sarro; Ronald Dekker;
    IEEE Sensors,
    Volume 20, Issue 3, pp. 1150-1157, 2020. DOI: 10.1109/JSEN.2019.2946854

14. Multi-axial electro-mechanical testing methodology for highly stretchable freestanding micron-sized structures
    S. Shafqat; A.M. Savov; S. Joshi; R. Dekker; M.G.D. Geers; J.P.M. Hoefnagels;
    Journal of Micromechanics and Microengineering,
    Volume 30, Issue 5, pp. 1--17, 2020. DOI: 10.1088/1361-6439/ab748f

15. Embedded High-Density Trench Capacitors for Smart Catheters
    Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
    In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

16. PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
    N. B. Babaroud; R. Dekker; W. Serdijn; V. Giagka;
    In 2020 42nd Annual International Conference of the IEEE Engineering in Medicine Biology Society (EMBC),
    pp. 3399-3402, July 2020. DOI: 10.1109/EMBC44109.2020.9175646

17. Metal and Polymeric Strain Gauges for Si-Based, Monolithically Fabricated Organs-on-Chips
    Quirós-Solano, William F.; Gaio, Nikolas; Silvestri, Cinzia; Pandraud, Gregory; Dekker, Ronald; Sarro, Pasqualina M.;
    Micromachines,
    Volume 10, Issue 8, pp. 536, Aug 2019. DOI: 10.3390/mi10080536
    document

18. Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices
    Mountain, C.; Kluba, M.; Bergers, L.; Snijder, J.; Dekker, R.;
    Micro and Nano Engineering,
    2019. DOI: 10.1016/j.mne.2019.100043

19. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
    Kawasaki, S.; Giagka, V.; de Haas, M.; Louwerse, M.; Henneken, V.; van Heesch, C.; Dekker, R.;
    In 9th International IEEE/EMBS Conference on Neural Engineering. IEEE,
    2019. DOI: 10.1109/NER.2019.8717064

20. Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
    Nanbakhsh, K.; Kluba, M.; Pahl, B.; Bourgeois, F.; Dekker, R.; Serdijn, W.; Giagka, V.;
    In 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC),
    IEEE, pp. 3840-3844, 2019. DOI: 10.1109/EMBC.2019.8857702

21. Towards a semi-flexible parylene-based platform technology for active implantable medical devices
    Bakhshaee Babaroud, N.; Kluba, M.; Dekker, R.; Serdijn, W.; Giagka, V.;
    In 7th Dutch Bio-Medical Engineering Conference - Egmond aan Zee, Netherlands,
    2019.
    document

22. A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects
    Angel Savov; Shivani Savov; Salman Shafqat; Johan Hoefnagels; Marcus Louwerse; Ronald Stoute; Ronald Dekker;
    Micromachines,
    Volume 9, Issue 1, pp. 39, 2018.
    document

23. Microfabricated tuneable and transferable porous PDMS membranes for Organs-on-Chips
    W. F. Quirós-Solano; N. Gaio; O. M. J. A. Stassen; Y. B. Arik; C. Silvestri; N. C. A. Van Engeland; A. Van der Meer; R. Passier; C. M. Sahlgren; C. V. C. Bouten; A. van den Berg; R. Dekker; P. M. Sarro;
    Scientific Reports,
    pp. 13524, 2018. DOI: 10.1038/s41598-018-31912-6

24. Investigation of 'Fur-like' Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
    Shivani Joshi; Angel Savov; Salman Shafqat; Ronald Dekker;
    Materials Science in Semiconductor Processing,
    Volume 75, pp. 130-135, 2018.
    document

25. Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization
    Marta Kluba; Bruno Morana; Angel Savov; Henk Van Zeijl; Gregory Pandraud; Ronald Dekker;
    In Proceedings Eurosensors,
    pp. 941, 2018. DOI: 10.3390/proceedings2130941

26. A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly
    William.F Quirós-Solano; Nikolas Gaio; Cinzia Silvestri; Oscar M. J. A. Arik; Yusuf, B. Stassen; Andries van der Meer; Carlijn V.C. Bouten; Albert van den Berg; Ronald Dekker; P.M. Sarro;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 318-321, 2018.

27. A Multi Well Plate Organ-on-chip (Ooc) Device For In-vitro Cell Culture Stimulation And Monitoring
    N. Gaio; A. Waafi; M.L.H. Vlaming; E. Boschman; P. Dijkstra; P. Nacken; S.R. Braam; C. Boucsein; P.M. Sarro; R. Dekker;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    2018.

28. Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches
    Joshi, Shivani; Bagani, Rishab; Beckers, Lucas; Dekker, Ronald;
    In Proceedings of Eurosensors,
    pp. 307, 2017.

29. Generic platform for the miniaturization of bioelectronic implants
    M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
    In Design of Medical Devices Conference (DMD Europe),
    2017.

30. Next generation smart catheters
    R. Dekker;
    In Philips Research,
    2017.

31. Singe-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
    M. Kluba; A. Arslan; R. Stoute; J. Muganda; R. Dekker;
    In Eurosensors,
    2017.
    document

32. Towards the Next Generation Smart Catheters and implants
    R. Dekker;
    In Smart Systems Industry Summit,
    DSP Valley, 2017.
    document

33. Organ-on-Chip
    R. Dekker;
    In Professors in de theatre arena,
    Theatre de Veste, Technical University of Delft, 2017.
    document

34. Towards the next generation of smart catheters and bioelectronics medicines
    R. Dekker;
    In Tyndall Technology Days 2017,
    2017.
    document

35. A low-cost electrical read-out system for cell stiffness measurement using silicon based microfluidic device
    S. Kawasaki; M. M. Kluba; R. Dekker;
    In ICT.OPEN,
    2017.

36. The Next Generation Smart Catheters
    R. Dekker;
    Maxwell, November 2017. "Maxwell" is a periodical of the Delft university of technology that is distributed amongst students and alumni.

37. Cytostretch, an Organ-on-Chip Platform
    Gaio, N.; van Meer, B.; Quiros Solano, W.; Bergers, L.; van de Stolpe, A.; Mummery, C.; Sarro, P.M.; Dekker, R.;
    Micromachines,
    Volume 7, Issue 7, pp. 120, 2016.

38. Fabrication and characterization of an Upside-down Carbon Nanotube (CNT) Microelectrode array (MEA)
    Gaio, N.; Silvestri, C.; van Meer, B.; Vollebregt, S.; Mummery, C.; Dekker, R.;
    IEEE Sensors Journal,
    Volume 16, Issue 24, pp. 8685, 2016.

39. Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification
    Shivani Joshi; Antonie van Loona; Angel Savov; Ronald Dekker;
    MRS Advances,
    Volume 1, pp. 33-38, 2016.

40. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,
    2016.

41. CMOS compatible embedded microchannels
    R. Stoute; J.M. Muganda; S. Dahar; A. Arslan; R.J.M Henderikx; P.C.M. van Stiphout; J.M.J. den Toonder; R. Dekker;
    In 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences,
    2016.

42. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

43. High Aspect Ratio Buried Channel Fabricated Using Two Step DRIE Process
    M. M. Kluba; A. Arslan; R. Dekker;
    In ICT.OPEN,
    2016.

44. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,
    2016.

45. Flexible membrane sensor for opto-mechanical force transducer
    Ronald Stoute; James Muganda; Steven Beekmans; Davide Iannuzzi; Ronald Dekker;
    In 13th International Workshop on Nanomechanical Sensing,
    2016.

46. Flex-to-Rigid, an assembly platform for the next generation smart catheters
    R. Dekker;
    In Forum BE-FLEXIBLE,
    Fraunhofer EMFT, 2016.

47. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
    2016.
    document

48. Towards the Next Generation of Smart Catheters
    R. Dekker;
    In SEMICON Europa,
    2016.

49. Meet Dr. Frankenstein
    R. Dekker;
    Guest Lecture at École Polytechnique Fédérale de Lausanne, November 2016.
    document

50. A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays
    A.Savov; A. H. Noor; R. Dekker;
    In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International,,
    pp. 145-148, 2015.

51. Upside-down Carbon Nanotube (CNT) Micro-electrode Array (MEA)
    N. Gaio; B. van Meer; C. Silvestri; Saeed Khoshfetrat Pakazad; S. Vollebregt; C.L. Mummery; R. Dekker;
    In IEEE Sensors Conference,
    2015.

52. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,
    2015.

53. Miniaturized Optical Data Link Assembly for 360 �m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

54. A novel stretchable micro-electrode array (SMEA) design for directional stretching of cells
    S Khoshfetrat Pakazad; A Savov; A van de Stolpe; R Dekker;
    Journal of Micromechanics and Microengineering,
    Volume 24, Issue 3, pp. 034003, 2014.

55. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

56. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

57. Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments
    Benjamin Mimoun; Vincent Henneken; Arjen van der Horst; Ronald Dekker;
    IEEE Sensors Journal,
    Volume 13, Issue 10, 2013. DOI: 10.1109/JSEN.2013.2252613

58. A manufacturable platform for in vito electrophysiological studies under mechanical stimulation
    S. Khoshferat Pakazad; A. Savov; R. Dekker;
    In Proceedings of the 17th international conference on miniaturized systems for chemistry and life sciences,
    pp. 1412-1414, 2013.

59. A novel SMEA design for directional stretching of cells
    S. Khoshferat Pakazad; A. Savov and. A. van der Stolpe; R. Dekker;
    In Proceedings of the 2013 International Conference on Microtechnologies in Medicine,
    pp. 6-7, 2013.

60. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

61. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

62. Thermal flow sensors on flexible substrates for minimally invasive medical instruments
    B. Mimoun; A. van der Horst; D. van der Voort; M. Rutten; R. Dekker; F. van de Vosse;
    In Proc. of IEEE Sensors Conference 2012,
    Taipei, Taiwan, pp. 1-4, Oct. 2012 2012. DOI 10.1109/ICSENS.2012.6411429.

63. A platform for manufacturable stretchable micro-electrode arrays
    S. Khoshfetrat Pakazad; A. Savov; S.R. Braam; R. Dekker;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 817-820, Sep 2012. DOI 10.1016/j.proeng.2012.09.272.

64. Flexible multipolar cuff microelectrode for FES of sacral nerve roots
    F. Rodrigues; B. Mimoun; M. Bartek; P.M. Mendes; R. Dekker;
    In Proc. 17th Annual International FES Society Conference (IFESS 2012),
    Banff, Alberta, Canada, pp. 1-4, Sept. 2012.

65. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

66. Atomic-scale electron-beam sculpting of near-defect-free graphene nanostructures
    B. Song; G.F. Schneider; Q. Xu; G. Pandraud; C. Dekker; H.W. Zandbergen;
    Nano Letters,
    Volume 11, Issue 6, pp. 2247-2250, 2011. DOI 10.1021/nl200369r.

67. A novel SOI-MEMS �micro-swing� time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 2066-2069, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969225.

68. A stretchable micro-electrode array for in vitro electrophysiology
    S. Khoshfetrat Pakazad; A. Metodiev Savov; A. van de Stolpe; S. Braam; B. van Meer; R. Dekker;
    In Proc. 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 829-832, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734553.

69. Millimeter-wave integrated waveguides on silicon
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; L.C.N. de Vreede; B. Rejaei;
    In Proc. 2011 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems (SiRF 2011),
    Phoenix, AZ, pp. 37-40, Jan. 2011. ISBN 978-1-4244-8060-9; DOI 10.1109/SIRF.2011.5719314.

70. FleXss: A standalone Matlab-based graphical user interface (GUI) for stress-strain analytical modeling of multilayered structures with applied bending
    B. Mimoun; A. Vieira da Silva; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

71. Living chips-Chips for the living
    R. Dekker; B. Mimoun; S. Pakazaad;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

72. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

73. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

74. FleSS: a Matlab Based Graphical User Interface for Stress � Strain Analytical Modeling of Multilayered Structures with Applied Bending
    A. Vieira da Silva; B. Mimoun; R. Dekker;
    In Proc. of 13th Workshop on Semiconductors Advances for Future Electronics and Sensors 2010 (SAFE 2010),
    Veldhoven, The Netherlands, STW, pp. 175-179, 2010. ISBN 978-90-73461-67-3).

75. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

76. High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; P. de Graaf; R. Dekker;
    Sensors and actuators a-physical,
    Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247.

77. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

78. Parylene-embedded metal interconnects for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. International Conference on Electronics Packaging (ICEP 2009),
    Kyoto, Japan, JIEP, IEEE, pp. 611-615, 2009.

79. Fabrication of Stretchable PDMS Membrane as Substrate Material for Multi-Electrode Array Devices
    R. Li; A. van Bogaard; R. Dekker;
    In Proc. of SAFE 2009,
    Veldhoven, The Netherlands, pp. 91-94, 2009.
    document

80. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In Proc. of 12th Workshop on Semiconductors Advances for Future Electronics and Sensors 2009 (SAFE 2009),
    Veldhoven, The Netherlands: STW (ISBN: 978-90-73461-62-8)-Best Flash Presentation Award, pp. 95-98, 2009.

81. Biocompatible encapsulation of CMOS based chemical sensors
    T. Prodomakis; K. Michelakis; T. Zoumpoulidis; R. Dekker; C. Toumazou;
    In Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 791-794, 2009.

82. Large-area silicon electronics using stretchable metal interconnect
    S. Sosin; T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. 59th Electronic Components & Technology Conference (ECTC 2009),
    San Diego, CA, pp. 1059-1064, 2009.

83. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In 2nd International Workshop on Flexible & Stretchable Electronics 2009,
    Ghent, Belgium, 2009.
    document

84. Front-to back-side overlay optimization after wafer bonding for 3D integration
    L. Marinier; W. van Noort; R. Pellens; B. Sutedja; R. Dekker; H. W. van Zeijl;
    In Proc. 31st International Conference on Micro- and Nano-Engineering 2005,
    Vienna, Austria, Sep. 2005.
    document

85. A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
    L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
    IEEE Trans. on Electron Devices,
    Volume 51, Issue 1, pp. 42-50, Jan. 2004.

86. Substrate Transfer Technology
    R. Dekker;
    PhD thesis, Delft University of Technology, Jun. 2004. ISBN 90-74445-61-6; Promotors: prof. J.W. Slotboom, prof. J.N. Burghartz.

87. Substrate Transfer for RF Technologies
    R. Dekker; P.G.M. Baltus; H.G.R. Maas;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 3, pp. 747-757, Mar. 2003.

88. Design and characterization of integrated passive elements on high ohmic silicon
    E. Valletta; J. van Beek; A. Den Dekker; N. Pulsford; H.F.F. Jos; L.C.N. de Vreede; L.K. Nanver; J.N. Burghartz;
    In 2003 IEEE MTT-S International Microwave Symposium,
    Philadelphia, PA, USA, pp. 1235 -1238, Jun. 2003.

89. 7781af6e4ower added efficiency surface-mounted bipolar power transistors for low-voltage wireless applications
    R. Dekker; D.M.H. Hartskeer; H.G.R. Maas; F. Van Rijs; J.W. Slotboom;
    BCTM,
    pp. 191-194, 2000.

90. Ultra-low-temperature low-ohmic contacts for SOA applications
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