Jing Zhang

Publications

  1. Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
    Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  2. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

  3. Fast Qualification of Solder Reliability in Solid-state Lightning System
    Jing Zhang;
    PhD thesis, Delft University of Technology, 2015.
    document

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