Jing Zhang
Publications
- Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Reliability optimization of gold-tin eutectic die attach layer in HEMT package
Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
In 13th China International Forum on Solid State Lighting (SSLChina),
2016.
document - Fast Qualification of Solder Reliability in Solid-state Lightning System
Jing Zhang;
PhD thesis, Delft University of Technology, 2015.
document