Hong Wah Chan


  1. Effect of thermal annealing and chemical treatments on secondary electron emission properties of atomic layer deposited MgO
    Violeta Prodanovic; Hong Wah Chan; Anil U. Mane; Jeffrey W. Elam; Matthias M. Minjauw; Christophe Detavernier; Harry van der Graaf; Pasqualina M. Sarro;
    Journal of Vacuum Science and Technology A,
    Volume 36, Issue 6, pp. 06A102-1-9, 2018.

  2. Ultra-thin Alumina and Silicon Nitride MEMS Fabricated Membranes for the Electron Multiplication
    Violeta Prodanović; Hong Wah Chan; W A van der Graaf; Lina Sarro;
    Volume 29, pp. 155703, 2018.

  3. Ultra-thin ALD MGO membranes as mems transmission dynodes in a timed photon counter
    Violeta Prodanovic; Hong Wah Chan; Anil U Mane; Jeffrey W Elam; Harry VD Graaf; Pasqualina M Sarro;
    In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
    pp. 740-743, 2017.

  4. Potential applications of electron emission membranes in medicine
    Yevgen Bilevych; Stefan E. Brunner; Hong Wah Chan; Edoardo Charbon; Harry van der Graaf; Cornelis W. Hagen; Gert Nützelf; Serge D. Pintof; Violeta Prodanović; Daan Rotman; Fabio Santagata; Lina Sarro; Dennis R. Schaar;
    Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
    Volume 809, pp. 171-174, 2016.

  5. The Tynode: A new vacuum electron multiplier
    Harry van der Graaf; Hassan Akhtar; Neil Budko; Hong Wah Chan; Cornelis W. Hagen; Conny C.T. Hansson; Gert Nützel; Serge D. Pinto; Violeta Prodanović; Behrouz Raftari; Pasqualina M. Sarro; John Sinsheimer; John Smedle;
    Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,

  6. Optimization of Silicon-rich Silicon Nitride Films for Electron Multiplication in Timed Photon Counters
    V. Prodanovic; H.W. Chan; J. Smedley; A. Theulings; S. Tao; H.v.d. Graaf; P.M. Sarro;
    In Procedia Engineering 120: EUROSENSORS 2015,
    pp. 1111-1114, 2015.

  7. Study on thermal interface material with carbon nanotubes and carbon black in high-brightness LED packaging with flip-chip technology
    K. Zhang; G. W. Xiao; C. K. Y. Wong; H. W. Gu; M. M. F. Yuen; P. C. H. Chan; B. Xu;
    In Proceedings-Electronic Components and Technology Conference,
    Lake Buena Vista, FL, pp. 60-65, 2005.

  8. Monolithic Spiral Inductors fabricated using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates
    J.N. Burghartz; D.C. Edelstein; K.A. Jenkins; C. Jahnes; C. Uzoh; E.J. O Sullivan; K.K. Chan; M. Soyuer; P. Roper; S. Cordes;
    In IEEE International Electron Devices Meeting (IEDM),
    pp. 99-102, 1996.

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