Selected publications
- A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
IEEE Transactions on Power Electronics,
Volume 39, Issue 6, pp. 7643-7653, 2024. DOI: 10.1109/TPEL.2024.3369728 - Measuring residual stresses in individual on-chip interconnects using synchrotron
nanodiffraction
Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
Applied Physics Letters,
Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672 - Surface modification of multilayer graphene neural electrodes by local printing of platinum nanoparticles using spark ablation
Nasim Bakhshaee Babaroud; Samantha J. Rice; Maria Camarena Perez; Wouter A. Serdijn; Sten Vollebregt; Vasiliki Giagka;
Nanoscale,
2024. DOI: 10.1039/D3NR05523J - Highly-sensitive wafer-scale transfer-free graphene MEMS condenser microphones
Roberto Pezone; Sebastian Anzinger; Gabriele Baglioni; Hutomo Suryo Wasisto; Lina Sarro; Peter Steeneken; Sten Vollebregt;
Microsystems & Nanoengineering,
Volume 10, Issue 27, pp. 1-9, 2024. DOI: 10.1038/s41378-024-00656-x - Effect of air-loading on the performance limits of graphene microphones
R. Pezone; G. Baglioni; C. Van Ruiten; S. Anzinger; H. S. Wasisto; P. M. Sarro; P. G. Steeneken; S. Vollebregt;
Applied Physics Letters,
Volume 124, Issue 12, 2024. DOI: 10.1063/5.0191939 - A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material
Jiarui Mo; Shreyas Shankar; Roberto Pezone; Guoqi Zhang; Sten Vollebregt;
Microsystems & Nanoengineering,
Volume 10, Issue 42, 2024. DOI: 10.1038/s41378-024-00672-x - An Analog to Digital Converter in a SiC CMOS Technology for High-temperature Applications
Jiarui Mo; Yunfan Niu; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
Applied Physics Letters,
Volume 124, Issue 15, 2024. DOI: 10.1063/5.0195013 - Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
2024. - Printed spark ablation nanoparticle films for microelectronic applications
Joost van Ginkel;
PhD thesis, Delft University Technology, 2024. DOI: 10.4233/uuid:17b83ad6-3179-4a10-8194-90c4e6c768b2 - Optimization of multilayer graphene-based gas sensors by ultraviolet photoactivation
Álvaro Peña; Daniel Matatagui; Filiberto Ricciardella; Leandro Sacco; Sten Vollebregt; Daniel Otero; JesúsLópez-Sánchez; Pilar Marína; M.Carmen Horrillo;
Applied Surface Science,
Volume 610, pp. 155393, 2023. DOI: 10.1016/j.apsusc.2022.155393 - Manufacturing thin ionic polymer metal composite for sensing at the microscale
Paul Motreuil-Ragot; Andres Hunt; Leandro N. Sacco; Pasqualina M. Sarro; Massimo Mastrangeli;
Smart Materials and Structures,
Volume 32, pp. 035006, 2023. DOI: 10.1088/1361-665X/acb305 - Overview of Engineering Carbon Nanomaterials such as Carbon Nanotubes (CNTs), Carbon Nanofibers (CNFs), Graphene and Nanodiamonds and Other Carbon Allotropes inside Porous Anodic Alumina (PAA) Templates
Leandro Sacco; Sten Vollebregt;
MDPI Nanomaterials,
Volume 13, Issue 2, pp. 260, 2023. DOI: 10.3390/nano13020260 - Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503 - Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257 - Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256 - Ultra-sensitive graphene membranes for microphone applications
Gabriele Baglioni; Roberto Pezone; Sten Vollebregt; Katarina Cvetanović Zobenica; Marko Spasenović; Dejan Todorovic; Hanqing Liu; Gerard Verbiest; Herre S.J. van der Zant; Peter Gerard Steeneken;
Nanoscale,
Volume 15, pp. 6343-6352, 2023. DOI: 10.1039/D2NR05147H - Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
Joost Romijn; Sten Vollebregt; Vincent G. de Bie; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
Sensors and Actuators A: Physical,
Volume 354, pp. 114268, 2023. DOI: 10.1016/j.sna.2023.114268 - The sensitivity enhancement of TiO2-based VOCs sensor decorated by gold at room temperature
Mostafa Shooshtari; Sten Vollebregt; Yas Vaseghi; Mahshid Rajati; Saeideh Pahlavan;
IOP Nanotechnology,
Volume 34, Issue 25, pp. 255501, 2023. DOI: 10.1088/1361-6528/acc6d7 - Modeling and Characterization of Pre-Charged Collapse-Mode CMUTs
M. Saccher; S. Kawasaki; J. H. Klootwijk; R. Van Schaijk; R. Dekker;
IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control,
Volume 3, pp. 14-28, 2023. DOI: 10.1109/OJUFFC.2023.3240699 - A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
IEEE Electron Device Letters,
Volume 44, Issue 6, pp. 995-998, 2023. DOI: 10.1109/LED.2023.3268334 - An organ-on-chip device with integrated charge sensors and recording microelectrodes
Hande Aydogmus; Michel Hu; Lovro Ivancevic; Jean-Philippe Frimat; Arn M. J. M. van den Maagdenberg; Pasqualina M. Sarro; Massimo Mastrangeli;
Scientific Reports,
Volume 13, Issue 8062, 2023. DOI: https://doi.org/10.1038/s41598-023-34786-5 - Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
Hao Hong; Jiangtao Wei; Xin Lei; Haiyun Chen; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu;
Microsystems & Nanoengineering,
Volume 9, pp. 63, 2023. DOI: 10.1038/s41378-023-00532-0 - Optical self-cooling of a membrane oscillator in a cavity optomechanical experiment at room temperature
P. Vezio; M. Bonaldi; A. Borrielli; F. Marino; B. Morana; P.M. Sarro; E. Serra; F. Marin;
Physical Review A,
Volume 108, pp. 063508, 2023. DOI: 10.1103/PhysRevA.108.063508 - Nanostructured Thermoelectric Films Synthesised by Spark Ablation and Their Oxidation Behaviour
Joost van Ginkel; Lisa Mitterhuber; Marijn Willem van de Putte; Mark Huijben; Sten Vollebregt; Guoqi Zhang;
Nanomaterials,
Volume 13, Issue 11, pp. 1778, 2023. DOI: 10.3390/nano13111778 - Low Noise Opto-Electro-Mechanical Modulator for RF-to-Optical Transduction in Quantum Communications
Michele Bonaldi; Antonio Borrielli; Giovanni Di Giuseppe; Nicola Malossi; Bruno Morana; Riccardo Natali; Paolo Piergentili; Pasqualina Maria Sarro; Enrico Serra; David Vitali;
Entropy,
Volume 25, Issue 7, 2023. DOI: 10.3390/e25071087 - Automated assessment of human engineered heart tissues using deep learning and template matching for segmentation and tracking
J. M. Rivera‐Arbeláez; D. Keekstra; C. Cofiño‐Fabres; Tom Boonen; M. Dostanic; S. A. Ten Den; K. Vermeul; M. Mastrangeli; A. van den Berg; L. I. Segerink; M. C. Ribeiro; N. Strisciuglio; R. Passier;
Bioengineering & Translational Medicine,
Volume 8, Issue 3, pp. e10513, 2023. DOI: 10.1002/btm2.10513 - Centimeter-scale nanomechanical resonators with low dissipation
Andrea Cupertino; Dongil Shin; Leo Guo; Peter G. Steeneken; Miguel A. Bessa; Richard A. Norte;
arXiv,
2023. DOI: 10.48550/arXiv.2308.00611 - Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
IEEE Transactions on Electron Devices,
Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066 - Miniaturized engineered heart tissues from hiPSC-derived triple cell type co-cultures to study human cardiac function
L Windt; M. Wiendels; M. Dostanic; M. Bellin; P. M. Sarro; M. Mastrangeli; C. L. Mummery; B. J. van Meer;
Biochemical and Biophysical Research Communications,
2023. DOI: 10.1016/j.bbrc.2023.09.034 - Quantifying stress distribution in ultra-large graphene drums through mode shape imaging
Ali Sarafraz; Hanqing Liu; Katarina Cvetanović; Marko Spasenović; Sten Vollebregt; Tomas Manzaneque Garcia; Peter G. Steeneken; Farbod Alijani;
arXiv,
2023. DOI: 10.48550/arXiv.2311.00443 - Integrated Electrochemical and Optical Biosensing in Organs-on-Chip
Pratik Tawade; Massimo Mastrangeli;
ChemBioChem,
2023. DOI: 10.1002/cbic.202300560 - Design and Characterization of a Data Converter in
a SiC CMOS Technology for Harsh Environment
Sensing Applications
Yunfan Niu; Jiarui Mo; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
In Proc. of IEEE Sensors,
2023. - Highly reproducible tissue positioning with tapered pillar design in engineered heart tissue platforms
M. Dostanic; L. M. Windt; M. Wiendels; B. J. van Meer; C. L. Mummery; P. M. Sarro; M. Mastrangeli;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052166 - High-performance wafer-scale transfer-free graphene microphones
Roberto Pezone; Gabriele Baglioni; Pasqualina M. Sarro; Peter G. Steeneken; Sten Vollebregt;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052360 - Silicon carbide reinforced vertically aligned carbon nanotube composite for harsh environment MEMS
Jiarui Mo; Shreyas Shankar; Guoqi Zhang; Sten Vollebregt;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052162 - Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100771 - Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100810 - Effect of Thermomigration on Electromigration in SWEAT Structures
Zhen Cui; Xuejun Fan; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100774 - Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100813 - Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100750 - Electromigration-induced local dewetting in Cu films
Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
In Proc. of the IEEE International Interconnect Technology Conference,
2023. DOI: 10.1109/IITC/MAM57687.2023.10154761 - Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Xuejun Fan; Zhen Cui; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
Varun Thukral; Irene Bacquet; Michiel Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Henry Antony Martin; Marcia Reintjes; Xiao Tang; Dave Reijs; Sander Dorrestein; Martien Kengen; Sebastien Libon; Edsger Smits; Marco Koelink; Rene Poelma; Willem Van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - High-performance Silicon Carbide-on-insulator Thermoresistive High-temperature Sensor Up To 750 C
Baoyun Sun; Jiarui Mo; Willem D. van Driel; GuoQi Zhang;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023. - MOSFET-based And P-N Diode Based Temperature Sensors In A 4H-sSiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023. - A Highly Sensitive Capacitive Displacement Sensor For Force Measurement Integrated In An Engineered Heart Tissue Platform
Milica Dostanic; Filippo Pfaiffer; Mahdieh Shojaei-Baghini; Laura M. Windt; Maury Wiendels; Berend J. van Meer; Christine L. Mummery; Pasqualina M. Sarro; Massimo Mastrangeli;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023. - Wafer-scale Transfer-free Graphene MEMS Condenser Microphones
Roberto Pezone; Gabriele Baglioni; Leonardo di Paola; Pasqualina M. Sarro; Peter G. Steeneken; Sten Vollebregt;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023. - Design And Fabrication Of A Smart Vaporasing Liquid
Microthruster For Cubesat Applications
Georgios Spernovasilis; Henk W. van Zeijl; Pasqualina M. Sarro;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023. - Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. van Zeijl; Willem D. van Driel; GuoQi Zhang;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052401 - Bayesian optimization with Gaussian process regression: a multi-fidelity review
Leo Guo;
In 15th World Congress of Structural and Multidisciplinary Optimisation,
2023. - Graphene gas sensors monolithically integrated on microhotplates by using a transfer-free approach
Leandro Sacco; Sten Vollebregt;
In Graphene Week,
2023.
document - High aspect-ratio multi-layer graphene MEMS condenser microphones
Roberto Pezone; Gabriele Baglioni; Pasqualina M. Sarro; Peter G. Steeneken; Sten Vollebregt;
In Graphene Week,
2023.
document - Time Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS technology
Yaqian Zhang; Jiarui Mo; Sten Vollebregt; GuoQi Zhang;
In 24th International Conference on Electronic Packaging Technology (ICEPT),
2023. - Dielectric spectroscopy for non-invasive sensing of multi-layered organ-on-chip devices
T. Hosman; M. Spirito; M. Mastrangeli;
In XXXV Eurosensors Conference,
2023. - An acoustically-transparent electrical cap for piezoelectric ultrasound transducers on silicon
G. Wardhana; T. Costa; M. Mastrangeli;
In XXXV Eurosensors Conference,
2023. - Pressure-assisted Cu sintering for SiC Die-attachment application
Xu Liu;
PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8 - Understanding the Fundament of Virus Inactivation via Modeling
Chunjian Tan;
PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:14351363-b5d1-41ec-ac32-8efb4817481b - Miniature sensorized platform for engineered heart tissues
Milica Dostanic;
PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:0f61f871-7c9c-47fc-a542-10883fb2d4de - Ionic electroactive polymer for organs-on-chip applications
Paul Motreuil-Ragot;
PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:5f72b863-c05f-4bfb-82e6-b75dc63923cd - Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfaces
Nasim Bakhshaee Babaroud; Merlin Palmar; Andrada Iulia Velea; Chiara Coletti; Sebastian Weingärtner; Frans Vos; Wouter A. Serdijn; Sten Vollebregt; Vasiliki Giagka;
Nature Microsystems & Nanoengineering,
Volume 8, pp. 107, 2022. (featured article). DOI: 10.1038/s41378-022-00430-x - Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro;
IEEE Transactions on Electron Devices,
Volume 69, Issue 1, pp. 4-10, 2022. DOI: 10.1109/TED.2021.3125279 - Technology Development for MEMS: A Tutorial
Paddy J French; Gijs JM Krijnen; Sten Vollebregt; Massimo Mastrangeli;
IEEE Sensors Journal,
Volume 22, Issue 11, 2022. DOI: 10.1109/JSEN.2021.3104715 - Mass and density determination of porous nanoparticle films using a quartz crystal microbalance
Hendrik Joost van Ginkel; Sten Vollebregt; GuoQi Zhang; Andreas Schmidt-Ott;
IOP Nanotechnology,
Volume 33, Issue 48, 2022. DOI: 10.1088/1361-6528/ac7811 - Characterization of low-loss hydrogenated amorphous silicon films for superconducting resonators
Bruno T. Buijtendorp; Juan Bueno; David J. Thoen; Vignesh Murugesan; Paolo M. Sberna; Jochem J. A. Baselmans; Sten Vollebregt; Akira Endo;
J. of Astronomical Telescopes, Instruments, and Systems,
Volume 8, Issue 2, pp. 028006, 2022. DOI: 10.1117/1.JATIS.8.2.028006 - Rapid Prototyping of Organ-on-a-Chip Devices Using Maskless Photolithography
Dhanesh G. Kasi; Mees N. S. de Graaf; Paul A. Motreuil-Ragot; Jean-Phillipe M. S. Frimat; Michel D. Ferrari; Pasqualina M. Sarro; Massimo Mastrangeli; Arn M. J. M. van den Maagdenberg; Christine L. Mummery; Valeria V. Orlova;
Micromachines,
Volume 13, pp. 49, 2022. DOI: 10.3390/mi13010049 - Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
Journal of Physics: Condensed Matter,
Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f - Enhancement of Room Temperature Ethanol Sensing by Optimizing the Density of Vertically Aligned Carbon Nanofibers Decorated with Gold Nanoparticles
Mostafa Shooshtari; Leandro Nicolas Sacco; Joost Van Ginkel; Sten Vollebregt; Alireza Salehi;
MDPI Materials,
Volume 15, Issue 4, pp. 1383, 2022. DOI: 10.3390/ma15041383 - Sensitive Transfer-Free Wafer-Scale Graphene Microphones
Roberto Pezone; Gabriele Baglioni; Pasqualina M. Sarro; Peter G. Steeneken; Sten Vollebregt;
ACS Applied Materials & Interfaces,
Volume 14, Issue 18, pp. 21705-21712, 2022. DOI: 10.1021/acsami.2c03305 - Direct Wafer-Scale CVD Graphene Growth under Platinum Thin-Films
Yelena Hagendoorn; Gregory Pandraud; Sten Vollebregt; Bruno Morana; Pasqualina M. Sarro; Peter G. Steeneken;
MDPI Materials,
Volume 15, Issue 10, pp. 3723, 2022.
document - Angle Sensitive Optical Sensor for Light Source Tracker Miniaturization
Joost Romijn; Secil Sanseven; Guoqi Zhang; Sten Vollebregt; Pasqualina M. Sarro;
IEEE Sensors Letters,
Volume 6, Issue 6, pp. 1-4, 2022. DOI: 10.1109/LSENS.2022.3175607 - Hydrogenated amorphous silicon carbide: A low-loss deposited dielectric for microwave to submillimeter-wave superconducting circuits
B. T. Buijtendorp; S. Vollebregt; K. Karatsu; D. J. Thoen; V. Murugesan; K. Kouwenhoven; S. Hähnle; J. J. A. Baselmans; A. Endo;
Physical Review Applied,
Volume 18, pp. 064003, 2022. DOI: 10.1103/PhysRevApplied.18.064003 - Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
V. Thukral; M. van Soestbergen; J.J.M. Zaal; R. Roucou; R.T.H. Rongen; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 139, pp. 114830, 2022. DOI: 10.1016/j.microrel.2022.114830 - Biodegradable sensors are ready to transform autonomous ecological monitoring
Sarab S. Sethi; Mirko Kovac; Fabian Wiesemüller; Aslan Miriyev; Clementine M. Boutry;
Nature Ecology & Evolution,
Volume 6, pp. 1245-1247, 2022. DOI: 10.1038/s41559-022-01824-w - Ultra-thin corrugated metamaterial film as large-area transmission dynode
H.W. Chan; V. Prodanović; A.M.M.G. Theulings; T. ten Bruggencate; C.W. Hagen; P.M. Sarro; H. v.d. Graaf;
Journal of Instrumentation,
Volume 17, pp. P09027, 2022. DOI: 10.1088/1748-0221/17/09/P09027 - 25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters
Jian Li; Chenhui Li; Vincent Henneken; Marcus Louwerse; Jeannet Van Rens; Paul Dijkstra; Oded Raz; Ronald Dekker;
Journal of Lightwave Technology,
Volume 40, Issue 8, pp. 2456-2464, 2022. DOI: 10.1109/JLT.2021.3137981 - A Microfluidic Cancer-on-Chip Platform Predicts Drug Response Using Organotypic Tumor Slice Culture
Sanjiban Chakrabarty; William F. Quiros-Solano; Maayke M.P. Kuijten; Ben Haspels; Sandeep Mallya; Calvin Shun Yu Lo; Amr Othman; Cinzia Silvestri; Anja van de Stolpe; Nikolas Gaio; Hanny Odijk; Marieke van de Ven; Corrina M.A. de Ridder; Wytske M. van Weerden; Jos Jonkers and Ronald Dekker; Nitika Taneja; Roland Kanaar; Dik C. van Gent;
Cancer Research,
Volume 82, Issue 3, pp. 510-520, 2022. DOI: 10.1158/0008-5472.CAN-21-0799 - Reliability of LED-based systems
Willem D. van Driel; B. Jacobs; P. Watte; X. Zhao;
Microelectronics Reliability,
Volume 129, pp. 114477, 2022. DOI: 10.1016/j.microrel.2022.114477 - Focused ultrasound neuromodulation on a multiwell MEA
Marta Saccher; Shinnosuke Kawasaki; Martina Proietti Onori; Geeske M. van Woerden; Vasiliki Giagka; Ronald Dekker;
Bioelectronic Medicine,
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Abstract: ...
Class-D amplifiers (CDAs) are often used in audio applications due to their superior power efficiency. Due to the sensitivity of the human ear, a large dynamic range (DR) is desired, and audio DACs with up to 130dB DR are commercially available [1]. However, the DR of the CDAs they drive is typically much lower [2]-[4], mainly due to the thermal noise introduced by the input resistors of their resistive feedback networks. Reducing this resistance is difficult, as it reduces the CDA's input impedance and increases the required loop-filter capacitance. Alternatively, the CDA could be configured as a capacitively coupled chopper amplifier (CCCA), whose capacitive feedback network could then achieve low noise without reducing input impedance. However, the large PWM component present at its output would then saturate its input stage. By exploiting the inherent PWM filtering present in a feedback-after-LC architecture, this paper presents a capacitively coupled chopper CDA, resulting in significantly improved DR and THD+N. The prototype achieves 8V_RMS of integrated output noise (A-weighted), a 121.4dB DR, and -1 09.8dB THD+N while delivering a maximum of 15/26W into an 8/4Omega load with 93%/88% efficiency. - Time-efficient low power time/phase-reversal beamforming for the tracking of ultrasound implantable devices
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In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021. DOI: 10.23919/EMPC53418.2021.9584984 - A -109.1 dB/-98 dB THD/THD+N Chopper Class-D Amplifier with >83.7 dB PSRR Over the Entire Audio Band
Huajun Zhang; Nuriel Rozsa; Marco Berkhout; Qinwen Fan;
In ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC),
United States, IEEE, pp. 395--398, 2021. Accepted author manuscript; ESSCIRC 2021 : IEEE 47th European Solid State Circuits Conference ; Conference date: 06-09-2021 Through 09-09-2021. DOI: 10.1109/ESSCIRC53450.2021.9567786
Keywords: ...
Class-D amplifier, PSRR, PWM, chopping, intermodulation.
Abstract: ...
This paper reports a chopper Class-D audio amplifier that obtains high PSRR over the entire audio band. A chopping scheme is proposed to minimize intermodulation distortion between pulse-width modulation (PWM) and chopping in the audio band. A high-voltage chopper is developed to handle a 14.4 V PWM signal. Timing matching techniques are proposed to minimize chopping nonidealities which ensure good PSRR and THD. Fabricated in a 180nm BCD process, the prototype obtains a PSRR >109 dB at 217 Hz and >83.7 dB over the entire audio band. It also achieves -109.1 dB/-98 dB THD/THD+N and can deliver a maximum of 13 W to an 8-Ω load. - A 94.1 dB DR 4.1 nW/Hz Bandwidth/Power Scalable DTDSM for IoT Sensing Applications Based on Swing-Enhanced Floating Inverter Amplifiers
Yibo Zhao; Huajun Zhang; Yaopeng Hu; Yuanxin Bao; Le Ye; Wanyuan Qu; Menglian Zhao; Zhichao Tan;
In 2021 IEEE Custom Integrated Circuits Conference, CICC 2021 - Proceedings,
United States, Institute of Electrical and Electronics Engineers (IEEE), 2021. 2021 IEEE Custom Integrated Circuits Conference, CICC 2021 ; Conference date: 25-04-2021 Through 30-04-2021. DOI: 10.1109/CICC51472.2021.9431415
Abstract: ...
IoT sensing applications operating from batteries or harvested energy require microwatt data converters. To accurately measure small signals, they often need to achieve a high DR (>90dB) and better linearity than the transducers themselves (>14b) with a BW in the kHz range. IoT systems also often consist of multiple sensing modalities with different BW requirements and are often heavily duty-cycled to reduce power consumption. This paper presents a fully dynamic discrete-time delta-sigma modulator (DTDSM) that supports 4x bandwidth/power scaling without any programming overhead except for changing fs, using a capacitively biased swing-enhanced floating inverter amplifier (SEFIA). The prototype, fabricated in 180nm CMOS, consumes only 4μW at 800Hz BW and achieves >87dB SNDR over 2 octaves of fs, between 100 kHz and 400 kHz, and a DR of 94.1 dB while operating with an OSR of 125. - A-121.5 dB THD Class-D Audio Amplifier with 49 dB Suppression of LC Filter Nonlinearity and Robust to +/-30% LC Filter Spread
Huajun Zhang; Marco Berkhout; Kofi Makinwa; Qinwen Fan;
In 2021 Symposium on VLSI Circuits,
United States, IEEE, 2021. Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher i. DOI: 10.23919/VLSICircuits52068.2021.9492441
Abstract: ...
This paper reports a Class-D audio amplifier that uses multiloop feedback to suppress output LC filter nonlinearity by 49 dB, enabling the use of small, low-cost LC filters with ±30% spread while maintaining low distortion. Fabricated in a 180 nm BCD process, the prototype achieves a THD of-121.5 dB and a THD+N of-107.1 dB. It delivers 12W/21W into an 8-Ω/4-Ω load with 91%/87% efficiency. - Low-loss dielectric for high frequency cryogenic applications
J.J.A. Baselmans; B.T. Buijtendorp; A. Endo; S. Vollebregt;
Patent, NL2024742B1; WO2021150101, 2021. - Design and processing of silicon and silicon carbide sensors
Brahim Mansouri;
PhD thesis, Delft University Technology, 2021.
document - Superconducting Funnelled Through-Silicon Vias for Quantum Applications
Juan Alfaro Barrantes;
PhD thesis, Delft University Technology, 2021.
document - Prognostics and health management of safety relevant electronics for autonomous driving
Alexandru Prisacaru;
PhD thesis, Delft University Technology, 2021.
document - Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment
Zhen Cui;
PhD thesis, Delft University Technology, 2021.
document - Low-friction, wear-resistant, and electrically homogeneous multilayer graphene grown by chemical vapor deposition on molybdenum
Borislav Vasic; Uros Ralevic; Katarina Cvetanovic Zobenica; Milce Smiljanic; Rados Gajic; Marko Spasenovic; Sten Vollebregt;
Applied Surface Science,
Volume 509, pp. 144792, 2020. DOI: 10.1016/j.apsusc.2019.144792 - A High-Linearity and Low-EMI Multilevel Class-D Amplifier
H. Zhang; S. Karmakar; L. J. Breems; Q. Sandifort; M. Berkhout; K. A. A. Makinwa; Qinwen Fan;
IEEE Journal of Solid-State Circuits,
Volume 56, pp. 1176-1185, December 2020. DOI: 10.1109/JSSC.2020.3043815
Abstract: ...
This article presents a Class-D audio amplifier for automotive applications. Low electromagnetic interference (EMI) and, hence, smaller LC filter size are obtained by employing a fully differential multilevel output stage switching at 4.2 MHz. A modulation scheme with minimal switching activity at zero input reduces idle power, which is further assisted by a gate-charge reuse scheme. It also achieves high linearity due to the high loop gain realized by a third-order feedback loop with a bandwidth of 800 kHz. The prototype, fabricated in a 180-nm high-voltage BCD process, achieves a minimum THD+N of −107.8 dB/−102 dB and a peak efficiency of 91%/87% with 8- and 4- Ω loads, respectively, while drawing 7-mA quiescent current from a 14.4-V supply. The prototype meets the CISPR 25 Class 5 EMI standard with a 5.7-dB margin using an LC filter with a cutoff frequency of 580 kHz. - A 28-W, -102.2-dB THD+N Class-D Amplifier Using a Hybrid Δ Σ M-PWM Scheme
S. Karmakar; H. Zhang; R. van Veldhoven; L. J. Breems; M. Berkhout; Qinwen Fan; K. A. A. Makinwa;
IEEE Journal of Solid-State Circuits,
September 2020. DOI: 10.1109/JSSC.2020.3023874
Abstract: ...
This article presents a 28-W class-D amplifier for automotive applications. The combination of a high switching frequency and a hybrid multibit Δ ΣM-PWM scheme results in high linearity over a wide range of output power, as well as low AM-band EMI. As a result, only a small (150-kHz cutoff frequency), and thus low-cost, LC filter is needed to meet the CISPR-25 EMI average limit (150 kHz-30 MHz) with 10-dB margin. At 28-W output power, the proposed amplifier achieves 91% efficiency while driving a 4-Ω load from a 14.4-V supply. It attains a peak THD+N of 0.00077% (-102.2 dB) for a 1-kHz input signal. - Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 367-380, 2020. - Review of Packaging Schemes for Power Module
Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 223-238, 2020. - The influence of phosphor particles on the water transport in optical silicones for LEDs
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Optical Materials: X,
Volume 6, pp. 100047, 2020. DOI: 10.1016/j.omx.2020.100047 - Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
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IEEE Transactions on Power Electronics,
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Physical Review Letters,
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Abstract: ...
This paper describes a class-D audio amplifier with a multilevel output stage that reduces both EMI and idle power. High loop gain, and thus high linearity, are enabled by a relatively high (4.2 MHz) switching frequency, which relaxes the requirements on its output LC filter. Fabricated in a 180nm BCD technology, it can drive 14 W into an 8-Ω load with state-of-the-art performance: -107.8 dB THD+N, 91% peak efficiency, and 7 mA quiescent current. It meets the CISPR 25 Class 5 radiated emission standard with a low-cost 580 kHz LC filter, improving the state-of-the-art by 5.8x. - A 28W -108.9dB/-102.2dB THD/THD+N Hybrid ΔΣ-PWM Class-D Audio Amplifier with 91% Peak Efficiency and Reduced EMI Emission
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United States, IEEE, pp. 350--352, 2020. Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher i. DOI: 10.1109/ISSCC19947.2020.9063001
Abstract: ...
Class-D amplifiers are often used in high-power audio applications due to their high power efficiency. They typically employ pulse-width modulation (PWM) at a fixed carrier frequency, which may cause electromagnetic interference (EMI). Setting this frequency fPWM) below the AM band (535 to 1605kHz) helps mitigate this, but its harmonics still contain substantial energy and must be filtered out by bulky LC filters with low cut-off frequencies (fc = 20 to 40 kHz), significantly increasing system cost and size. Stability considerations also constrain the amplifier's unity-gain frequency to be < mathrm{f} {mathrm{PWM}}/pi [1], compromising the audio-band loop gain required to suppress output-stage nonlinearity. Setting fPWM above the AM band helps increase fc and allows a higher loop gain [2]. However, this results in narrower pulses at higher power levels (higher modulation index), which cannot be faithfully produced by the output stage, thus exacerbating its non-linearity. Delta-sigma modulation (DeltaSigma M) has fixed pulse widths and does not suffer from these narrow-pulse artefacts. However, the out-of-band noise of 1bit modulators then requires larger LC filters. Moreover, high-order loop filters must be used to achieve sufficient SQNR, which then require additional techniques to maintain stability as the modulation range approaches 100% [3]. - Microelectromechanical organs-on-chip
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Micromachines,
Volume 10, Issue 8, pp. 536, 2019. DOI: 10.3390/mi10080536 - Stress analysis of pressure-assisted sintering for the double-side assembly of power module
Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
Soldering and Surface Mount Technology,
2019. DOI: 10.1108/SSMT-01-2018-0005 - Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
Results in Physics,
Volume 12, pp. 712-717, 2019. DOI: 10.1016/j.rinp.2018.12.026 - High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
Hongyu Tang; Yutao Li; Huaiyu Ye; Fafei Hu; Chenshan Gao; Luqi Tao; Tao Tu; Guangyang Gou; Xianping Chen; Xuejun Fan; Tianling Ren; GuoQi Zhang;
Nanotechnology,
Volume 31, Issue 5, pp. 055501, Nov 2019. DOI: 10.1088/1361-6528/ab414e
document - Mass measurement of graphene using quartz crystal microbalances
Robin J Dolleman; Mick Hsu; Sten Vollebregt; John E Sader; Herre SJ van der Zant; Peter G Steeneken; Murali K Ghatkesar;
Applied Physics Letters,
Volume 115, Issue 5, pp. 053102, 2019. DOI: 10.1063/1.5111086
document - General coupling model for electromigration and one-dimensional numerical solutions
Zhen Cui; Xuejun Fan; GuoQi Zhang;
Journal of Applied Physics,
Volume 125, pp. 105101-1-9, 2019. DOI: 10.1063/1.5065376 - A 6 \textdollar\textbackslashmu\textdollar W 95 dB SNDR Inverter Based \textdollar\textbackslashSigma\textbackslashDelta\textdollar Modulator With Subtractive Dithering and SAR Quantizer
Huajun Zhang; Zhichao Tan; Yi Zhang; Baozhen Chen; Roberto Maurino; Robert Adams; Khiem Nguyen;
{IEEE} Transactions on Circuits and Systems {II}: Express Briefs,
Volume 66, Issue 4, pp. 552--556, April 2019. DOI: 10.1109/tcsii.2018.2869103
document - A 1-V 560-nW SAR ADC With 90-dB SNDR for IoT Sensing Applications
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P. Lambert; M. Mastrangeli (Ed.);
MDPI, , 2019. DOI: 10.3390/mi10080526 - MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
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2019. DOI: 10.1109/TRANSDUCERS.2019.8808192 - Design Considerations for a Mems Coriolis Mass Flow Sensing System
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10 2019. DOI: 10.1109/SENSORS43011.2019.8956695 - Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
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2019. DOI: 10.1109/NER.2019.8717064 - Degradation Prediction of Electronic Packages using Machine Learning
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In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
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In 4th Int. Conf. on Manipulation, Automation and Robotics at Small Scales (MARSS 2019),
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M. Dostanic; L. Windt; J. Stein; B. van Meer; M. Mastrangeli; C. Mummery; P. M. Sarro;
In International MicroNanoConference,
Utrecht (NL), December 10-11, 2019. - Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
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2019. - Enabling actuation and sensing in organs-on-chip using electroactive polymers
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Utrecht (NL), December 10-11, 2019. - Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
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2019. - Flexible, graphene-based acive implant for spinal cord stimulation in rodents
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2019. DOI: 10.1109/EDTM.2019.8731110 - A wafer-scale process for the monolithic integration of CVD graphene and CMOS logic for smart MEMS/NEMS sensors
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In IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE,
2019. DOI: 10.1109/MEMSYS.2019.8870741 - A SPICE-based transient thermal-electronic model for LEDs
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In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
2019. DOI: 10.1109/EuroSimE.2019.8724555 - Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions
Mehr, M. Y.; Van Driel, W.; GuoQi Zhang;
In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
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2019. DOI: 10.1109/EuroSimE.2019.8724571 - Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
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Utrecht (NL), December 10-11, 2019. - Organs- (and other pretty cool stuff) on-chip
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Seminar, presented at the Department of Nano Opto-Mechatronic Instruments (NOMI) of TNO, June 6 2019. - Micro- and nanosystems assembly via fluid joints
M. Mastrangeli;
Seminar, presented at Stanford University, Palo Alto (CA), August 12, 2019. - Microengineering organs-on-chip
M. Mastrangeli;
Invited talk, presented at QBio Symposium, Utrecht (NL), October 29, 2019. - Microengineered organs-on-chip
H. Aydogmus; M. Dostanic; P. Motreuil-Ragot; M. Mastrangeli; P. M. Sarro;
Poster, presented at QBio Symposium, Utrecht (NL), October 29, 2019. - Self-assembly by fluidics and by shaking
M. Mastrangeli;
Seminar, presented at Palo Alto Research Center (PARC), Palo Alto (CA), July 31, 2019. - Microengineering organs-on-chip
M. Mastrangeli;
Seminar, presented at Universita' di Roma - Tor Vergata, Roma (IT), December 20, 2019. - Single nanoparticle printing
M. Mastrangeli;
Seminar, presented at Palo Alto Research Center (PARC), Palo Alto (CA), August 28, 2019. - Graphene pellicle lithographic apparatus
Evgenia Kurganova; Jos Giesbers; Maria Peter; Maxim Naselevich; Arnoud Notenboom; Alexander Klein; Pieter-Jan van Zwol; David Vles; Pim Voorthuijzen; Sten Vollebregt;
Patent, WO2019170356, 2019. - Full wafer transfer-free graphene
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Patent, WO2019125140; NL2020111, 2019. - Multi-functional LED Module Integration and Miniaturization for Solid State Lighting Applications
Pan Liu;
PhD thesis, Delft University of Technology, 2019.
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Hao Zhang;
PhD thesis, Delft University of Technology, 2019.
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William Fausto Quiros Solano;
PhD thesis, Delft University of Technology, 2019.
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Aleksandar Jovic;
PhD thesis, Delft University of Technology, 2019.
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Nikolas Gaio;
PhD thesis, Delft University of Technology, 2019.
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Violeta Prodanovic;
PhD thesis, Delft University Technology, 2019. - AlGaN/GaN high electron mobility transistor (HEMT) based sensors for gas sensing applications
Robert Sokolovskij;
PhD thesis, Delft University Technology, 2019.
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M. Yazdan Mehr; M.R. Toroghinejad; F. Karimzadeh; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 81, pp. 136-142, 2018. - A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects
Angel Savov; Shivani Savov; Salman Shafqat; Johan Hoefnagels; Marcus Louwerse; Ronald Stoute; Ronald Dekker;
Micromachines,
Volume 9, Issue 1, pp. 39, 2018.
document - Thermal Management on IGBT Power Electronic Devices and Modules
Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
IEEE Access,
Volume 6, pp. 12868-12884, 2018. - A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 84, pp. 140-148, 2018. - Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
ETV Maxwell,
Volume 21.2, 2018. - Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
Amir Mirza Gheytaghi; Hamid Saffari; GuoQi Zhang;
Heat Transfer Engineering,
2018. - Effect of thermal annealing and chemical treatments on secondary electron emission properties of atomic layer deposited MgO
Violeta Prodanovic; Hong Wah Chan; Anil U. Mane; Jeffrey W. Elam; Matthias M. Minjauw; Christophe Detavernier; Harry van der Graaf; Pasqualina M. Sarro;
Journal of Vacuum Science and Technology A,
Volume 36, Issue 6, pp. 06A102-1-9, 2018.
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D. Ipparthi; T. A. G. Hageman; N. Cambier; M. Sitti; M. Dorigo; L. Abelmann; M. Mastrangeli;
Physical Review E,
Volume 98, pp. 042137, 2018. DOI: 10.1103/PhysRevE.98.042137 - A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; GuoQi Zhang; Xuejun Fan;
Applied Mechanics Reviews,
Volume 70, Issue 2, pp. 020803-1-16, 2018. - Microfabricated tuneable and transferable porous PDMS membranes for Organs-on-Chips
W. F. Quirós-Solano; N. Gaio; O. M. J. A. Stassen; Y. B. Arik; C. Silvestri; N. C. A. Van Engeland; A. Van der Meer; R. Passier; C. M. Sahlgren; C. V. C. Bouten; A. van den Berg; R. Dekker; P. M. Sarro;
Scientific Reports,
pp. 13524, 2018. DOI: 10.1038/s41598-018-31912-6 - Silicon Nitride MOMS Oscillator for Room Temperature Quantum Optomechanics
Enrico Serra, Bruno Morana, Antonio Borrielli, Francesco Marin, Gregory Pandraud, Antonio Pontin, Giovanni Andrea Prodi, Pasqualina M. Sarro,; Michele Bonaldi;
ArXiv preprint,
2018. - System in package (SiP) technology: fundamentals, design and applications
F. Santagata, J. Sun, E. Iervolino, H. Yu, F. Wang, G. Zhang, P. M. Sarro, G. Zhang;
Microelectronics International,
2018. DOI: 10.1108/MI-09-2017-0045 - Grafeen: een zoektocht naar de toepassing
Sten Vollebregt; Jos Giesbers; Johan Klootwijk;
Nederlands Tijdschrift voor Natuurkunde,
pp. 16-20, September 2018. - Advances in the electronics for cyclic voltammetry: the case of gas detection by using microfabricated electrodes
Giorgio Pennazza; Marco Santonico; Luca Vollero; Alessandro Zompanti; Anna Sabatini; Nandeesh Kumar; Ivan Pini; William F Quiros Solano; Lina Sarro; Arnaldo D'Amico;
Frontiers in Chemistry,
Volume 6, pp. 327, 2018.
document - Carbon Nanotube Array: Scaffolding Material for Opto, Electro, Thermo, and Mechanical Systems
Amir M. Gheytaghi; H. van Zeijl; S. Vollebregt; R.H. Poelma; C. Silvestri; R. Ishihara; G. Q. Zhang; P. M. Sarro;
Innovative Materials,
Volume 3, pp. 22-25, 2018. - Quantum nondemolition measurement of optical field fluctuations by optomechanical interaction
A Pontin; M Bonaldi; A Borrielli; L Marconi; F Marino; G Pandraud; GA Prodi; PM Sarro; E Serra; F Marin;
Physical Review A,
Volume 97, Issue 3, pp. 033833, 2018. - A MEMS Actuator System for an Integrated 3-D Optical Coherent Tomography Scanner
Aleksandar Jovic; Grégory Pandraud; Nuria Sanchez Losilla; Juan Sancho; Kirill Zinoviev; Jose Luis Rubio; Eduaro Margallo-Ballbas; Pasqualina M. Sarro;
Journal of Microelectromechanical Systems,
Volume 27, Issue 2, pp. 259-268, 2018.
document - A new hermetic sealing method for ceramic package using nanosilver sintering technology
Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
Microelectronics Reliability,
Volume 81, pp. 143-149, 2018. - Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
IEEE Transactions on Device and Materials Reliability,
Volume 18, Issue 2, pp. 240-246, 2018. - Failure of AISI 304H stainless steel elbows in a heat exchanger
A. Bahrami; S. H. Mousavi Anijdan; P. Taheri; M. Yazdan Mehr;
Engineering Failure Analysis,
Volume 90, pp. 397-403, 2018. - Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Volume 8, Issue 7, pp. 1254-1262, 2018. - Germanene on single layer ZnSe substrate: Novel electronic and optical properties
H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; GuoQi Zhang;
Physical Chemistry Chemical Physics,
Volume 20, Issue 23, pp. 16067-16076, 2018. - A stochastic process based reliability prediction method for LED driver
Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; GuoQi Zhang;
Reliability Engineering and System Safety,
Volume 178, pp. 140-146, 2018. - High Selective Gas Detection for small molecules based on Germanium selenide monolayer
Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
Applied Surface Science,
pp. 575-581, 2018. DOI: 10.1016/j.apsusc.2017.10.084 - Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
Sensors and Actuators B: Chemical,
2018. DOI: 10.1016/j.snb.2018.08.015 - Investigation of 'Fur-like' Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
Shivani Joshi; Angel Savov; Salman Shafqat; Ronald Dekker;
Materials Science in Semiconductor Processing,
Volume 75, pp. 130-135, 2018.
document - Imaging Correlations in Heterodyne Spectra for Quantum Displacement Sensing
Pontin, A.; Lang, J. E.; Chowdhury, A.; Vezio, P.; Marino, F.; Morana, B.; Serra, E.; Marin, F.; Monteiro, T. S.;
Physical Review Letters,
2018. DOI: 10.1103/PhysRevLett.120.020503 - Ultra-thin Alumina and Silicon Nitride MEMS Fabricated Membranes for the Electron Multiplication
Violeta Prodanović; Hong Wah Chan; W A van der Graaf; Lina Sarro;
Nanotechnology,
Volume 29, pp. 155703, 2018.
document - In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
Prisacaru, A.; Palczynska, A.; Theissler, A.; Gromala, P.; Han, B.; GuoQi Zhang;
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Volume 750-763, 2018. DOI: 10.1109/TCPMT.2018.2816259 - Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; GuoQi Zhang;
Crystals,
2018. DOI: 10.3390/cryst8110428 - Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]
van Driel, W. D.; Wymyslowski, A.;
Microelectronics Reliability,
2018. DOI: 10.1016/j.microrel.2018.06.012 - The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
Yang, N.; Yang, D.; GuoQi Zhang; Chen, L.; Liu, D.; Cai, M.; Fan, X.;
Sensors,
2018. DOI: 10.3390/s18020422 - Study on the Degradation of Optical Silicone Exposed to Harsh Environments
Yazdan Mehr, M.; van Driel, W.; De Buyl, F.; GuoQi Zhang;
Materials,
2018. DOI: 10.3390/ma11081305 - MEMS-based multi-modal vibration energy harvesters for ultra-low power autonomous remote and distributed sensing
Iannacci, J.; Serra, E.; Sordo, G.; Bonaldi, M.; Borrielli, A.; Schmid, U.; Bittner, A.; Schneider, M.; Kuenzig, T.; Schrag, G.; Pandraud, G.; Sarro, P. M.;
Microsystem Technologies,
pp. 5027-5036, 2018. DOI: 10.1007/s00542-018-3923-1 - Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
Results in Physics,
2018. DOI: 10.1016/j.rinp.2018.10.005 - Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
pp. 13167-13175, 2018. DOI: 10.1007/s10854-018-9440-2 - Microstructure and mechanical properties of spark plasma sintered nanocrystalline Ni3Al-xB alloy
Mohammadnejad, A.; Bahrami, A.; Sajadi, M.; Karimi, P.; Fozveh, H. R.; Mehr, M. Y.;
Materials Today Communications,
2018. DOI: 10.1016/j.mtcomm.2018.09.002 - Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
Applied Surface Science,
pp. 554-561, 2018. DOI: 10.1016/j.apsusc.2018.08.014 - A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; GuoQi Zhang;
Applied Energy,
Volume 228, pp. 1454-1472, 2018. - Quality and Reliability in Solid-State Lighting: Qua Vadis?
Vos, T; den Breeijen, P.; van Driel, W. D.;
Solid State Lighting Reliability Part 2: Components to Systems,
2018. DOI: 10.1007/978-3-319-58175-0_1 - Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
Small,
Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614 - Solid State Lighting Reliability Part 2: Components to Systems
van Driel, W. (ed.); Fan, X. (ed.); Zhang, G. Q. (ed.) (Ed.);
Springer International Publishing AG, , 2018. DOI: 10.1007/978-3-319-58175-0_1_16 - Lightning Effects on LED-Based Luminaires
Agbemuko, A.; van Meurs, J.; van Driel, W. D.;
Springer International Publishing, , pp. 573-583, 2018. DOI: 10.1007/978-3-319-58175-0_21 - Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
Bo Sun; Fan, X.; van Driel, W. D. (ed.); GuoQi Zhang;
Springer, , 2018. DOI: 10.1007/978-3-319-58175-0_16 - The Next Frontier: Reliability of Complex Systems
Schenkelaars, D.; van Driel, W. D. (ed.); Duijve, R.;
Springer International Publishing AG, , 2018. DOI: 10.1007/978-3-319-58175-0_22 - LED-Based Luminaire Color Shift Acceleration and Prediction
Lu, G.; van Driel, W. D. (ed.); Fan, X.; Fan, J.; GuoQi Zhang;
Springer, , pp. 201-219, 2018. DOI: 10.1007/978-3-319-58175-0_9 - Statistical Analysis of Lumen Depreciation for LED Packages
Schuld, M.; van Driel, W. D. (ed.); Jacobs, B.;
Springer International Publishing, , 2018. DOI: 10.1007/978-3-319-58175-0_17 - Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
In Solid State Lighting Reliability Part 2,
Springer, 2018. - Corrosion Sensitivity of LED Packages
B.J.C. Jacobs; C. van der Marel; W.D. van Driel; S.J. Lu; X.P. Li;
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Springer International Publishing AG, 2018. - Capacitively-Coupled Chopper Instrumentation Amplifiers: An Overview
Qinwen Fan; Kofi A. A. Makinwa;
In Proc. IEEE Sensors,
10 2018. DOI: 10.1109/ICSENS.2018.8589958 - Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization
Marta Kluba; Bruno Morana; Angel Savov; Henk Van Zeijl; Gregory Pandraud; Ronald Dekker;
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In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017. - In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017. - Adsorption of gases on monolayer GeSe: A first principle study
L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017. - First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
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2017. - The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017. - Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
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2017. - Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
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In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017. - Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection
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2017. - Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
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PhD thesis, Delft University of Technology, 2017.
document - An accelerated test method of luminous flux depreciation for LED luminaires and lamps
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Volume 147, pp. 84-92, 2016. - Potential applications of electron emission membranes in medicine
Yevgen Bilevych; Stefan E. Brunner; Hong Wah Chan; Edoardo Charbon; Harry van der Graaf; Cornelis W. Hagen; Gert Nützelf; Serge D. Pintof; Violeta Prodanović; Daan Rotman; Fabio Santagata; Lina Sarro; Dennis R. Schaar;
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
Volume 809, pp. 171-174, 2016. - Data Communication Pathway for Sensing Guidewire at Proximal Side: A Review
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Journal of Medical Devices,
2016. - PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
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IEEE Transactions on Industrial Electronics,
pp. 99, 2016. - A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
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IEEE Electron Device Letters,
Volume 37, Issue 4, 2016. - Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
IEEE Transactions on Electron Devices,
Volume 63, pp. 2807-2814, 2016. - Output blue light evaluation for phosphor based smart white LED wafer level packages
Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
Optics Express,
Volume 24, Issue 4, pp. 174-177, 2016. - Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test
Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; G. Q. Zhang;
Reliability Engineering & System Safety,
Volume 154, pp. 152-159, 2016. - Silicon microfabrication based particulate matter sensor
Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
Sensors and Actuators A: Physical,
Volume 247, pp. 115-124, 2016. - Increasing color saturation by optimizing light spectra constrained on color rendering properties
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Journal of the Optical Society of America A,
Volume 33, Issue 2, pp. 192-2014, 2016. - SiNW-FET in-Air Biosensors for High Sensitive and Specific Detection in Breast Tumor Extract
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IEEE Sensors Journal,
Volume 16, Issue 10, pp. 3374-3381, 2016.
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Journal of Applied Physics,
Volume 120, Issue 7, pp. 074504, 2016. - The Tynode: A new vacuum electron multiplier
Harry van der Graaf; Hassan Akhtar; Neil Budko; Hong Wah Chan; Cornelis W. Hagen; Conny C.T. Hansson; Gert Nützel; Serge D. Pinto; Violeta Prodanović; Behrouz Raftari; Pasqualina M. Sarro; John Sinsheimer; John Smedle;
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Micromachines,
Volume 7, Issue 7, pp. 120, 2016. - Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
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Micro and Nano Letters,
Volume 11, Issue 8, pp. 412, 2016. - Fabrication and characterization of an Upside-down Carbon Nanotube (CNT) Microelectrode array (MEA)
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IEEE Sensors Journal,
Volume 16, Issue 24, pp. 8685, 2016. - Control of recoil losses in nanomechanical SiN membrane resonators
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Physical Review B,
Volume 94, pp. 121403, 2016. - Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification
Shivani Joshi; Antonie van Loona; Angel Savov; Ronald Dekker;
MRS Advances,
Volume 1, pp. 33-38, 2016. - Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
Nanoscale,
Volume 8, pp. 8266-8275, 2016.
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AIP Advances,
Volume 6, pp. 065004, 2016. - Dynamical two-mode squeezing of thermal fluctuations in a cavity opto-mechanical system
A. Pontin; M. Bonaldi; A. Borrielli; L. Marconi; F. Marino; G. Pandraud; G. A. Prodi; P.M. Sarro; E. Serra; F. Marin;
Physical Review Letters,
Volume 116, pp. 103601, 2016. - Stretchable Binary Fresnel Lens for Focus Tuning
Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
Scientific Reports,
Volume 6, pp. 25348, 2016. - The growth of carbon nanotubes on electrically conductive ZrN support layers for through-silicon vias
Sten Vollebregt; Sourish Banerjee; Frans D. Tichelaar; Ryoichi Ishihara;
Microelectronic Engineering,
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R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
Advanced Functional Materials,
Volume 26, Issue 8, pp. 1233-1242, 2016. - LED degradation: From component to system
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Microelectronics Reliability,
Volume 64, pp. 599--604, 9 2016. DOI: DOI: 10.1016/j.microrel.2016.07.014 - Effect of excimer laser annealing on a -InGaZnO thin-film transistors passivated by solution-processed hybrid passivation layers
Juan Paolo Bermundo; Yasuaki Ishikawa; Mami N Fujii; Toshiaki Nonaka; Ryoichi Ishihara; Hiroshi Ikenoue; Yukiharu Uraoka;
Journal of Physics D: Applied Physics,
Volume 49, Issue 3, pp. 035102-1-7, 2016. - A review of small heat pipes for electronics
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Applied Thermal Engineering,
Volume 96, pp. 1-17, 2016. - The Direct Growth of Carbon Nanotubes as Vertical Interconnects in 3D Integrated Circuits
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Volume 62, pp. 39--44, 3 2016. DOI: 10.1016/j.microrel.2016.03.018 - Creep fatigue models of solder joints: A critical review
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Volume 59, pp. 186--194, 1 2016. - Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires
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Optical Materials,
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Switzerland: Springer, , 2016. - A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
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In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
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Volume 32, Issue 7, pp. 1262-1270, 2015. - Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
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IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 576-587, 2015. - Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
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IEEE Electron Device Letters,
Volume 36, Issue 6, 2015. - Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
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IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 478-485, 2015. - Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
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IEEE Photonics Technology Letters,
Volume 27, Issue 13, pp. 1430-1433, 2015. - Degradation modeling of mid-power white-light LEDs by using Wiener process
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Volume 23, pp. A966-A978, 2015. - Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
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Volume 426, pp. 228-233, 2015. - Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
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Volume 55, Issue 2654-2662, 2015. - Highly selective and responsive ultra-violet detection using an improved phototransistor
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Applied Physics Letters,
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IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 2, pp. 220-228, 2015. - SiNW-FET in-Air Biosensors for High Sensitive and Specific Detection in Breast Tumor Extract
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Optical Materials,
Volume 49, pp. 79-84, 2015. - Solution-processed polycrystalline silicon on paper
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Volume 227, pp. 48-54, 2015. - Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
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Volume 45, pp. 37-41, 2015. - Impact of the atomic layer deposition precursors diffusion on solid-state carbon nanotube based supercapacitors performances
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IOP Nanotechnology,
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Annalen der Physik,
Volume 527, Issue 1-2, pp. 89-99, 2015. - High-ohmic resistors fabricated by PureB layer for silicon drift detectors applications
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Solid-State Electronics,
Volume 105, pp. 6-11, 2015. - 3D system-in-package design using stacked silicon submount technology
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Microelectronics International,
Volume 32, Issue 2, pp. 63-72, 2015. - Fabrication and characterization of low loss MOMS resonators for cavity opto-mechanics
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Volume 33, pp. 01A142, 2015. - Ingredients for sensors science
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Sensors and Actuators B: Chemical,
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Optics Letters,
2015. - Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
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APL Materials,
Volume 2, Issue 10, pp. 100702, 2014.
document - A novel stretchable micro-electrode array (SMEA) design for directional stretching of cells
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Volume 24, Issue 3, pp. 034003, 2014. - Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
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Optical Materials,
Volume 37, pp. 155-159, 2014. - Atomic-scale imaging of Pt and Pd nanoparticle catalysts during CO oxidation at 1 Bar reaction conditions
Vendelbo, SB; Elkjaer, CF; Puspitasari, I; Creemer, JF; Dona, P; Mele, L; Morana, B; Nelissen, BJ; Roobol, S; Rijn, R van; Helveg, S; Kooyman, PJ;
Microscopy and Microanalysis,
Volume 20, Issue S3, pp. 1570-1571, 2014. - Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
Applied Thermal Engineering,
Volume 63, Issue 2, pp. 588-597, 2014. - Multi-modal vibration based MEMS energy harvesters for ultra-low power wireless functional nodes
Iannacci, J; Serre, E; Di Criscienzo, R; Sordo, G; Gottardi, M; Borrielli, A; Bonaldi, M; Kuenzig, T; Schrag, G; Pandraud, G; Sarro, PM;
Microsystem Technologies: micro and nanosystems - information storage and processing systems,
Volume 20, Issue 4-5, pp. 627-640, 2014. - Flow-Through Cell Electroporation Microchip Integrating Dielectrophoretic Viable Cell Sorting
Zewen Wei; Xueming Li; Deyao Zhao; Hao Yan; Zhiyuan Hu; Zicai Liang; Zhihong Li;
Analytical chemistry,
Volume 86, Issue 20, pp. 10215-10222, 2014. - Thermal and mechanical effects of voids within flip chip soldering in LED packages
Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
Microelectronics Reliability,
Volume 54, Issue 9-10, pp. 2028-2033, 2014. - Self-healing thermally conductive adhesives
Lafont, UL; Moreno Belle, C.; Zeijl, HW van; Zwaag, S van der;
Journal of Intelligent Material Systems and Structures,
Volume 25, Issue 1, pp. 67-74, 2014. - Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature
Vollebregt, Sten; Banerjee, Sourish; Chiaramonti, Ann N; Tichelaar, Frans D; Beenakker, Kees; Ishihara, Ryoichi;
Journal of Applied Physics,
Volume 116, Issue 2, pp. 023514, 2014. - Carbon nanotube vertical interconnects fabricated at temperatures as low as 350 �C
Vollebregt, Sten; Tichelaar, FD; Schellevis, H; Beenakker, CIM; Ishihara, R;
Carbon,
Volume 71, pp. 249--256, 2014. - Stiction-Induced Sealing of Surface Micromachined Channels
B Morana; RH Poelma; G Fiorentino; J Wei; JF Creemer; PM Sarro;
Journal of Microelectromechanical Systems,
Volume 23, Issue 2, pp. 459-470, 2014.
document - Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics:
Ryoichi ISHIHARA; Jin ZHANG; Miki TRIFUNOVIC; Jaber DERAKHSHANDEH; Negin GOLSHANI; Daniel M.R. TAJARI MOFRAD; Tao CHEN; Kees BEENAKKER; Tatsuya SHIMODA;
IEICE Transactions on Electronics,
Volume E97.C, Issue 4, pp. 227--237, 2014. - Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits
Chiaramonti, Ann N; Vollebregt, Sten; Sanders, Aric W; Ishihara, Ryoichi; Read, David T;
Microsc. Microanal,
Volume 20, pp. 1762-1763, 2014. - Reliability and optical properties of LED lens plates under high temperature stress
Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
Microelectronics Reliability,
2014. - Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
Advanced Functional Materials,
Volume 24, Issue 36, pp. 5737-5744, 2014.
document - Accelerated life time testing and optical degradation of remote phosphor plates
Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 8, pp. 1544-1548, 2014. - A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1355-1362, 2014. - Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 1, pp. 138-142, 2014. - Multi-physics reliability simulation for solid state lighting drivers
Tarashioon, S; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1212-1222, 2014. - Visualization of oscillatory behaviour of Pt nanoparticles catalysing CO oxidation
Vendelbo, SB; Elkj{\ae}r, CF; Falsig, H; Puspitasari, I; Dona, P; Mele, L; Morana, B; Nelissen, BJ; Rijn, R van; Creemer, JF; Kooyman, PJ; Helveg, S;
Nature Materials,
Volume 13, Issue 9, pp. 884-890, 2014. - A hybrid silicon-PDMS optofluidic platform for sensing applications
Testa, G; Persichetti, G; Sarro, PM; Bernini, R;
Biomedical Optics Express,
Volume 5, Issue 2, pp. 417-426, 2014. - Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 25, Issue 11, pp. 4954-4959, 2014. - RF-noise modeling in advanced CMOS technologies
Smit, GDJ; Scholten, AJ; Pijper, RMT; Tiemeijer, LF; van der Toorn, R; Klaassen, D.B.M;
IEEE Transactions on Electron Devices,
Volume 61, Issue 2, pp. 245-254, 2014. - Amorphous silicon carbide nitride layer as an alternative to a disordered silicon surface to suppress RF/microwave losses
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Microelectronic Engineering,
Volume 125, pp. 2-7, 2014. - Design of silicon micro-resonators with low mechanical and optical losses for quantum optics experiments
Borrielli, A; Bonaldi, M; Serre, E; Bagolini, A; Bellutti, P; Cataliotti, FS; Marin, F; Marino, F; Pontin, A; Prodi, GA; Pandraud, G; Sarro, PM; Lorito,; Zoumpoulidis, T;
Microsystem Technologies,
Volume 20, Issue 4-5, pp. 907-917, 2014. - Single-Grain Si TFTs Fabricated From Sputtered Si on a Polyimide Substrate
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Journal of Display Technology,
Volume 10, Issue 11, pp. 945-949, 2014. - Robust UV/VUV/EUV PureB Photodiode Detector Technology with High CMOS Compatibility
L.K. Nanver; L. Qi; V. Mohammadi; K.R.M. Mok; W.B. de Boer; N. Golshani; A. Sammak; T.L.M. Scholtes; A. Gottwald; U. Kroth; F. Scholze;
Journal of Selected Topics in Quantum Electronics,
Volume 20, Issue 6, pp. pp.1-11, 2014. - Fracture toughness of Cu-EMC interfaces in pressurized steam
Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
International Journal of Adhesion and Adhesives,
Volume 49, pp. 73-79, 2014. - Temperature Dependency of the Kinetics of PureB CVD Deposition over Patterned Si/SiO2 Surfaces
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Microelectronic Engineering,
Volume 125, pp. 45-50, 2014. - Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
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In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
Springer, 2014. - Carbon Nanotube Vertical Interconnects: Prospects and Challenges
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CRC Press, 2014. - High Sensitive Detection in Tumor Extracts with SiNW-FET in-Air Biosensors
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pp. 26.5.1-4, 2014. - Reliability of LED-based Products is a Matter of Balancing Temperatures
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Volume 46, Issue 7, pp. 1534 - 1543, July 2011. DOI: 10.1109/JSSC.2011.2143610
Keywords: ...
CMOS integrated circuits;choppers (circuits);instrumentation amplifiers;wireless sensor networks;CMOS technology;CMRR;DC servo loop;PSRR;biopotential sensing;capacitively-coupled chopper instrumentation amplifier;chopping ripple;current 1.8 muA;electrode offset suppression;low-power precision instrumentation amplifier;noise efficiency factor;positive feedback loop;power 1.8 muW;rail-to-rail input common-mode range;ripple reduction loop;size 65 nm;voltage 1 V;wireless sensor nodes;Capacitors;Choppers;Impedance;Noise;Sensors;Topology;Wireless sensor networks;Bio-signal sensing;chopping;high power efficiency;low offset;low power;precision amplifier;wireless sensor nodes.
Abstract: ...
This paper presents a low-power precision instrumentation amplifier intended for use in wireless sensor nodes. It employs a capacitively-coupled chopper topology to achieve a rail-to-rail input common-mode range as well as high power efficiency. A positive feedback loop is employed to boost its input impedance, while a ripple reduction loop suppresses the chopping ripple. To facilitate bio-potential sensing, an optional DC servo loop may be employed to suppress electrode offset. The IA achieves 1 µV offset, 0.16% gain inaccuracy, 134 dB CMRR, 120 dB PSRR and a noise efficiency factor of 3.3. The instrumentation amplifier was implemented in a 65 nm CMOS technology. It occupies only 0.1 mm² chip area (0.2 mm² with the DC servo loop) and consumes 1.8 µA current (2.1 µA with the DC servo loop) from a 1 V supply. - Temperature calibration and electrical characterization of the differential scanning calorimeter chip UFS1 for the Mettler-Toledo Flash DSC 1
E. Iervolino; A.W. van Herwaarden; F.G. van Herwaarden; E. van de Kerkhof; P.P.W. van Grinsven; A.C.H.I. Leenaers; V.B.F. Mathot; P.M. Sarro;
Thermochimica Acta,
Volume 522, Issue 1-2, pp. 53-59, Aug. 2011. DOI 10.1016/j.tca.2011.01.023. - Modeling study on carrier mobility in ultra-thin body FinFETs with circuit-level implications
M. Poljak; V. Jovanovic; T. Suligoj;
Solid-State Electronics,
Volume 65-66, pp. 130-138, 2011. DOI 10.1016/j.sse.2011.06.039. - Boron-layer silicon photodiodes for high-efficiency low-energy electron detection
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Solid-State Electronics,
Volume 65-66, pp. 38-34, Dec. 2011. DOI 10.1016/j.sse.2011.06.042. - Integration of MOSFETs with SiGe dots as stressor material
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Solid-State Electronics,
Volume 60, Issue 1, pp. 75-83., 2011. DOI 10.1016/j.sse.2011.01.038. - Design, performance and analysis of thermal lag of the UFS1 twin-calorimeter chip for fast scanning calorimetry using the Mettler-Toledo Flash DSC 1
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Thermochimica Acta,
Volume 522, Issue 1-2, pp. 46-52, Aug. 2011. DOI 10.1016/j.tca.2011.05.025. - Atomic-scale electron-beam sculpting of near-defect-free graphene nanostructures
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Nano Letters,
Volume 11, Issue 6, pp. 2247-2250, 2011. DOI 10.1021/nl200369r. - X-ray Nanodiffraction on a Single SiGe Quantum Dot inside a Functioning Field-Effect Transistor
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Materials,
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Microelectronics Reliability,
Volume 51, Issue 3, pp. 560-565, 2011. DOI 10.1016/j.microrel.2010.10.006. - An analytical model and verification for MEMS Pirani gauges
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Volume 21, Issue 11, pp. 1-7, 2011. DOI 10.1088/0960-1317/21/11/115007. - A surface micromachined thermopile detector array with an interference-based absorber
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Journal of Micromechanics and Microengineering,
Volume 21, Issue 7, pp. 1-8, Jun. 2011. DOI 10.1088/0960-1317/21/7/074009. - Mixed motion in deterministic ratchets due to anisotropic permeability
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Journal of Colloid and Interface Science,
Volume 354, Issue 1, pp. 7-14., Feb. 2011. DOI 10.1016/j.jcis.2010.10.02. - Low-complexity full-melt laser-anneal process for fabrication of low-leakage implanted ultrashallow junctions
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Volume 40, Issue 11, pp. 2187-2196, 2011. DOI 10.1007/s11664-011-1734-6. - Excimer laser crystallization of InGaZnO4 on SiO2 substrate
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Journal of Materials Science: Materials Electronics,
Volume 22, pp. 1694-1696, 2011. DOI 10.1007/s10854-011-0347-4. - Synergistic toughening of epoxy-copper interface using a thiol-based coupling layer
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Volume 25, Issue 16, pp. 2081-2099, 2011. DOI 10.1163/016942410X544875. - MEMS for thermogravimetry: Fully integrated device for inspection of nanomasses
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IEEE/ASME Journal of Microelectromechanical Systems,
Volume 20, Issue 6, pp. 1277-1286, Dec. 2011. DOI 10.1109/JMEMS.2011.2167672. - Hot carrier effect and tunneling effect of location- and orientation-controlled (100)- and (110)-oriented single-grain Si TFTs without seed substrate
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IEEE Transactions on Electron Devices,
Volume 58, Issue 1, pp. 216-223, 2011. DOI 10.1109/TED.2010.2084089. - Analysis of electrothermal effects in bipolar differential pairs
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Volume 58, Issue 4, pp. 966-978, Apr. 2011. DOI 10.1109/TED.2011.2106132. - Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride or PE-ALD titanium nitride for void-free bottom-up copper electroplating
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R. Ishihara; N. Golshani; J. Derakhshandeh; M.R. Tajari Mofrad; C.I.M. Beenakker;
In Proc. 12th International Conference on Ultimate Integration on Silicon (ULIS),
Cork, Ireland, pp. 1-4, Mar. 2011. ISBN 978-1-4577-0090-3; DOI 10.1109/ULIS.2011.5758004. - Compact noise modeling of SiGe heterojunction bipolar transistors: Relevance of base-collector shot noise correlation and non-quasi static effects in the quasi-neutral emitter
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In Proc. 2011 IEEE Bipolar/BiCMOS Technology and Circuits Meeting (BCTM 2011),
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In Proc. 11th IEEE International Conference on Nanotechnology (NANO 2011),
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In Netherlands Catalysis and Chemistry Conference (NCCC-XII),
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In AIP Conference Proceedings: Frontiers of Characterization and Metrology for Nanoelectronics,
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In 7-th Workshop on Future Trends Electronics (WOFE-2011),
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In Book of Abstracts, 4th IRUN Symposium on NanoTechnology,
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In 7th International Thin-Film Transistor Conference,
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In 3rd Flexible and Stretchable Electronics Workshop 2011,
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In 37th International Conference on Micro and Nano Engineering (MNE 2011,
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In 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
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In 37th International Conference on Micro and Nano Engineering (MNE 2011),
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document - Stability characterization of high-sensitivity silicon-based EUV photodiodes in a detrimental industrial environment
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In 37th Annual Conference of the IEEE Industrial Electronics Society (IECON 2011),
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Yujian Huang; G. Pandraud; P.M. Sarro;
In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
Beijing, China, pp. 2682-2685, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969771. - Fatigue model based on average cross-section strain of Cu trace cyclic bending
D.M. Farley; A. Dasgupta; Y. Zhou; J.F.J Caers; J.W.C. de Vries;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-10, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765858. - PECVD SiC photonic crystal sensor
G. Pandraud; Yujian Huang; P.M. Sarro; F. Bernal Arango;
In Proc. IEEE SENSORS 2011 Conference,
Limerick, Ireland, pp. 367-370, Oct. 2011. ISBN 978-1-4244-9288-6; DOI 10.1109/ICSENS.2011.6127130. - Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094. - Buckling analysis of carbon nanotubes and the influence of defect position
R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864. - Thermal analysis of HB LED packages and advanced materials
H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
In ChinaSSL 2012, China,
2011. - Co-design of wafer level thin film package assembly
J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
document - Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845. - Degradation of epoxy lens materials in LED systems
S. Koh; W.D. van Driel; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850. - Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785. - Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
Jiaqi Tang; H. Ye; J.B.J. Schelen; C.I.M. Beenakker;
In Proc. 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011),
Shanghai, China, pp. 888-892, Aug. 2011. ISBN 978-1-4577-1768-0; DOI 10.1109/ICEPT.2011.6066972. - Reflectance-based photonic crystal liquid sensors made of ALD TiO2
Yujian Huang; G. Pandraud; P.M Sarro;
In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
Athens, Greece, Procedia Engineering, pp. 1389-1392, Sep. 2011. DOI 10.1016/j.proeng.2011.12.343. - Single-grain Si TFTs using spin-coated liquid-silicon
Jin Zhang; R. Ishihara; H. Tagagishi; R. Kawajiri; T. Shimoda. C.I.M. Beenakker;
In 2011 International Electron Device Meeting (IEDM 2011),
Washington, DC, USA, pp. 14.5.1-14.5.4, Dec. 2011. ISBN 978-1-4577-0505-2; DOI 10.1109/IEDM.2011.6131553. - Patent: Thermogravimetric device with thermal actuator
E.Iervolino; A.W. van Herwaarden;
WIPO Patent Application WO/2011/062489, 2011. - Radiation Detector
Lis K. Nanver; T. Ludovicus; M. Scholtes; Agata Sakic; C. Sander Kooijman; Gerard Nicolaas Anne Van Veen;
Patent application, 2011. - Method of manufacturing a micro unit and micro unit for use in a microscope
J.F. Creemer; G. Pandraud; F. Santagata;
Patent No. WO2011019276, Feb. 2011. - Patent: Thermogravimetric device
A.W. van Herwaarden; E.Iervolino;
WIPO Patent Application WO/2011/062491, 2011. - MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications
M. Mihailovic;
PhD thesis, Delft University of Technology, Jun. 2011. ISBN 978-90-5335-430-8; Promotor: prof.dr. P.M. Sarro. - Mechanical robustness and hermeticity monitoring for MEMS thin film encapsulation
F. Santagata;
PhD thesis, Delft University of Technology, Dec. 2011. ISBN 978-90-8570-759-2; Promotor: prof.dr. P.M. Sarro. - Orientation-and-location controlled single-grain TFTs on glass substrate
T. Chen;
PhD thesis, Delft University of Technology, Apr. 2011. ISBN 978-90-8570-741-7; Promotors: prof. C.I.M. Beenakker, dr. R. Ishihara. - Interconnect schemes for stretchable array-type microsystems
S. Sosin;
PhD thesis, Delft University of Technology, Apr. 2011. ISBN 978-90-5335-390-7; Promotors: prof. P.M. Sarro, dr. M. Bartek. - DotFETs: MOSFETs strained by a single SiGe dot in a low-temperature ELA technology
C. Biasotto;
PhD thesis, Delft University of Technology, Oct. 2011. ISBN 978-90-8570-425-6; Promotor: prof.dr. L.K. Nanver. - Silicon micromachined vertical structures for nanoparticle separation
C. Shen;
PhD thesis, Delft University of Technology, Nov. 2011. ISBN 978-90-8570-761-5; Promotor: prof.dr. P.M. Sarro. - C-V profiling of ultra-shallow junctions using step like background profiles
M. Popadic; V. Milovanovic; C. Xu; F. Sarubbi; L.K. Nanver;
Solid-state electronics,
Volume 54, Issue 9, pp. 890-896, 2010. - Design, fabrication and characterization of a femto-farad capacitive sensor for pico-liter liquid monitoring
J. Wei; C. Yue; M. van der Velden; Z.L. Chen; Z.W. Liu; K.A.A. Makinwa; P.M. Sarro;
Sensors and Actuators A,
Volume 162, Issue 2, pp. 406-417, 2010. - Influence of layout design and on-wafer heatspreaders on the thermal behavior of fully-isolated Bipolar transistors: Part I - Static analysis
S. Russo; La Spina; L; d'Alessandro; V; N. Rinaldi; L.K. Nanver;
Solid-state electronics,
Volume 54, Issue 8, pp. 745-753, 2010. - Ultra-high aspect ratio FinFET technology.
V. Jovanovic; T. Suligoj; M. Poljak; Y. Civale; L.K. Nanver;
Solid-state electronics,
Volume 54, Issue 9, pp. 870-876, 2010. - Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs
D. Farley; Y. Zhou; F. Askari; M. Al-Bassyiouni; A. Dasgupta; J. Caers; J. DeVries;
Microelectronics Reliability,
Volume 50, pp. 937-947, Jul. 2010. - Comb-Actuated Resonant Torsional Microscanner with Mechanical Amplification
A. Arslan; D. Brown; W. Davis; S. Holmstrom; S. K. Gokce; H. Urey;
Journal of Microelectromechanical Systems (JMEMS),
Volume 19, pp. 936-943, 2010. - MEMPHIS: a smart mix of electronics and photonics
L.K. Nanver; Polmans; R; Leinse; A; Flannary; L; Mulders; H;
Mikroniek,
Volume 50, Issue 3, pp. 46-52, 2010. - Thermal budget considerations for excimer laser annealing of implanted dopant
V. Gonda; J. Venturini; C. Sabatier; J. van der Cingel; L.K. Nanver;
Journal of optoelectronics and advanced materials,
Volume 12, Issue 3, pp. 466-469, 2010. - Growth of high density aligned carbon nanotubes using palladium as catalyst
S. Vollebregt; J. Derakhshandeh; R. Ishihara; M. Y. Wu; C. I. M. Beenakker;
Journal of Electronic Materials,
Volume 39, Issue 4, pp. 371-375, 2010. - A silicon MEMS structure for characterization of femto-farad-level capacitive sensors with lock-in architecture
J. Wei; C. Yue; Z.L. Chen; Z.W. Liu; P.M. Sarro;
Journal of Micromechanics and Microengineering,
Volume 20, Issue 6, 2010. - Chemical vapor deposition of a-boron layers on silicon for controlled nanometer deep p+n junction formation
F. Sarubbi; T.L.M. Scholtes; L.K. Nanver;
Journal of Electronic Materials,
Volume 39, Issue 2, pp. 162-173, 2010. - Angular momentum dynamics and the intrinsic drift of monopolar vortices on a rotating sphere
Ramses van der Toorn; Joseph T. F. Zimmerman;
Journal of Mathematical Physics,
Volume 51, 2010. DOI 10.1063/1.3455315. - High speed 6T SRAM cells using single grain TFTs fabricated by ""angstrom""""micro""-Czochralski-Czochralski process at low temperature
Negin Golshani; Jaber Derakhshandeh; R. Ishihara; C.I.M Beenakker;
Japanese Journal of Applied Physics (JJAP),
2010. - Thermal design of multifinger Bipolar transistors.
L. La Spina; V. d'Alessandro; S. Russo; L.K. Nanver;
IEEE Transactions on Electron Devices,
Volume 57, Issue 8, pp. 1789-1800, 2010. - Wafer-level assembly and sealing of a MEMS nanoreactor for in situ microscopy
L. Mele; F. Santagata; G. Pandraud; B. Morana; F. D. Tichelaar; J. F. Creemer; P. M. Sarro;
J. Micromech. Microeng.,
Volume 20, 2010. - High effective Gummel number of CVD boron layers in ultrashallow p+n diode configurations.
F. Sarubbi; L.K. Nanver; T.L.M. Scholtes;
IEEE Transactions on Electron Devices,
Volume 57, Issue 6, pp. 1269-1278, 2010. - Merging standard CVD techniques for GaAs and Si epitaxial growth.
A. Sammak; W.B. de Boer; Boogaard; A van den; L.K. Nanver;
ECS Transactions,
Volume 28, Issue 5, pp. 237-244, 2010. - n-Channel MOSFETs fabricated on SiGe dots for strain-enhanced mobility.
V. Jovanovic; C. Biasotto; L.K. Nanver; J. Moers; D. Gruetzmacher; J. Gerharz; G. Mussler; J. van der Cingel; J.J. Zhang; G. Bauer; O.G. Schmidt; L. Miglio;
IEEE Electron Device Letters,
Volume 31, Issue 10, pp. 1083-1085, 2010. - Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
B. Mimoun; V. Henneken; R. Dekker;
In Stretchable Electronics and Conformal Biointerfaces,
Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010. - A 2.1 µW Area-Efficient Capacitively-Coupled Chopper Instrumentation Amplifier for ECG Applications in 65 nm CMOS
Qinwen Fan; Fabio Sebastiano; Johan H. Huijsing; Kofi A.A. Makinwa;
In Proc. Asian Solid-State Circuits Conference,
Beijing, China, pp. 1 - 4, November8--10 2010. DOI: 10.1109/ASSCC.2010.5716624
Keywords: ...
CMOS integrated circuits;amplifiers;biomedical electrodes;choppers (circuits);electrocardiography;CMOS technology;DC servo loop;ECG application;area efficient chopper instrumentation amplifier;capacitive feedback network;capacitively coupled chopper instrumentation amplifier;electrocardiography;electrode-tissue interface;power 2.1 muW;switched capacitor integrator;Choppers;DSL;Earth Observing System;Electrocardiography;Impedance;Instruments;Noise.
Abstract: ...
This paper describes a capacitively-coupled chopper instrumentation amplifier for use in electrocardiography (ECG). The amplifier's gain is accurately defined by a capacitive feedback network, while a DC servo loop rejects the DC offset generated by the electrode-tissue interface. The high-pass corner frequency established by the servo loop is realized by an area-efficient switched-capacitor integrator. Additional feedback loops are employed to boost the amplifier's input-impedance to 80 MΩ and to suppress the chopper ripple. Implemented in a 65 nm CMOS technology, the amplifier draws 2.1 µA from a 1 V supply and occupies 0.2 mm². - A 21nV/¿Hz chopper-stabilized multipath current-feedback instrumentation amplifier with 2µV offset
Qinwen Fan; J.H. Huijsing; K.A.A. Makinwa;
In H Hidaka; B. Nauta (Ed.), Digest of Technical Papers - 2010 IEEE International Solid-State Circuits Conference,
IEEE, pp. 80-81, 2010. - A 1.8µW 1-µV-offset capacitively-coupled chopper instrumentation amplifier in 65nm CMOS
Qinwen Fan; Fabio Sebastiano; Johan H. Huijsing; Kofi A.A. Makinwa;
In Proc. European Solid-State Circuits Conference,
Sevilla, Spain, pp. 170 - 173, September14--16 2010. DOI: 10.1109/ESSCIRC.2010.5619902
Keywords: ...
CMOS integrated circuits;instrumentation amplifiers;CMOS;input impedance;noise efficiency factor;positive feedback loop;precision capacitively-coupled chopper instrumentation amplifier;rail-to-rail DC common-mode input range;ripple reduction loop;size 65 nm;Accuracy;Choppers;Impedance;Instruments;Noise;Resistors;Topology.
Abstract: ...
This paper describes a precision capacitively-coupled chopper instrumentation amplifier (CCIA). It achieves 1µV offset, 134dB CMRR, 120dB PSRR, 0.16% gain accuracy and a noise efficiency factor (NEF) of 3.1, which is more than 3x better than state-of-the-art. It has a rail-to-rail DC common-mode (CM) input range. Furthermore, a positive feedback loop (PFL) is used to boost the input impedance, and a ripple reduction loop (RRL) is used to reduce the ripple associated with chopping. The CCIA occupies only 0.1mm² in a 65nm CMOS technology. It can operate from a 1V supply, from which it draws only 1.8µA. - A novel 3-D tube-shaped buried poly-Si Pirani gauge for extended dynamic range with small footprint
Santagata; F.; E. Iervolino; Laros; J.M.W.; Groeneweg; J.; Creemer; J.F.; van Herwaarden; A.W.; P.M. Sarro and;
In Y. Suzuki; Man Wong (Ed.), Proceedings of IEEE MEMS 2010 Conference,
Wanchai, Hong Kong, IEEE, pp. 643-646), 2010. - Unifying GaAs and Si epitaxial growth in a standard Si/SiGe CVD system.
A. Sammak; W.B. de Boer; L.K. Nanver;
In STW-SAFE 2010 Conference Proceeding,
Veldhoven, pp. 147-154, 2010. - Ultrashallow junction silicon photdiodes for detection of low energy electrons
A. Sakic; L.K. Nanver; T.L.M. Scholtes; C.T.H. Heerkens; G. van Veen; K. Kooijman; P. Vogelsang;
In STW-SAFE2010 Conference Proceeding,
Veldhoven, pp. 150-153, 2010. - LPCVD amorphous SiCx for freestanding electron transparent windows
B. Morana; J.F. Creemer; F. Santagata; C.C. Fan; H.T.M. Pham; G. Pandraud; F.D. Tichelaar; P.M. Sarro;
In Y. Suzuki; Man Wong (Ed.), Proceedings of IEEE MEMS 2010 Conference,
Wanchai, Hong Kong, IEEE, pp. 572-575), 2010. - VUV performance characterization of a silicon based ultrashallow junction photodiode
L. Shi; S. Nihtianov; L.K. Nanver; Krothc A; U;
In STW-SAFE2010 Conference Proceeding,
Veldhoven, pp. 158-161, 2010. - High Performance Single Grain Si- TFT X-ray Image Sensors
A. Arslan; R. Ishihara; C.I.M. Beenakker;
In Semiconductor Advances for Future Electronics Workshop (SAFE),
Veldhoven, The Netherlands, Nov. 2010. - The influence of stacking faults on the leakage current of B-layer p+n diodes.
Golshani; N; W.B. de Boer; T.L.M. Scholtes; A. Sakic; L.K. Nanver;
In Proceedings of STW-SAFE 2010,
Veldhoven, Nederland, pp. 81-84, 2010. - Design and Development of an Ultra Compact Silicon Phase-Change Heat Exchanger
Rops; C M; M. Mihailovic; P.M. Sarro;
In Proceedings of the 2nd European Conference Microfluidics,
Toulouse, France, Dec. 2010. - A Verilog-A Implementation for Correlated Noise in HBTs
F. Vitale; Ramses van der Toorn;
In Proceedings of SAFE 2010,
Veldhoven, Netherlands, pp. 180-183, Nov. 2010. - Single-grain Si TFTs with high performance surpassing SOI-TFTs
R. Ishihara; T. Chen; C.I.M. Beenakker;
In Proceedings of International Meeting on Information Display,
2010. - Molecular design of reliable epoxy-copper interface using molecular dynamic simulation
C. K. Y. Wong; H. Fan; G. Zhang; M. Yuen;
In Proceedings of International Conference of Thermal, Mechanical & Multi-Physics Simulation, and Experiments Microelectronics and Microsystems (EuroSimE),
France, pp. 1-7, 2010. - Effect of the pulse offset on the thermal cycle for double excimer laser annealing of implanted silicon
V. Gonda; L.K. Nanver;
In Proceedings of OGET conference 2009,
Gyergy�szentmikl�s, Romania: Hungarian Technical Scientific Society of Transylvania, Romania, pp. 135-138, 2010. - Base Resistance Distribution in Bipolar Transistors: Relevance to Compact Noise Modeling and Extraction from Admittance Parameters
F. Vitale; R. Pijper; Ramses van der Toorn;
In Proceedings of IEEE BCTM 2010,
Austin, TX, pp. 161-164, Oct. 2010. - Optical Stability Investigation of High-Performance Silicon-Based VUV Photodiode
L. Shi; S. Nihtianov; L.K. Nanver; U. Kroth; A. A. Sakic Gottwald;
In Proceedings of IEEE Sensors 2010,
Waikoloa, Hawaii, USA, pp. 132-135, Nov. 2010. - MEMS Silicon-Based Micro-Evaporator with Diamond-Shaped Fins
M. Mihailovic; C. Rops; J.F. Creemer; P.M. Sarro;
In Proceedings of EUROSENSORS XXIV,
Linz, Austria, Sep. 2010. - Electrical characterization of TiSi/TiN layer stack in temperature range from 0 � 500 �C
M. Mihailovic; J.F. Creemer; P.M. Sarro;
In Proceedings of 13th Annual Workshop on Semiconductors Advances for Future Electronics and Sensors (SAFE),
Veldhoven, The Netherlands, pp. 114-117, 2010. - Silicon Photodiodes for High-Efficiency Low-Energy Electron Detection
Agata Sakic; Lis K. Nanver; T. L. M. Scholtes; Carel Th. H. Heerkens; Gerard van Veen; Kees Kooijman; Patrick Vogelsang;
In Proceedings of IEEE 40th European Solid-State Device Research Conference (ESSDERC 2010),
Seville, Spain, pp. 102-105, Sep. 2010. - Design concepts for semiconductor based ultra linear varactor circuits.
C. Huang; K. Buisman; L.K. Nanver; P.J. Zampardi; L.E. Larson; L.C.N. de Vreede;
In Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting (BCTM),
Austin, Texas, USA, IEEE, pp. 204-211, 2010. - Optical performance of B-layer ultra-shallow-junction silicon photodiodes in the VUV spectral range
L. Shi; F. Sarubbi; L.K. Nanver; Kroth; U; Gottwald; A; S. Nihtianov;
In Proc. Eurosensors XXIV,
Linz, Austria, 2010. - A piezoresistive sensor for pressure monitoring at inkjet nozzle
J. Wei; P.M. Sarro; T. Chu Duc;
In Proc. IEEE Sensors,
pp. 2093-2096, 2010. - Thermogravimetric Device with Integrated Thermal Actuators
E. Iervolino; A.W. van Herwaarden; W. van der Vlist; P.M. Sarro.;
In Proceedings MEMS2010,
Hong Kong, China, pp. 683-686, Jan. 2010. - Optical Performance of B-Layer Ultrashallow Junction Si Photodiodes in the VUV Spectral Range
L. Shi; F. Sarubbi; L.K. Nanver; Kroth; U; Gottwald; A; S. Nihtianov;
In Procedia Engineering 5,
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In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
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In 11th National Conference on Photonics,
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In EMRS,
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PhD thesis, Delft University of Technology, Jul. 2010. ISBN 978-90-8570-583-3; Promotors: prof. L.K. Nanver. R. van der Toorn. - Substrate crosstalk suppression using wafer-level packaging: Metalized through-substrate trench approach
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PhD thesis, Delft University of Technology, Oct. 2010. ISBN 978-90-8570-600-7; Promotors: prof. J.N. Burghartz, dr. M. Bartek. - Characterization of pure boron depositions integrated in silicon diodes for nanometer-deep junction applications
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Sensors and actuators a-physical,
Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247. - Calorimeter chip calibration for thermal characterization of liquid samples
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Thermochimica acta,
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Solid-state electronics,
Volume 53, Issue 5, pp. 540-547, 2009. - Improving bulk FinFET DC performance in comparison to SOI FinFET
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Microelectronic engineering,
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Journal of vacuum science & technology b,
Volume 27, Issue 2, pp. 912-918, 2009. - Controlled Growth of Non-uniform Arsenic Profiles in Silicon RPCVD Epitaxial Layers
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Journal of Electronic Materials,
Volume 38, Issue 11, pp. 2323-2328, 2009. - Direct observation of the electrical activity of coincidence-site lattice boundaries in location-controlled silicon islands using scanning spread resistance microscopy
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Journal of the society for information display,
Volume 17, Issue 3, pp. 293-297, 2009. - Stacking of Single-Grain Thin-Film Transistors.
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Japanese journal of applied physics,
Volume 48, 2009. ISSN 0021-4922. - Modulation speed improvement in a FabryPerot thermo-optical modulator through a driving signal optimization technique
F.G. della Corte; M. Merenda; G. Cocorullo; M. Iodice; I. Rendina; P.M. Sarro;
Optical engineering,
Volume 48, Issue 7, 2009. - Pattern transfer on a vertical cavity sidewall using SU8
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Journal of micromechanics and microengineering,
Volume 19, 2009. - Photolithography on bulk micromachined substrates. Journal of micromechanics and microengineering
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Journal of micromechanics and microengineering,
Volume 19, pp. 1-6, 2009. - On the Mechanisms Governing Aluminum-Mediated Solid-Phase Epitaxy of Silicon
Y. Civale; G. Vastola; L.K. Nanver; R. Mary-Joy; J.R. Kim;
Journal of electronic materials,
Volume 38, Issue 10, pp. 2052-2062, 2009. - Ultra Linear Low-Loss Varactor Diode Configurations for Adaptive RF Systems
C. Huang; K. Buisman; M. Maretti; L. K. Nanver; F. Sarubbi; M. Popadic; T. Scholtes; H. Schellevis; L. E. Larson; L. de Vreede;
IEEE Transactions on Microwave Theory and Techniques,
Volume 57, Issue 1, pp. 205-215, 2009. - Monolithic Stacking of Single-Grain Thin-Film Transistors to realize high performance three dimensional integrated circuits
M.R Tajari Mofrad; Jaber Derakhshandeh; R. Ishihara; Cees Beenakker;
Japanese Journal of Applied Physics,
Volume 48, 2009. - Analytical Model of I-V Characteristics of Arbitrarily Shallow p-n Junctions
M. Popadic; G. Lorito; L. K. Nanver;
IEEE Transactions on Electron Devices,
Volume 56, Issue 1, pp. 116-125, 2009. - Analytical Carrier Transport Model for Arbitrarily Shallow p-n Junctions
M. Popadic; G. Lorito; L.K. Nanver;
IEEE Transactions on Electron Devices,
Volume 56, Issue 1, pp. 116-125, 2009. - Ultra linear low-loss varactor diode configurations for adaptive RF systems
C. Huang; K. Buisman; L.K. Nanver; F. Sarubbi; M. Popadic; T.L.M. Scholtes; H. Schellevis;
IEEE Transactions on Microwave Theory and Techniques,
Volume 57, Issue 1, pp. 205-215, 2009. - Influence of Concurrent Electrothermal and Avalanche Effects on the Safe Operating Area of Multifinger Bipolar Transistors
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IEEE Transactions on Electron Devices,
Volume 56, Issue 3, pp. 483-491, 2009. - A 2_2 Optofluidic Multimode Interference Coupler
R. Bernini; G. Testa; L. Zeni; P.M. Sarro;
IEEE journal of selected topics quantum electronics,
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Applied Physics Letters,
Volume 94, 2009. - Analysis of the Bipolar Current Mirror Including Electrothermal and Avalanche Effects
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IEEE Transactions on Electron Devices,
Volume 56, Issue 6, pp. 1309-1321, 2009. - Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling
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IEEE Journal of Solid-State Circuits,
Volume 44, Issue 9, pp. 2322-2338, 2009. - Nanoscale chemical imaging of the reduction behavior of a single catalyst particle
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Angewandte chemie-international edition,
pp. 3632-3635, 2009. - X-ray diffraction study of the composition and strain fields in buried SiGe islands
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European physical journal-special topics,
Volume 167, pp. 41-46, 2009. - Strained Single Grain Silicon n- and p-channel Thin Film Transistors by Excimer Laser
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Accepted IEEE Electron Device Letters,
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Advanced materials,
Volume 21, pp. 4992-4995, 2009. - Stretchable array of ISFET devices for applications in biomedical imagers.
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document - Monolithic 3D-ICs with Single Grain Si TFTs
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document - C-V Profiling of Ultrashallow Junctions using a Step-Like Background Doping Profile
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document - Thermal analysis of peptides with a calorimeterchip
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document - Thermal Characterization of Microliter Amounts of Liquids by a Micromachined Calorimetric Transducer.
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document - Hydrophobic Self-Assembly Molecular Layer for Reliable Cu-Epoxy Interface
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In Proceedings-Electronic Components and Technology Conference,
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document - Sheet resistance of As-doped monocrystalline silicon in temperature range up to 1100 K
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document - Mems nanoreactor for atomic-resolution microscopy of nanomaterials in their working state
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document - Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition
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In Proceeding title: Proceedings of the Eurosensors XXIII Conference,
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document - MEMS Stage Integrated with Microlens Arrays for High-Resolution Beam Steering
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In Procedia Chemistry,
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document - Bulk-Si FinFET Technology for Ultra-High Aspect-Ratio Devices
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In Proc. of the 39th IEEE European Solid-State Device Research Conference (ESSDERC 2009),
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document - Deterministic Ratchets for Particle Separation Fabricated With Si MEMS Technology
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document - Fabrication of Stretchable PDMS Membrane as Substrate Material for Multi-Electrode Array Devices
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document - Chemical Vapor Deposition of Gallium on Silicon and SiO2. In PJ French
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document - Downscaling of Al/Si-gate MOSFETs with Self-Aligned Laser Annealed Source/Drain Junctions
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document - Stability Investigation of High Performance Silicon-Based DUV/EUV Photodiodes
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document - Characterization of AlN thin films sputtered on Al/Ti electrodes for piezoelectric devices
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document - Simulation and Experimental study of crystallographic orientation control of 2D location controlled single grain crystalline silicon
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document - Application of amorphous boron layer as diffusion barrier for pure aluminium
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document - Effect of the pulse offset on the thermal cycle for double excimer laser annealing of implanted silicon
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document - Evaluating the self-heating thermal resistance of bipolar transistors by DC measurements: A critical review and update
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In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM),
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document - Numerical analysis of the dynamic thermal behavior of RF bipolar transistors
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In Proc. of International Conference on Computational Methods for Thermal Problems (ThermaComp),
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document - Thermal budget considerations for excimer laser annealing of implanted dopants
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L. La Spina; V. Alessandro; S. Russo; N. Rinaldi; L.K. Nanver;
In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM),
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In Proc. of 45th International Conference on Microelectronics, Devices and Materials (MIDEM 2009),
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Solid-State Electronics,
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Solid State Electronics,
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Sensors and Actuators A,
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Journal of Adhesion Science and Technology,
Volume 22, pp. 1733-1756, 2008. - Single-Grain Si TFTs and Circuits Fabricated Through Advanced Excimer-Laser Crystallization
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Solid State Electronics,
Volume 52, pp. 353-358, 2008. - Location and Crystallographic Orientation Control of Si Grains Through Combined Metal Induced Lateral Crystallization and micro-Czochralski process
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JJAP,
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Informacije MIDEM Journal of Microelectronics Electronic Components and Materials,
Volume 38, Issue 1, pp. 1-4, 2008. - Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation
C. K. Y. Wong; H. Fan; M. M. F. Yuen;
IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies,
Volume 31, pp. 297-308, 2008. - Continuous deep reactive ion etching of tapered via holes for three-dimensional integration
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Volume 18, 2008. - Enabling low-distortion varactors for adaptive transmitters
C. Huang; L. C. N. de Vreede; F. Sarubbi; M. Popadic; K. Buisman; J. Qureshi; M. Mar.etti; A. Akhnoukh; T. L. M. Scholtes; L. E. Larson; L. K. Nanver;
IEEE Trans. Microwave Theory and Techniques,
Volume 56, Issue 5, pp. 1149-1163, May 2008. - An Assessment of angstrom micro-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integation
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IEEE Journal of Solid-State Circuits,
Volume 43, Issue 7, pp. 1563-1576, Jul. 2008. - An Assessment of �_-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integration
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IEEE Microwave and Wireless Components Letters,
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Electrochemical and Solid-State Letters,
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Geophysical and Astrophysical Fluid Dynamics,
Volume 102, Issue 4, pp. 349-371, 2008. - Formation of Location-Controlled Germanium Grains by Excimer Laser
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Volume 13, Issue 9, Oct. 2008. - Hyrogenation Assisted Lateral Micromachining of (111) Silicon Wafers
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Volume 17,, Issue 6, pp. 1489-1494, Dec. 2008. - Reliability Analysis of Single Grain Si TFT using 2D Simulation
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Volume 13, Issue 9, Oct. 2008. - Investigation of Local Electrical Properties of Coincidence-Site-Lattice Boundaries in Location-Controlled Silicon Islands Using Scanning Capacitance Microscopy
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J. Krc; M. Zeman; F. Smole; M. Topic;
Thin Solid Films,
Jan. 2004. - Integrated Coulter counter based on 2-dimensional liquid aperture control
J.H. Nieuwenhuis; F. Kohl; J. Bastemeijer; P.M. Sarro; M.J. Vellekoop;
Sensors and Actuators B: Chemical,
2004. - Metal patterning on high topography surface for 3D RF devices fabrication
N.P. Pham; E. Boellaard; W. Wien; L.D.M. van den Brekel; J.N. Burghartz; P.M. Sarro;
Sensors and Actuators A,
Volume 115, pp. 557-562, Mar. 2004. - Microfluidic sensor based on integrated optical hollow waveguides
S.Campopiano; R.Bernini; L.Zeni; P.M. Sarro;
Optics letters,
Volume 29, Issue 16, pp. 1894-1896, Aug. 2004. - Optimization of a-SiGe:H solar cells with graded intrinsic layers using integrated optical and electrical modeling
B.E. Pieters; M. Zeman; R.A.C.M.M. van Swaaij; W.J. Metselaar;
Thin Solid Films,
Volume 451, pp. 294, 2004. - Integrated Coulter counter based on 2-dimensional liquid aperture control
J. H. Nieuwenhuis; F. Kohl; J. Bastemeijer; P. M. Sarro; M. J. Vellekoop;
Sensors and Actuators B,
Volume 102, Issue 1, pp. 44-50, 2004. - Arrow optical waveguides based sensors
R.Bernini; S.Campopiano; L.Zeni; P.M. Sarro;
Sensors and Actuators B,
Volume 100, Issue 1-2, pp. 143-146, 2004. - Organized structures obtained from urethane/urea elastomers
M.H. Godinho; A.C. Trindade; J.L. Figueirinhas; D. Vidal; L.V. Melo; P. Brogueira;
Metals,
Volume 147, Issue 1-3, pp. 209-213, Dec. 2004. - Concept and performance of field-effect amorphous silicon solar cell
N. Matsuki; Y. Abiko; K. Miyazaki; M. Kobayashi; H.Fujioka; H. Koinuma;
Semicond. Sci. Technol,
Volume 19, Issue 1, pp. 61-64, Jan. 2004. - Novel low-temperature processing of low noise SDDs with on-detector electronics
J. Sonsky; R. Koornneef; J. Huizenga; R.W. Hollander; L.K. Nanver; T. Scholtes; F. Roozeboom; C.W.E. van Eijk;
Nuclear Instruments and Methods Physics Research Section A,
Volume 517, Issue 1-3, pp. 301-312, Jan. 2004. - Limit Cycle Oscillations in CW Laser Driven NEMS
Keith Aubin; Maxim Zalalutdinov; Tuncay Alan; Robert Reichenbach; Richard Rand; Alan Zehnder; Jeevak Parpia; Harold Craighead;
J. Microelectromech. Syst.,
Volume 13, pp. 1018, 2004. - Stress-assisted nickel-induced crystallization of silicon on glass
P. Hashemi; J. Derakhshandeh; S. Mohajerzadeh; M. Robertson; A. Tonita;
Journal of Vacuum Science and Technology A (JVSTA),
Volume 22, Issue 3, pp. 966-970, May 2004. - Photoresist Coating Methods for the Integration of Novel 3-D RF Microstructures
N.P. Pham; E. Boellaard; J.N. Burghartz; P.M. Sarro;
Journal of Microelectromechanical Systems,
Volume 13, Issue 3, pp. 491-499, Jun. 2004. ISSN 1057-7157. - Novel network control in hydrogenated amorphous silicon by molecular beam deposition method
N. Matsuki; M. Kondo; A. Matsuda;
J. Non-Cryst. Solid,
Volume 338-340, pp. 382-385, Jun. 2004. - Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires
C.Videlot; J. Ackermann; F.Fages; T.N.Nguyen; L.Wang; P.M. Sarro; D.Crawley; K.Nikolic; M.Forshaw;
J. Micromech. Microeng.,
Volume 14, pp. 1618-1624, 2004. - The role of the silyl radical in plasma deposition of microcrystalline silicon
C. Smit; R.A.C.M.M. van Swaaij; E. A. G. Hamers; M. C. M. van de Sanden;
J. Appl. Phys.,
Volume 96, pp. 4076, 2004. - Electrothermal Limitations on the Current Density of High-Frequency Bipolar Transistors
Nebojsa Nenadovic; Lis K. Nanver; Jan W. Slotboom;
IEEE Transactions on Electron Devices,
Volume 51, Issue 12, pp. 2175-2180, Dec. 2004. - A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part II: A Novel Analysis of Thermal Breakdown
N. Nenadovic; V. d Alessandro; L.K. Nanver; F. Tamigi; N. Rinaldi; J.W. Slotboom;
IEEE Transactions on Electron Devices,
Volume 51, Issue 1, pp. 51-62, Jan. 2004. - A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
IEEE Trans. on Electron Devices,
Volume 51, Issue 1, pp. 42-50, Jan. 2004. - Extraction and Modeling of Self-Heating and Mutual Thermal Coupling Impedance of Bipolar Transistors
N. Nenadovic; S. Mijalkovic; L.K. Nanver; L.J.K. Vandamme; V. Alessandro; H. Schellevis; J.W. Slotboom;
IEEE Journal of Solid-State Circuits,
Volume 39, Issue 10, pp. 1764-1772, Oct. 2004. ISSN 0018-9200. - High-speed wavefront sensor compatible with standard CMOS technology
D. W. de Lima Monteiro; G. Vdovin; P. M. Sarro;
Sensors and Actuators A,
Volume 109, Issue 3, pp. 220-230, Jan. 2004. - A pulsed laser ablation / plasma chemical vapor deposition cluster system for combinatorial device fabrication
N. Matsuki; Y. Abiko; M. Kobayashi; K. Miyazaki; H. Fujioka; H. Koinuma;
Applied Physics A,
Volume 79, Issue 4-6, pp. 1413-1416, Sep. 2004. - RF power silicon-on-glass VDMOSFETs
N. Nenadovic; V. Cuoco; S.J.C.H. Theeuwen; H. Schellevis; G. Spierings; A. Griffo; M. Pelk; L.K. Nanver; R.F.F. Jos; J.W. Slotboom;
IEEE Electron Device Letters,
Volume 25, Issue 6, pp. 424-426, Jun. 2004. - Gel-layer- assisted, directional electropolymerization: a versatile method for high resolution volume and/or surface patterning of flexible substrates with conjugated polymers
J. Ackermann; C.Videlot; T.N.Nguyen; L.Wang; P.M. Sarro;
Advanced Materials,
Volume 16, Issue 19, 2004. - M3: the third dimension of silicon, Advanced Micro and Nanosystems
P.M. Sarro;
In Enabling Technologies for MEMS and Nanodevices,
Wiley, 2004. - On the reproducibility of a-Si:H deposited with an expanding thermal plasma
A. M. H. N. Petit; A. H. M. Smets; R.A.C.M.M. van Swaaij; M. C. M. van de Sanden;
In Proceedings of SAFE2004,
Veldhoven, The Netherlands, pp. 714, 2004. - Particle discrimination with an improved projection cytometer
J.H. Nieuwenhuis; P. Svasek; P.M. Sarro; M.J. Vellekoop;
In Proceed. MicroTAS 2004,
Malmo, Sweden, pp. 419-421, Sep. 2004. - Nanostructure formation on anodic aluminum oxide nanotemplates
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In The Second International Workshop on Nanophysics and Nanotechnology,
Hanoi, Vietnam, pp. 91-98, Oct. 2004. - Characterization Waferstepper and Process Related Front- to Backwafer Overlay Errors in Bulk Micro Machining using Electrical Overlay Test Structures
H.W. van Zeijl; F.G.C. Bijnen; J. Slabekoorn;
In Proc. SPIE, MEMS, MOEMS and Micromachining,
pp. 398-406, Apr. 2004. ISBN 0-8194-5378-1. - Aspects of Silicon Nanowire Synthesis by Aluminum-Catalyzed Vapor-Liquid-Solid Mechanism
Y. Civale; L.K. Nanver; P. Hadley; E.J.G. Goudena;
In Proceedings of 7th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE, Veldhoven,
The Netherlands, pp. 692-696, 2004. - Integrated antiresonant hollow waveguide liquid sensor
S. Campopiano; R.Bernini; L.Zeni; P.M. Sarro;
In Proc. Eurosensors XVIII,
Rome, pp. 765-766, Sept. 2004. ISBN: 88-7621-282-5. - A new approach in measuring Cu-EMC adhesion strength by AFM
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In Proceedings-Electronic Components and Technology Conference,
Las Vegas, NV, pp. 491-495, 2004. - Nanochannels in glass with poly-silicon electrodes
V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
In Proc. Eurosensors XVIII,
Rome, Italy, Sep. 2004. - TiN for MEMS hotplate heaters
J.F. Creemer; P.M. Sarro; M. Laros; H. Schellevis; L. Steenweg; H.W. Zandbergen;
In Proc. Eurosensors XVIII,
Rome, pp. 706-707, Sept. 2004. ISBN 88-7621-282-5. - Particle size discrimination with a liquid aperture coulter counter
J. Nieuwenhuizen; P. Svasek; P.M. Sarro; M.J. Vellekoop;
In Proc. Eurosensors XVIII,
Rome, pp. 317-320, Sept. 2004. ISBN: 88-7621- 282-5. - The Electro-Thermal Smoothie Database Model for LDMOS Devices
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In Proc. ESSDERC,
Leuven, Belgium, pp. 457-460, Sep. 2004. ISBN 0-7803-8479-2. - A New Extraction Technique for the Series Resistances of Semiconductor Devices Based on the Intrinsic Properties of Bias-Dependent Y-Parameters
V. Cuoco; W.C.E. Neo; L.C.N de Vreede; H.C de Graaff; L.K. Nanver; H.C. Wu; H.F.F Jos; J.N. Burghartz;
In Proc. Bipolar/BiCMOS Circuits and Technology Meeting 2004 (BCTM 2004),
Montreal, Canada, pp. 148-151, Sep. 2004. - A Novel SPICE Macromodel of BJTs Including the Temperature Dependence of High-Injection Effects
V. Alessandro; N. Nenadovic; F. Tamigi; N. Rinaldi; L.K. Nanver; J.W. Slotboom;
In Proc. 24th International Conference on Microelectronics (MIEL 04), Nis,
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F. Tamigi; N. Nenadovic; V. Alessandro; L.K. Nanver; N. Rinaldi; J.W. Slotboom;
In Proc. 24th International Conference on Microelectronics (MIEL 04),
Nis, Serbia and Montenegro, pp. 257-260, May 2004. ISBN 0-7803-8166-1.
document - Electrothermal Characterization of Silicon-on-Glass VDMOSFETs
N. Nenadovic; H. Schellevis; V. Cuoco; A. Griffo; S.J.C.H. Theeuwen; L.K. Nanver; R.F.F. Jos; J.W. Slotboom;
In Proc. 24th International Conference on Microelectronics (MIEL 04), Nis,
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document - Integrated Sensors Arrays For Bioluminescence And Fluorescence Bio-Chemical Analysis
V.Iordanov; B. Iliev; A.Bossche; J. Bastemeijer; P.M. Sarro; I.T.Young; G. van Dedem; M.Vellekoop;
In Proc. IEEE Sensors 2004 Conf.,
2004. - High-aspect-ratio bulk micromachined vias contacts
N.P. Pham; P.M. Sarro;
In Proc SAFE, & Prorisc 2004,
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document - Electrothermal limitations on the current density of high-frequency bipolar transistors
N. Nenadovic; L.K. Nanver; J.W. Slotboom;
In Proc. 19th International Symposium on Microelectronics Technology and Devices,
Porto de Galinhas, Brazil, pp. 3-8, Sep. 2004. ISBN 1-56677-416-0. - Design of in-package MST-based actuators for micro-assembly
V. Henneken; S. van der Bedem; M. Tichem; B. Karpuschewski; P.M. Sarro;
In Proc SAFE & Prorisc 2004,
Veldhoven, pp. 747-752, Nov. 2004. ISBN 90-73461-43X. - Titanium Nitride for MEMS Hotplates
J.F. Creemer; P.M. Sarro; M. Laros; H. Schellevis; T. Nathoeni; L. Steenweg; V. Svetchnikov; H.W. Zandbergen;
In Proc SAFE & Prorisc 2004,
Veldhoven, pp. 742-746, Nov. 2004. ISBN 90-73461-43X. - Hydrogen Injection in ETP Plasma Jet for Fast-Deposition of High-Quality a-Si:H
A. M. H. N. Petit; R.A.C.M.M. van Swaaij; M. C. M. van de Sanden;
In Mater. Res. Soc. Symp. Proc.,
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J. Derakhshandeh; P. Hashemi; S. Mohajerzadeh; A. Khajooeizadeh;
In Iran Physics Conference,
Tehran, Iran, Sep. 2004. - Characterization of ferroelectric thin films materials for FeRAM
S.H. Le; B. R. Salmassi; J. N. Burghartz; P.M. Sarro;
In Proc SAFE & Prorisc 2004,
Veldhoven, pp. 710-713, Nov. 2004. ISBN 90-73461-43X. - Study of 3-MeV electron irradiation damage in amorphous silicon with TRMC
A. Klaver; J. M. Warman; M. P. de Haas; J. W. Metselaar; R.A.C.M.M. van Swaaij;
In Mater. Res. Soc. Symp. Proc.,
pp. 165, 2004. - Design and Characterization of a High-Resistivity Silicon Traveling Wave Amplifier for 10 Gb/s Optical Communucation Systems
F.M. De Paola; L.C.N. de Vreede; L.K. Nanver; N. Rinaldi; J.N. Burghartz;
In J.D. Cressler; J. Papapolymerou (Ed.), 2004 Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems,
Atlanta, USA, pp. 69-7, Sep. 2004. ISBN 0-7803-8703-1. - Physically based analytical modeling of base-collector charge, capacitance and transit time of III-V HBTs
R. van der Toorn; J.C.J. Paasschens; R.J. Havens;
In Compound Semiconductor Integrated Circuit Symposium,
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J.C.J. Paasschens; S. Harmsma; R. van der Toor;
In Bipolar/BiCMOS Circuits and Technology. Proceedings of the 2004 Meeting 13-14 Sept. 2004,
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document - The Investigation of Stress-Assisted Nickel-Induced Crystallization of Silicon on Glass by TEM and SEM
P. Hashemi; J. Derakhshandeh; S. Mohajerzadeh; M. Robertson; A. Tonita;
In The 31st Annual Meeting of the Microscopical Society of Canada May,
2004. - A quantitative evaluation of pattern transfer across (111) surfaces in a (100) silicon wafer by contact masking and over-exposure
W. Venstra; M. Laros; J.W. Spronck; P.M. Sarro; J. van Eijk;
In Proc. Eurosensors XVIII,
Rome, pp. 313-316, Sept. 2004. 88-7621-282-5. - Substrate Transfer Technology
R. Dekker;
PhD thesis, Delft University of Technology, Jun. 2004. ISBN 90-74445-61-6; Promotors: prof. J.W. Slotboom, prof. J.N. Burghartz. - Electrothermal behavior of high-frequency silicon-on-glass transistors
N. Nenadovic;
PhD thesis, Delft University of Technology, Nov. 2004. ISBN 90-6464-114-5; Promotors: prof. L.K. Nanver, prof. J.W. Slotboom. - PECVD silicon carbide: A structural material for surface micromachined devices
H.T.M. Pham;
PhD thesis, Delft University of Technology, Dec. 2004. ISBN 90-9018856-8; Promotor: prof. P.M. Sarro. - Phase-Field Modelling of Excimer Laser Lateral Crustallization of Silicon Thin Films
A. Burtsev; M. Apel; R. Ishihara; C.I.M. Beenakker;
Thin Solid Films,
Volume 427, Issue 1-2, pp. 309-313, Mar. 2003. - Photoluminescence properties of a-Si:H based thin films and corresponding solar cells
E. Pincik; H. Kobayashi; et al;
Thin Solid Films,
Volume 433, Issue 1-2, pp. 344-351, Jun. 2003. - Effect of surface roughness of ZnO:Al films on light scattering in hydrogenated amorphous silicon solar cells
J. Krc; M. Zeman; O. Kluth; F. Smole; M. Topic;
Thin Solid Films,
Volume 426, Issue 1-2, pp. 296-304, Feb. 2003. - Advanced excimer-laser crystallization process for single-crystalline thin film transistors
R. Ishihara; P.Ch. van der Wilt; B.D. van Dijk; A. Burtsev; J.W. Metselaar; C.I.M. Beenakker;
Thin Solid Films,
Volume 427, Issue 1-2, pp. 77-85, Mar. 2003. - Spatial light modulators based on micromachined reflective membranes on viscoelastic layers
S. Sakarya; G. Vdovin; P.M. Sarro;
Sensors and Actuators A,
Volume 108, Issue 1-3, pp. 271-275, Nov. 2003. - Three terminals optoelectronics devices integrated into a silicon on silicon waveguide
G. Coppola; A. Irace; G. Breglio; M. Iodice; L. Zeni; A. Cutolo; P.M. Sarro;
Optics and Lasers Engineering,
Volume 39, Issue 3, pp. 317-332, Mar. 2003. ISSN 0143-8166. - Photoluminescence properties of a-Si:H based thin films and corresponding solar cells
E. Pincik; H. Kobayashi; H. Gleskova; M. Kucera; L. Ortega; M. Jergel; C. Falcony; R. Brunner; T. Shimizu; V. Nadazdy; M. Zeman; M. Mikula; M. Kumeda; R.A.C.M.M. van Swaaij;
Thin Solid Films,
Volume 433, 2003. - X-ray grazing incidence study of inhomogeneous strain relaxation in Si/SiGe wires
A. Daniel; Y. Zhuang; V. Holy; J. Stangl; S. Zerlauth; F. Schaffler; G. Bauer; N. Darowski; U. Pietsch;
Nuclear Instruments and Methods Physics Research B,
Volume 200C, pp. 267-272, 2003. - Determining the material structure of microcrystalline silicon from Raman spectra
C. Smit; R.A.C.M.M. van Swaaij; H. Donker; A.M.H.N. Petit; W.M.M. Kessels; M.C.M. van de Sanden;
J. Appl. Phys.,
Volume 94, 2003. - Transient analysis of a high-speed thermo-optic modulator integrated in an all-silicon waveguide
M. Iodice; F.G. Della Corte; I. Rendina; P.M. Sarro; M. Bellucci;
Optical-Engineering,
Volume 42, Issue 1, pp. 169-175, Jan. 2003. - Electrical Characteristics of Plasma-Enhanced Chemical Vapor Deposited Silicon Carbide Thin Films
H.T.M. Pham; T. Akkaya; C.R. de Boer; P.M. Sarro;
Material Science Forum,
Volume 433-436, pp. 451-454, 2003. ISSN 0255-5476. - Fabrication of crystalline membranes oriented in the (111) plane in a (100) silicon wafer
W.J. Venstra; P.M. Sarro;
Microelectronic Engineering,
Volume 67-68, pp. 502-507, Jun. 2003. - Characterization of front- to backwafer bulk micromachining using electrical overlay test structures
H. W. van Zeijl; J. Slabbekoorn;
J. Micromech. Microeng,
Volume 13, Issue 4, pp. S108-S112, Jul. 2003. ISSN 0960-1317. - On the Design of RF Spiral Inductors on Silicon
J.N. Burghartz; B. Rejaei;
IEEE Transactions on Electron Devices,
Volume 50, Issue 3, pp. 718-729, 2003. - 3D molecular interconnection technology
D. Crawley; K. Nikolic; M. Forshaw; J. Ackermann; C. Videlot; T.N. Nguyen; L. Wang; P.M. Sarro;
J. Micromech. Microeng,
Volume 13, Issue 5, pp. 655-662, Jun. 2003. - Patterned FeNi thin film for RF and microwave components
M. Vroubel; Y. Zhuang; B. Rejaei; J.N. Burghartz;
Journal of Magnetism and Magnetic Materials,
Volume 258-259, pp. 167-169, Mar. 2003. ISSN 0304-8853. - Substrate Transfer for RF Technologies
R. Dekker; P.G.M. Baltus; H.G.R. Maas;
IEEE Transactions on Electron Devices,
Volume 50, Issue 3, pp. 747-757, Mar. 2003. - One chip photovoltaic water electrolysis device
Y. Yamada; N. Matsuki; T. Ohmori; H. Mametsuka; M. Kondo; A. Matsuda; E. Suzuki;
Int. J. Hydrogen Energy,
Volume 28, Issue 11, pp. 1167-1169, Nov. 2003. - Planar antiresonant reflecting optical waveguides as integrated optical refractometer
R. Bernini; S. Campopiano; L. Zeni; C. de Boer; P.M. Sarro;
IEEE Sensors Journal,
Volume 3, Issue 5, pp. 652-657, Oct. 2003. - Power amplifier PAE and ruggedness optimization by second-harmonic control
M. Spirito; L.C.N. de Vreede; L.K. Nanver; S. Weber; J.N. Burghartz;
IEEE Journal of Solid-State Circuits,
Volume 38, Issue 9, pp. 1575-1583, 2003. - Self-Adjustment of Micro-mechatronic Systems
M. Tichem; B. Karpuschewski; P.M. Sarro;
Annals of the CIRP,
Volume 52, Issue 1, pp. 17-20, 2003. - Integrated Solenoid Inductors with Patterned Sputter-Deposited Cr/Fe10Co90/Cr Ferromagnetic Cores
Y. Zhuang; B. Rejaei; E. Boullaard; M. Vroubel; J.N. Burghartz;
IEEE Electron Device Letters,
Volume 24, Issue 4, pp. 224-226, 2003. - Miniaturized analytical assays in biotechnology
R.A. Guijt-van Duijn; et al;
Biotechnology Advances,
Volume 21, Issue 5, pp. 431-444, Aug. 2003. - Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications
J. Ackermann; C. Videlot; T.N. Nguyen; L. Wang; P.M. Sarro; D. Crawley; K. Nikoli; M. Forshaw;
Applied Surface Science,
Volume 212-213, pp. 411-416, May 2003. - Polymeric amorphous carbon as p-type window within amorphous silicon solar cells
R.U.A. Khan; S.R.P. Silva; R.A.C.M.M. van Swaaij;
Appl. Phys. Lett.,
Volume 82, pp. 3979, 2003. - On optical, electrical and structural properties of amorphous silicon based semiconductors
E. Pincik; H. Kobayashi; J. Mullerov�; K. Gmucov�; M. Jergel; R. Brunner; M. Zeman; M. Zahoran;
Acta Physica Slovaca,
Volume 53, Issue 4, pp. 267-278, 2003. - Respect for Quantity
L.K. Nanver;
Delft University of Technology: , Apr. 2003.
document - M3: the third dimension of silicon
P.M. Sarro;
Delft University of Technology: , Apr. 2003. ISBN 90-75774-02-8. - Poly-Si TFT Structures
R. Ishihara;
In Thin Film Transistors, Materials and Processes,
Boston, Kluwer Academic Publishers, 2003. - Extraction of Thermal Network Function for Bipolar RF Devices and Circuits
N. Nenadovic; S. Mijalkovic; F. Tamigi; V. dAlessandro; L.K. Nanver; H. Schellevis; J.W. Slotboom;
In XLVII ETRAN Conference,
Herceg Novi, Serbia-Montenegro, pp. 225-228, Jun. 2003. ISBN 86-80509-48-5.
document - Simulations of buffer layers in a-Si:H solar cells deposited with an expanding thermal plasma
A.M.H.N. Petit; M. Zeman; R.A.C.M.M. van Swaaij; M.C.M. van de Sanden;
In WCPEC-3,
Osaka, Japan, May 2003.
document - Light scattering properties of SnO2 and ZnO surface textured substrates
J. Krc; M. Zeman; O. Kluth; F. Smole; M. Topic;
In WCPEC-3,
Osaka, Japan, May 2003.
document - Effect of charged gap states on light induced degradation of a-Si:H single junction solar cells
M. Zeman; V. Nadazdy; R.A.C.M.M. van Swaaij; J.W. Metselaar;
In WCPEC-3,
Osaka, Japan, May 2003. - Fabrication of Nanochannels Using Glass to Glass Anodic Bonding
V.G. Kutchoukov; F. Laugere; W. van der Vlist; L. Pakula; Y. Garini; P.F.A. Alkemade; A. Bossche;
In Transducers,
Boston, Massachuesetts, USA, pp. 1327-1330, Jun. 2003. ISBN 0-7803-7731-1. - Integrated 5.7 GHz Chip-Size Antenna for Wireless Sensor Networks
P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
In Transducers,
Boston, Massachuesetts, USA, pp. 49-52, Jun. 2003. ISBN 0-7803-7731-1. - Low-Cost Microfilter for Red Blood Cell Membrane Stiffness Measurement Using Photosensitive BCB
P. Turmezei; A. Polyakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
In Transducers,
Boston, Massachuesetts, USA, pp. 107-110, Jun. 2003. ISBN 0-7803-7731-1.
document - Single-crystalline Si TFTs fabricated by the µ-Czochralski (grain-filter) process
Y. Hiroshima; R. Ishihara; V. Rana; D. Abe; S. Inoue; T. DShimoda; J.W. Metselaar; C.I.M. Beenakker;
In 2003 Int. Workshop on Active-Matrix Liquid-Crystal Displays,
Tokyo, Japan, pp. 157-158, Jul. 2003.
document - Dependence of single-crystalline Si TFT characteristics on the channel position in a location-controlled grain
V. Rana; R. Ishihara; Y. Hiroshima; D. Abe; S. Higashi; S. Inoue; T. Shimoda; J.W. Metselaar;
In 2003 Int. Workshop on Active-Matrix Liquid-Crystal Displays - TFT Technologies and Related Materials,
Tokyo, pp. 17-20, Jul. 2003.
document - Shell Type Micromechanical Oscillator, Smart Sensors, Actuators, and MEMS
Maxim Zalalutdinov; Keith L. Aubin; Christopher Michael; Robert B.Reichenbach; Tuncay Alan; Alan T. Zehnder; Brian H. Houston; Jeevak M. Parpia; Harold G. Craighead;
In Proc. SPIE,
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document - Hopf Bifurcation in a Disk-Shaped NEMS
Maxim Zalalutdinov; Jeevak Parpia; Keith Aubin; Harold Craighead; Tuncay Alan; Alan Zehnder; R. Richard;
In Proceedings of the 2003 ASME Design Engineering Technical Conferences,
Chicago, IL, 2003. - Using PDMS microtransfer molding (uTM) for polymer flip chip
C. K. Y. Wong; O. C. T. Cheung; B. Xu; M. M. F. Yuen;
In Proceedings - Electronic Components and Technology Conference,
New Orleans LA, pp. 652-657, 2003. - Role of charged defects in the light-induced degradation of single junction a-Si:H solar cells
M. Zeman; V. Nadazdy; R.A.C.M.M. van Swaaij; J. W. Metselaar;
In Proceedings of the 3rd World Conference on Photovoltaic Energy Conversion,
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document - Technological approaches for fabrication of elastomer based spatial light modulators
S. Sakarya; G. Vdovin; P.M. Sarro;
In Proc. SPIE,
pp. 279-286, 2003. ISSN 0277-786X. - Race-free CMOS pass-gate charge recycling logic (FCPCL) for low power applications
A. Abbasian; S.H. Rasouli; J. Derakhshandeh; A. Afzali-Kusha; M. Nourani;
In Proceeding of the 2003 south west symposium on mixed signal design,
Las Vegas, USA, pp. 87-89, Feb. 2003. - Through-Wafer Electrical Vias for RF Silicon technology
Z. Wang; L. Wang; H. Schellevis; W. Wien; J.N. Burghartz; P.M. Sarro;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 761-765, Nov. 2003. ISBN 90-73461-39-1. - Dynamic behavior of polycrystalline and single grain silicon TFTs
P. Migliorato; F. Yan; S. Inoue; T. Shimoda; R. Ishihara;
In Proc. 10th International Display Workshop,
Fukuoka, Japan, Dec. 2003. - Analysis and Optimization of Via-Connected Spiral Inductors in RF Silicon Technology
S.M. Sinaga; M. Bartek; J.N. Burghartz;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 757-760, Nov. 2003. ISBN 90-73461-39-1.
document - Extended Mextram Model To Wide Frequency Range
H.-C. Wu; S. Mijalkovic; J.N. Burghartz;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 668-671, Nov. 2003. ISBN 90-73461-39-1.
document - Characterization of Front- to Backwafer Alignment and Bulk Micromachining Using Electrical Overlay Test Structures
H.W. van Zeijl; J. Slabbekoorn;
In Proc. SPIE, Smart Sensors, Actuators and MEMS,
pp. 617-626, May 2003. - Thermal Impedance Extraction and Modeling for Different Silicon-on-Glass BJT Designs
A. Rossi; V. Moschiano; F. Tamigi; N. Nenadovic; L.K. Nanver; J.W. Slotboom;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 643-647, Nov. 2003. ISBN 90-73461-39-1. - A Wideband Distributed Silicon Driver for 10 Gb/s External Modulators
F.M. De Paola; L.C.N. de Vreede; N. Rinaldi; J.N. Burghartz;
In Proc. ProRISC 2003,
Veldhoven, The Netherlands, pp. 186-189, Nov. 2003. ISBN 90-73461-39-1.
document - Thermal Management of Silicon-On-Glass MOS Field-Effect Transistors for RF-Power Applications
A. Griffo; N. Nenadovic; V. Cuoco; L.K. Nanver; J.W. Slotboom;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 1-8, Nov. 2003. ISBN 90-73461-39-1. - Experimental results of a three-terminal optical modulator based on a BMFET device
A. Irace; G. Breglio; M. Tordi; G. Coppola; C.R. de Boer; P.M. Sarro;
In Proc. of SPIE,
Brugge, Belgium, pp. 125-132, Oct. 2003. ISSN 0277-786X.
document - Folded-Patch Chip-Size Antennas for Wireless Microsystems using Wafer-Level Chip-Scale Packaging
P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
In Proc. MME 2003,
Delft, The Netherlands, pp. 77-80, Nov. 2003. ISBN 90-808266-1-8.
document - Liquid crystal wavefront corrector with modal response
M. Loktev; G. Vdovin; P.M. Sarro;
In Proc. Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 598-599, Sep. 2003. - Wafer thinning for high-density, through-wafer interconnects
L. Wang; C.C.G. Visser; C.R. de Boer; M. Laros; W. van der Vlist; J. Groeneweg; G. Craciun; P.M. Sarro;
In Proc. of SPIE,
San Jose, CA, pp. 532-539, Jan. 2003. ISSN 0277-786X.
document - Fabrication of a microfluidic chip for PCR applications
M. Bu; B. Husband; T. Melvin; G. ensell; N.P. Pham; P.M. Sarro; J.S. Wilkinson; A.G.R. Evans;
In Proc. MME 2003,
Delft, The Netherlands, pp. 119-122, Nov. 2003. ISBN 90-808266-1-8.
document - Efficiency Improvement of a Chip-Size Antenna for Wireless Microsystems
P.M. Mendes; D.A. Duraes; M. Bartek; J.H. Correia;
In Proc. Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 725-726, Sep. 2003. - A model for film thickness using direct spray coating
N.P. Pham; J.N. Burghartz; P.M. Sarro;
In Proc. IEEE EPTC conference,
Singapore, Dec. 2003.
document - Metal patterning on high topography surface for 3-D RF devices fabrication
N.P. Pham; E. Boellaard; W. Wien; L.D.M. van den Brekel; J.N. Burghartz; P.M. Sarro;
In Proc. Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 440-443, Sep. 2003. - Microfluidic device constructed from photosensitive BCB for erythrocyte membrane deformability measurement
P. Turmezei; A. Polyakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
In Proc. Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 193-196, Sep. 2003. - Thermal Instability in Two-Finger Bipolar Transistors
N.Nenadovic; V.dAlessandro; F. Tamigi; A. Rossi; A. Griffo; L.K. Nanver; J.W. Slotboom;
In J. Franca; P. Freitas (Ed.), Proc. ESSDERC 2003,
Estoril, Portugal, pp. 203-206, Sep. 2003. ISBN 0-7803-7999-3. - C-V Characterization of MOS Capacitors on High Resistivity Silicon Substrate
B. Rong; L.K. Nanver; J.N. Burghartz; A.B.M. Jansman; A.G.R. Evans; B. Rejaei;
In J. Franca; P. Freitas (Ed.), Proc. ESSDERC 2003,
Estoril, Portugal, pp. 489-492, Sep. 2003. ISBN 0-7803-7999-3. - Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages
A. Polyakov; P.M. Mendes; S.M. Sinaga; M. Bartek; B. Rejaei; J.H. Correia; J.N. Burghartz;
In Proc. 53rd Electronic Components and Technology Conference,
New Orleans, Louisiana, USA, pp. 875-880, May 2003. ISBN 0-7803-7430-4.
document - High-performance TFTs fabricated inside a location-controlled grain by µ-Czochralski (grain-filter) process
V. Rana; R. Ishihara; Y. Hiroshima; D. Abe; S. Higashi; S. Inoue; T. Shimoda; J.W. Metselaar; C.I.M. Beenakker;
In Proc. 3rd International Meeting on Information Display,
Deagu, Korea, pp. 1-4, Jul. 2003.
document - Design and Analysis of a 6 GHz Chip Antenna on Glass Substrates for Integration with RF/Wireless Microsystems
P.M. Mendes; J. H. Correia; M. Bartek; J.N. Burghartz;
In Proc. 2003 IEEE AP-S,
Columbus, Ohio, USA, pp. 667-670, Jun. 2003. ISBN 0-7803-7846-6.
document - Electrical characterization of silicon diodes formed by laser annealing of implanted dopants
L.K. Nanver; J. Slabbekoorn; A. Burtsev; T.L.M. Scholtes; R. Surdeanu; F. Simon; H.J. Kalhert; J.W. Slotboom;
In Proc. 203rd ECS,
Paris, France, pp. 119-130, Apr. 2003. ISBN 1-56677-396-2.
document - Area-Selective Adhesive Bonding Using Photosensitive BCB for WLCSP Applications
A. Polyakov; M. Bartek; J.N. Burghartz;
In Polytronic 2003, 3rd International IEEE Conference on Polymers and Adhesives Microelectronics and Photonics,
Montreux, Switzerland, Lab. TIMA, France, Oct. 2003. ISBN 2-84813-023.
document - Integrated optical refractometer based on rib-ARROW waveguide
R. Bernini; S. Campopiano; L.Zeni; P.M. Sarro;
In Proc Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 139-142, Sep. 2003.
document - High Aspect Ratio through-Wafer Interconnections for 3D-Microsystems
L. Wang; A. Nichelatti; H. Schellevis; C. de Boer; C. Visser; T.N. Nguyen; P.M. Sarro;
In Proc. 16th IEEE International MEMS conference,
Kyoto, Japan, pp. 634-637, Jan. 2003.
document - Simulations of buffer layers in a-Si:H thin-film solar cells deposited with an expanding thermal plasma
A.M.H.N. Petit; M. Zeman; R.A.C.M.M. van Swaaij; M.C.M. van de Sanden;
In MRS,
San Francisco, USA, Apr. 2003.
document - On-Chip Isolation in Wafer-Level Chip-Scale Packages: Substrate Thinning and Circuit Partitioning by Trenches
S.M. Sinaga; A. Polyakov; M. Bartek; J.N. Burghartz;
In IMAPS 2003,
Boston, USA, IMAPS, pp. 768-773, Nov. 2003. ISBN 0-930815-71-8. - Field Aided Germanium Induced Crystallization of Silicon on glass
J. Derakhshandeh,��S. Mohajerzadeh; N. Golshani; M.D.Robertson;
In MRS,
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document - A physically based analytical model of the collector charge of III-V heterojunction bipolar transistors
R. van der Toorn; J.C.J. Paasschens; R.J. Havens and;
In Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2003. 25th Annual 2003. IEEE 2003,
pp. 111-114, 2003. - Material structure of microcrystalline silicon deposited by an expanding thermal plasma
C. Smit; D. L. Williamson; M. C. M. van de Sanden; R.A.C.M.M. van Swaaij;
In Mater. Res. Soc. Symp. Proc.,
pp. 527, 2003. - Design of a Folded-Patch Chip-Size Antenna for Short-Range Communications
P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J. H. Correia;
In European microwave conference 2003,
Munich, Germany, pp. 723-726, Oct. 2003. ISBN 1-58053-839-8. - Low-loss passives for 2nd-harmonic termination control in power amplifiers for mobile applications
M. Spirito; L.C.N. de Vreede; L.K. Nanver; J. Mueller; J.N. Burghartz;
In 4th Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems,
Garmisch, Southern Germany, pp. 49-52, Apr. 2003. - Simulation of buffer layers in a-Si:H thin film solar cells deposited with and expanding thermal plasma
A. M. H. N. Petit; M. Zeman; R.A.C.M.M. van Swaaij; M. C. M. van de Sanden;
In Mater. Res. Soc. Symp. Proc.,
pp. 369, 2003. - Extraction of Glass-Wafers Electrical Properties Based on S-Parameters Measurements of Coplanar Waveguides
P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J. H. Correia;
In ConfTele 2003,
Aveiro, Portugal, Instituto de Telecom, pp. 51-54, Jun. 2003. ISBN 972-98368-2-5. - A 2 GHz high-gain differential InGaP HBT driver amplifier matched for high IP3
M.P. van der Heijden; M. Spirito; L.C.N. de Vreede; F. van Straten; J.N. Burghartz;
In 2003 IEEE MTT-S International Microwave Symposium,
Philadelphia, PA, USA, pp. 235 -238, Jun. 2003. - Assessment of ferromagnetic integrated inductors for Si-technology
B. Rejaei; M. Vroubel; Y. Zhuang; J.N. Burghartz;
In 4th Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems,
Garmisch, Southern Germany, pp. 100-103, Apr. 2003. - A Calibration Procedure for On-Wafer Differential Load-Pull Measurements
M. Spirito; M.P. van der Heijden; M. de Kok; L.C.N. de Vreede;
In 61st ARFTG,
Philadelphia, Pennsylvania, USA, Jun. 2003. - Design and characterization of integrated passive elements on high ohmic silicon
E. Valletta; J. van Beek; A. Den Dekker; N. Pulsford; H.F.F. Jos; L.C.N. de Vreede; L.K. Nanver; J.N. Burghartz;
In 2003 IEEE MTT-S International Microwave Symposium,
Philadelphia, PA, USA, pp. 1235 -1238, Jun. 2003. - Mixed Compact and Behavior Modeling Using AHDL Verilog-A
H.-C. Wu; S. Mijalkovic; J.G. Macias; J.N. Burghartz;
In 2003 IEEE International Workshop on Behavioral Modeling and Simulation (BMAS 2003),
San Jose, CA, USA, pp. 139-143, Oct. 2003. - Characterization of Anisotropic Conductive Adhesives
P. Iyer; P. Baumgaertner; D. Farley; A. Dasgupta;
In ASME International Mechanical Engineering Congress and RD&D Expo,
Washington, DC, USA, 2003. - Extraction and Modeling of Self-Heating and Mutual Thermal Coupling Impedance of Bipolar Transistors
N. Nenadovic; S. Mijalkovic; L.K. Nanver; Vandamme; H. Schellevis; V. Alessandro; J. W. Slotboom;
In 2003 BCTM,
Toulouse, France, Sep. 2003. - The Shrinking Bipolar Transistor
J.W. Slotboom;
In 2003 BCTM,
Toulouse, France, Sep. 2003. - Design and Tolerance Analysis of a 5.7 GHz Chip-Size Microstrip Antenna on High Resistivity Silicon
P.M. Mendes; J. H. Correia; M. Bartek; J.N. Burghartz;
In 2003 IEEE AP-S,
Columbus, Ohio, USA, Jun. 2003. - Stress-assisted Nickel-Induced Crystallization of Silicon on Glass
P. Hashemi; A. Khajooeizadeh; S. Mohajerzadeh; J. Derakhshandeh; M. Robertson; J.C. Bennett;
In 11th Canadian Semiconductor Technology Conference (CSTC),
Ottawa, Canada, Aug. 2003. - A High Performance Unilateral 900 MHz LNA with Simultaneous Noise, Impedance, and IP3 Match
M.P. van der Heijden; L.C.N. de Vreede; F. van Straten; J.N. Burghartz;
In 2003 BCTM,
Toulouse, France, Sep. 2003. - The ASCA simulation program: Integrated optical and electrical modeling of thin-film Si devices
B.E. Pieters; M. Zeman; J.W. Metselaar;
In 2nd aSiNet workshop,
Lisbon, Portugal, Feb. 2003. - Thin-film silicon solar cells
M. Zeman;
In 13th Conference of Slovak Physical Society,
Smolenice, Slovakia, Aug. 2003. - Evolution of charged gap states in a-Si:H under light exposure
M. Zeman; V. Nadazdy; R.A.C.M.M. van Swaaij; R. Durny; J. W. Metselaar;
In Mater. Res. Soc. Symp. Proc.,
San Francisco, USA, pp. 39, Apr. 2003. - Integrated Chip-Size Antenna for Wireless Microsystems: Fabrication and Design Considerations
P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
In Proc. Eurosensors XVII,
University of Minho, Guimaraes, Portugal, pp. 438-439, Sep. 2003. ISBN 90-73461-39-1. - High Performance P-Channel Single-Crystalline Si TFTs Fabricated Inside a Location-Controlled Grain by mu-Czochralski Process
V. Rana; R. Ishihara; Y. Hiroshima; D. Abe; S. Inoue; T. Shimoda; J.W. Metselaar; C. I.M. Beenakker;
In Proc. SAFE 2003,
Veldhoven, The Netherlands, pp. 639-642, Nov. 2003. ISBN 90-73461-39-1.
document - Formation of crystalline-silicon islands for thin-film transistors by excimer-laser-induced lateral growth
P.C. van der Wilt;
PhD thesis, Delft University of Technology, Jan. 2003. ISBN 90-6464-066-1; Promotor: prof. C.I.M. Beenakker. - Modeling and Characterization of RF Power Bipolar Transistors
R.Tinti;
PhD thesis, Delft University of Technology, Feb. 2003. ISBN 90-9016621-1; Promotors: prof. J.W. Slotboom, prof. J.L. Tauritz, dr. H. de Graaff. - Location-controlled large Si islands by excimer-laser annealing on glass substrate
A.A. Burtsev;
PhD thesis, Delft University of Technology, Oct. 2003. ISBN 90-6734-019-7; Promotor: prof. C.I.M. Beenakker. - Silicon micromachining for RF technology
P.N. Pham;
PhD thesis, Delft University of Technology, May 2003. ISBN 90-6734-235-1; Promotors: prof. J.N. Burghartz, P.M. Sarro. - Investigation of Microstrips with NiFe Magnetic Thin Film (II): Modelling
M. Vroubel; Y. Zhuang; B. Rejaei; J.N. Burghartz;
Transactions of The Magnetic Society of Japan,
Volume 2, Issue 5, pp. 371-376, Dec. 2002. - Properties of semiconductor surfaces covered with very thin insulating overlayers prepared by impacts of low-energy particles
E. Pincic; H. Gleskovic; J. Mllerovic; V. Nadazdy; S. Mric; L. Ortega; M. Jergel; C. Falcony; R. Brunner; K. Gmucovic; M. Zeman; R.A.C.M.M. van Swaaij; M. Kucera; R. Juric; M. Zahoran;
Vacuum,
Volume 67, 131 (2002), 2002. - Technology of reflective membranes for spatial light modulators
S. Sakarya; G. Vdovin; P.M. Sarro;
Sensors and Actuators A,
Volume 97-98, pp. 468-472, Apr. 2002. - Investigation of Microstrips with NiFe Magnetic Thin Film (I): Experiment
Y. Zhuang. M. Vroubel; B. Rejaei; E. Boellaard; J.N. Burghartz;
Transactions of The Magnetic Society of Japan,
Volume 2, Issue 5, pp. 367-370, Dec. 2002. - Correlation between the results of charge deep-level transient spectroscopy and ESR techniques for undoped hydrogenated amorphous silicon
V. N�dazdy; R. Durn_; I. Thurzo; E. Pinc�k; A. Nishida; J. Shimizu; M. Kumeda; T. Shimizu;
Physical Review B,
Volume 66, Issue 19, pp. 195211/1-195211, 2002. ISSN 0163-1829. - Silicon thin-film UV filter for NADH fluorescence analysis
V.P. Iordanov; G.W. Lubking; R. R. IshiharaF. Wolffenbuttel; P.M. Sarro; M.J. Vellekoop;
Sensors and Actuators A,
Volume 97-98, pp. 161-166, Apr. 2002. - Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging
A. Polyakov; M. Bartek; J.N. Burghartz;
Microelectronics Reliability,
Volume 42, Issue 9-11, pp. 1783-1788, 2002. ISSN 0026-2714. - X-ray spectroscopy with a Multi-anode Sawtooth Silicon Drift Detector: the diffusion process
J. Sonsky; R.W.Hollander; P.M. Sarro; C.W.E. van Eijk;
Nucl. Instr. and Meth. A,
Volume 477, pp. 93-98, 2002. ISSN 0168-9002. - Current Assisted Germanium Induced Crystallization of amorphous silicon on glass
J. Derakhshandeh; N. Golshani; S. Mohajerzadeh;
Journal of Thin Solid Films,
2002. - Through-wafer copper electroplating for 3-D interconnects
N.T. Nguyen; E. Boellaard; N.P. Pham; V.G. Kutchoukov; G. Craciun; P.M. Sarro;
Journal of Micromechanics and Microengineering,
Volume 12, Issue 4, pp. 395-399, Jul. 2002. ISSN 0960-1317. - Substrate effects in monolithic RF transformers on silicon
K.T. Ng; B. Rejaei; J.N. Burghartz;
IEEE Transactions on Microwave Theory and Techniques,
Volume 50, Issue 1, pp. 377-383, Jan. 2002. - Structural characterization of highly boron doped SiGe/Si heterostructures
J.F. Woitok; C.C.G. Visser; T.L.M. Scholtes;
Materials Science and Engineering B,
Volume 89, Issue 1-3, pp. 216-220, Feb. 2002. ISSN 0921-5107. - Optical modeling of a-Si:H solar cells deposited on textured glass/SnO2 substrates
J. Krc; M. Zeman; F. Smole; M. Topic;
Journal of Applied Physics,
Volume 92, Issue 2, pp. 749-755, Jul. 2002. - Fast deposition of microcrystalline silicon with an expanding thermal plasma
C. E. Smit.A.G. Hamers; B.A. Korevaar; R.A.C.M.M. van Swaaij; M.C.M. van de Sanden;
J. Non-Cryst. Solids,
Volume 299, pp. 98, 2002. - Photo carrier generation in bipolar transistors
J.H. Klootwijk; J.W. Slotboom; M.S. Peter; V. Zieren; D.B. de Mooy;
IEEE Trans. on Electron Devices,
Volume 49, Issue 9, pp. 1628-1631, Sept. 2002. - Theory and design of an ultra-linear square-law approximated LDMOS power amplifier in class-AB operation
M.P van der Heijden; H.C. de Graaff; L.C.N. de Vreede; J.R. Gajadharsing; J.N. Burghartz;
IEEE Trans. Microwave Theory and Techniques,
Volume 50, Issue 9, pp. 2176-2184, Sep. 2002. - A novel frequency-independent third-order intermodulation distortion cancellation technique for BJT amplifiers
M.P. van der Heijden; H.C. de Graaff; L.C.N. de Vreede;
IEEE Journal of Solid-State Circuits,
Volume 37, Issue 9, pp. 1176-1183, Sep. 2002. ISSN 0018-9200. - GHz Band-Stop Microstrip Filter Using Patterned Ni78Fe22 Ferromagnetic Film
Y. Zhuang; B. Rejaei; E. Boellaard; M. Vroubel; J.N. Burghartz;
IEEE Microwave and Wireless Components Letters,
Volume 12, Issue 12, pp. 473-475, Dec. 2002. - Gain and Threshold-Current Calculation of V-Groove Quantum-Wire InGaAs-InP Laser
D. M. Gvozdic; N. M. Nenadovic; A. Schlachetzki;
IEEE Journal of Quantum Electronics,
Volume 38, Issue 12, pp. 1565-1579, Dec. 2002. - A Single-Chip CMOS Optical Microspectrometer with Light-to-Frequency Converter and Bus Interface
J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
IEEE Journal of Solid-State Circuits,
Volume 37, Issue 10, pp. 1344-1347, Oct. 2002. ISSN 0018-9200. - Through-silicon-chip transmission lines
K.T. Ng; E. Boellaard; N.P. Pham; J.N. Burghartz;
Electronics Letters,
Volume 38, Issue 13, pp. 640-641, Jun. 2002. - Fabrication of a glass-implemented microcapillary electrophoresis device with integrated contactless conductivity detection
A. Berthold; F. Laugere; H. Schellevis; C.R. de Boer; M. Laros; R.M. Guijt; P.M. Sarro; M.J. Vellekoop;
Electrophoresis,
Volume 23, Issue 20, pp. 3511-3519, Oct. 2002. ISSN 0173-0835. - Ferromagnetic RF Inductors and Transformers for Standard CMOS/BiCMOS
Y. Zhuang; M. Vroubel; B. Rejaei; J. Burghartz;
In IEDM 2002,
San Francisco, CA, USA, pp. 18.06/1-18.06/4, Dec. 2002. ISBN 0-7803-7463-0. - Energy Density Window for Location-Controlled Si Grains by Dual-Beam Excimer-Laser
A. Burtsev; R. Ishihara; C. I. M. Beenakker;
In Thin Solid Films,
pp. 199-206, Nov. 2002. ISSN 0040-6090. - Agile beams and micromachined membrane deformable mirrors
G. Vdovin; P.M. Sarro;
In The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society (LEOS 2002),
pp. 576-577, 2002. ISBN 0-7803-7500-9. - Single-Crystalline Si Thin-Film Transistors Fabricated with mu-Czochralski (Grain-Filter) Process
R. Ishihara; P.Ch. van der Wilt; B.D. van Dijk; A. Burtsev; J.W. Metselaar; C.I.M. Beenakker;
In M. Matsumura (Ed.), Tech Dig. 2002 Intern. Workshop on Active-Matrix LCDs - TFT Technologies and Rel. Materials,
Tokyo, Japan, pp. 53-56, Jul. 2002 2002. - Saddle Add-On Metallisation (SAM) for RF Inductor Implementation in Standard IC Interconnects
B. Rejaei; J. Burghartz; H. Schellevis;
In IEDM 2002,
San Francisco, CA, USA, pp. 18.04/1-18.04/4, Dec. 2002. ISBN 0-7803-7463-0. - Analysis of Light Scattering in a-Si:H-based Solar Cells with Rough Interfaces
J. Krc; M. Zeman; F. Smole; J.W. Metselaar; M. Topic;
In Solar Energy Materials and Solar Cells,
pp. 401-406, Oct. 2002. ISSN 0927-0248. - New Trends in Thin Film Silicon Solar Cell Technology
M. Zeman;
In Proc. 4th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM 2002),
Smolenice Castle, Slovakia, pp. 353-362, Oct. 2002. ISBN 0-7803-7276-X. - Self-adjustment of optical interconnects using in-package MEMS-based actuators
K.J. van Nielen; W.J. Venstra; M. Tichem; M. Laros; P.M. Sarro; B. Karpuschewski;
In J. Saneistr; P. Ripka (Ed.), Proceedings Eurosensors XVI,
Prague, Czech Republic, Czech Technical University, pp. 794-797, Sep. 2002. - High Performance P-Channel Single-Crystalline Si Thin Film Transistors
V. Rana; R. Ishihara;
In SAFE 2002,
Veldhoven, The Netherlands, pp. 35, Nov. 2002. ISBN 90-73461-32-4. - Development of a silicon-based modal liquid crystal wavefront corrector
M.Y. Loktev; G.V. Vdovin; P.M. Sarro;
In Proc. SPIE: Photonics, Devices, and Sytems II,
Prague, Czech Republic, pp. 558-564, May 2002. - CV doping profiling of boron out-diffusion using an abrupt and highly doped arsenic buried epilayer
C.J. Ortiz; L.K. Nanver; W.D van Noort; T.L.M. Scholtes; J.W Slotboom;
In Proc. 2002 International Conference on Microelectronic Test Structures (ICMTS 2002),
Cork, Ireland, pp. 83-88, Apr. 2002. ISBN 0-7803-7464-9. - Substrate Options and Add-On Process Modules for Monolithic RF Silicon Technology
J.N. Burghartz; M. Bartek; B. Rejaei; P.M. Sarro; A. Polyakov; N.P. Pham; E. Boullaard; K.T. Ng;
In Proc. 2002 Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2002),
Monterey, CA, pp. 17-23, Sept. 2002. ISBN 0-7803-7562-9. - Characterization of Front to Backwafer Bulk Micromachining using Electrical Overlay Test Structures
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Solid-State Electronics,
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Physical Review B,
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Sensors and Actuators A,
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Volume 82, Issue 1-3, pp. 224-228, 2000. - Design and fabrication of infrared detector arrays for satellite attitude control
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Volume 83, pp. 101-108, 2000. - Single-chip CMOS optical microspectrometer
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Physical Review B,
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Semiconductors,
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Nuclear Instruments and Methods Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
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Physica B,,
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IEEE Trans. on Nuclear Science,
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Sensors and Actuators,
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Phys. Rev. B,
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Nature,
Volume 400, pp. 735-737, Aug. 1999. - The Role of Front and Back Contact Roughness in the Performance Enhancement of Single Junction a-Si:H Solar Cells
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Volume 10, pp. 215, 1999. - Strain relaxation in periodic arrays of Si/SiGe quantum wires determined by coplanar high resolution x-ray diffraction and grazing incidence diffraction
Y. Zhuang; V. Holy; J. Stangl; A.A. Darhuber; P. Mikulik; S. Zerlauth; F. Schaffler; G. Bauer; N. Darowski; D. L�bbert; U. Pietsch;
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IEEE Transactions on Electron Devices,
Volume 46, Issue 10, pp. 2086-2092, Oct. 1999. ISSN 0018-9383. - CdTe epitaxial layers in ZnSe-based heterostructures
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Journal of Crystal Growth,
Volume 201, pp. 465, 1999. - Technology and applications of micromachined adaptive mirrors
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IEEE Transactions on Electron Devices,
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Volume 46, Issue 3, pp. 271-274, 1999. ISSN 0018-9499. - Thin photodiodes for a scintillator-silicon well detector
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IEEE Trans. on Nuclear Science,
Volume 46, Issue 6, pp. 1948-1951, 1999. - Investigation of periodicity fluctuations in strained (GaNAs)1/(GaAs)m superlattices by the kinematical simulation of X-ray diffraction
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Nederlandse Octrooiaanvraag nr. 1013790, Dec 1999. - Integrated Circuit Inductor
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Physical Review B,
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In Proceedings of the Symposium on Radio Frequency Integrated Circuits (RFIC),
pp. 19-22, 1997. - Silicon RF Technology - The Two Generic Approaches
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In Proceedings of the European Solid-State Device Research Conference (ESSDERC),
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In Proceedings of the 27th ESSDERC,
Stuttgart, Germany, pp. 450-453, Sept. 1997. - Deposition of thin film-silicon by thermal CVD processes for application in solar cells
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In Proceedings of the 14th European Photovoltaic Solar Energy Conference and Exhibition,
Barcelona, pp. 1440-1443, Jun. 1997. - MAIDS: A microwave active integral device simulator
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In Proceedings of the 27th ESSDERC,
Stuttgart, Germany, pp. 108-111, Sept. 1997. - Silicon thermooptic micromodulators for low-cost low-performance fiber-in-the-loop applications
G. Cocorullo; F.G. Della Corte; I. Rendina; P.M. Sarro;
In Proc.SPIE Integrated Optic Devices '97 Symposium,
San Jose, California, USA, SPIE, pp. 312-337, 1997. - Computer modelling of a-Si:H alloy tandem cells: determination of current matching with light scattering
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In Proceedings of the 14th European Photovoltaic Solar Energy Conference and Exhibition,
Barcelona, pp. 586-589, Jun. 1997. - Fabrication of Geiger mode Avalanche Photodiodes
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In Proc. of the Nuclear Methods and Physics 1997. Nuclear Methods and Physics 1997,
Austin, Sep. 1997. - Low stress PECVD thin film SiC for IC compatible microstructures
P.M. Sarro; C.R. de Boer; M. Laros; E. Korkmaz;
In Proc. Eurosensors '97 Conf.,
Warsaw, Poland, pp. 920-932, Sep. 1997. - Temperature dependence and drift of a thermal accelerometer
U.A. Dauderstadt; P.M. Sarro; S. Middelhoek;
In Proc. 9th Int. Conf. Solid-State Transducers,
Chicago, USA, pp. 1209-1212, Jun. 1997. - Development of a 128 channel silicon drift detector for spectroscopic purposes
H. Valk; J. Huizenga; C.W. van Eijk; R.W.Hollander; L.K. Nanver; P.M. Sarro; A. van den Bogaard;
In Proc. 4th International Conference on Position-Sensitive Detectors,
Manchester, UK, pp. 169-172, Sept. 1997. - Two-dimensional location confinement of crystal Si grain followed by excimer-laser melting of Si thin films
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In International Conference on Advanced Materials and European Materials Research Society Spring Meeting,
Strasbourg, Jun. 1997. - Temperature Analysis and On-Chip Compensation for an UHF VCO
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In IEEE RFIC Symposium Digest,
Denver, pp. 229-232, Jun. 1997. - Electronic effects of ion damage in hydrogenated amorphous silicon alloys
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In Chelsea Meeting on Amorphous Semiconductors,
London, UK, Apr. 1997. - Temperature Analysis and On-Chip Compensation for an UHF VCO
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In IEEE MTT-S Digest,
Denver, pp. 757-760, Jun. 1997. - Dual-beam excimer-laser irradiation of a-Si film on glass substrate
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In Ext. Abstr. 1997, Int. Conference on Solid State Devices and Materials,
Hamamatsu, pp. 360-365, 1997. - Thermal resistance modelling of RF high power bipolar transistors
K. Mouthaan; R. Tinti; A. Arno; H.C. de Graaff; J.L. Tauritz; J. Slotboom;
In ESSDERC 97,
Stuttgart, pp. 184-187, Sep. 1997. - A 4 b 8 GSample/s A/D Converter in SiGe Bipolar Technology
P. Xiao; K.A. Jenkins; M. Soyuer; H.A. Ainspan; J.N. Burghartz; H. Shin; M. Dolan; D.L. Harame;
In IEEE International Solid-State Circuits Conference (ISSCC),
pp. 124-125, 1997. - Microwave modelling and measurement of the self- and mutual inductance of coupled bondwires
K. Mouthaan; R. Tinti; M. de Kok; H.C. de Graaff; J.L. Tauritz; J.W. Slotboom;
In Proc. Bipolar/BiCMOS Circuits and Technology Meeting,
Minneapolis, USA, pp. 166-169, Sep. 1997. - Modelling of a-Si:H alloy solar cells on textured substrates
M. Zeman; J.H. van den Berg; L.L.A. Vosteen; J.A. Willemen; J.W. Metselaar; R.E.I. Schropp;
In S.Wagner et al.), MRS Proceedings 467, Spring Meeting (Ed.), Amorphous Silicon Technology-1997,
San Francisco, pp. 671-680, Mar.Apr. 1997. - Structural and photoelectric studies on double barrier quantum well infrared detectors
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In 1997 IEEE Hong Kong Electron Devices Meeting,
1997. - Fabrication of Geiger mode Avalanche Photodiodes
W.J. Kindt; H.W. van Zeijl;
In 1997 IEEE Nuclear Science Symposium and Medical Imaging Conference,
Albuquerque, New Mexico, USA, Nov. 1997. - State-of-the-Art in Compact Modelling with Emphasis on Bipolar RF Circuit Design
H.C. de Graaff;
In ESSDERC 97,
Stuttgart, pp. 14-23, Sep. 1997. - 2~3 Ghz Silicon MMIC Balanced Oscillators Using On-chip Active Resonators
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In 27th European Microwave Conference,
Jerusalem, pp. 749-754, Sep. 1997. - Two-Level Spiral Inductor Structure Having a High Inductance to Area Ratio
Joachim N. Burghartz; Keith A. Jenkins; Saila Ponnapalli; Mehmet Soyuer;
Patent No. US 5,656,849, Aug 1997. - Geometry, Angular Momentum and the Intrinsic Drift of Oceanic Monopolar Vortices
Ramses van der Toorn;
PhD thesis, Nederlands Instituut voor Onderzoek der Zee, Texel / Faculteit Natuur- en Sterrenkunde, Universiteit Utrecht, 1997. - Ultrafast interstitial injection during transient enhanced diffusion of boron in silicon
H.G.A. Huizing; C.C.G. Visser; N.E.B. Cowern; P.A.Stolk; R.C.M. de Kruif;
Appl. Phys. Lett,
Volume 69, Issue 9, pp. 1211-1213, 1996. - Study of double barrier superlattice by synchrotron radiation and double-crystal x-ray diffraction
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Appl. Phys. Lett.,
Volume 68, Issue 8, pp. 1147, 1996. - Advanced modeling of distortion effects in bipolar transistors using the Mextram model
L.C.N. de Vreede; H.C. de Graaff; Mouthaan; K.; de Kok; M.; J.L. Tauritz; Baets; R.G.F;
J. Solid-State Circuits,
Volume 31, Issue 1, pp. 114-121, Jan. 1996. - Bipolar integrated Kelvin test structure for contact resistance measurement of self-aligned implantations
L.K. Nanver; E.J.G. Goudena; J. Slabbekoorn;
IEEE Trans. on Semiconductor Manufacturing,
Volume 9, Issue 3, pp. 455-460, 1996. - Microwave Inductors and Capacitors in Standard Multilevel Interconnect Silicon Technology
J.N. Burghartz; M. Soyuer; K.A. Jenkins;
IEEE Transactions on Microwave Theory and Techniques,
Volume 44, Issue 1, pp. 100-104, 1996. - Determination of the density of states in amorphous silicon-carbon alloys using a Fourier transformation of transient photocurrent data
P. A. Bayley; J. M. Marshall; C. Main; D. P. Webb; R.A.C.M.M. van Swaaij; J. Bezemer;
J. Non-Cryst. Solids,
Volume 161, 1996. - Identification of Gate Electrode Discontinuities in Submicron CMOS Technologies, and Effect on Circuit Performance
K.A. Jnkins; J.N. Burghartz; P.D. Agnello;
IEEE Transactions on Electron Devices,
Volume 43, Issue 5, pp. 759-765, 1996. - A 3-V 4-GHz nMOS Voltage-Controlled Oscillator with Integrated Resonator -
M. Soyuer; K.A. Jenkins; J.N. Burghartz; M.D. Hulvey;
IEEE Journal of Solid-State Circuits,
Volume 31, Issue 12, pp. 2042-2045, 1996. - A 2.4-GHz Silicon Bipolar Oscillator with Integrated Resonator
M. Soyuer; K.A. Jenkins; J.N. Burghartz; H.A. Ainspan; F.J. Canora; S. Ponnapalli; J.F. Ewen; W.E. Pence;
IEEE Journal of Solid-State Circuits,
Volume 31, Issue 2, pp. 268-270, 1996. - BiCMOS Process Integration and Device Optimization: Basic Concepts and New Trends
J.N. Burghartz;
Electronic Engineering,
Volume 79, pp. 313-327, 1996. - Recombination centers identification in very thin silicon epitaxial layers via lifetime measurements
S. Daliento; A. Sanseverino; P. Spirito; P.M. Sarro; L. Zeni;
IEEE Electr. De van Lett,
Volume 17, Issue 3, pp. 148-150, 1996. - Multi-Level Spiral Inductors Using VLSI Interconnect Technology
J.N. Burghartz; K.A. Jenkins; M. Soyuer;
IEEE Electron Device Letters,
Volume 17, Issue 9, pp. 428-430, 1996. - Plasma_enhanced chemical vapor deposition of thick silicon nitride films with low stress on InP
L. Shi; C. A. M. Steenbergen; A. H. de Vreede; M. K. Smit; T. L. M. Scholtes; F. H. Groen; J. W. Pedersen;
J. Vac. Sci. Technol. A,
Volume 14, pp. 471, 1996. - Ultra fast interstitial injection during transient enhanced boron diffusion in silicon
H.G. A. Huizing; C.C.G. Visser; N.E.B. Cowern; P.A. Stolk; R.C.M. de Kruif;
Appl. Phys. Letters,
Volume 68, pp. 409-411, 1996. - Collective transport through charge-density-wave heterostructures
B. Rejaei; G.E.W. Bauer;
Phys. Re. B,
Volume 54, pp. 8487-8490, 1996. - Equivalence of the transmission-eigenvalue density in supersymmetric and scaling theories of disordered wires without time-reversal symmetry
B. Rejaei;
Phys. Re. B,
Volume 53, pp. R13235-R13238, 1996. - LPCVD silicon-rich silicon nitride films for applications in micromechanics, studied with statistical experimental design
Gardeniers; H.A.C. Tilmans; C.C.G. Visser;
J. Vac. Sci. Technol. A,
Volume 14, Issue 5, pp. 2879-2892, 1996. - De ontlading van een fotogeleider
R.A.C.M. van Swaaij;
Ned. Tijdschr. v. Natuurkunde,
Volume 62, Issue 5, pp. 77, 1996. - Electrical and optical properties of plasma-deposited a-SiGe:H alloys: Role of growth temperature and postgrowth anneal
V.I. Kuznetsov; M. Zeman; L.L.A. Vosteen; B.S. Girwar; J.W. Metselaar;
Journal of Applied Physics,
Volume 80, pp. 6496-6504, 1996. - Theory of tunneling conductance of CDW junctions
Yukio Tanaka; Mark I. Visscher; Behzad Rejaei; Gerrit E. W. Bauer;
Physica B: Condensed Matter,
Volume 227, Issue 1-4, pp. 339-341, Sep. 1996. - Silicon three-axial tactile sensor
Z.Chu; P.M. Sarro; S. Middelhoek;
Sensors and Actuators A,
Volume 54, pp. 505-510, 1996. - The PhotoElectroMagnetic Effect in planar silicon structures
J.F. Creemer; S. Middelhoek; P.M. Sarro;
Sensors and Actuators A,
Volume 55, pp. 115-120, 1996. - Low temperature surface passivation for silicon solar cells
C. Leguijt; P. L�lgen; A.R. Burgers; J.A. Eikelboom; A.W. Weeber; F.M. Schuurmans; W.C. Sinke; P.F.A. Alkemade; P.M. Sarro; C.H.M. Mar�e; L.A. Verhoef;
Solar Energy Materials and Solar Cells,
Volume 40 (1996), pp. 297-345, 1996. - A 3x1 integrated pyroelectric sensor based on VDF/TrFE copolymer
D. Setiadi; P.M. Sarro; P.P.L. Regtien;
Sensors and Actuators A,
Volume 52, pp. 103-109, 1996. - Tunneling spectroscopy of mesoscopic charge density wave systems
Yukio Tanaka; Mark I. Visscher; Behzad Rejaei; G.E.W. Bauer;
Solid State Communications, Volume 100, Issue 1,
pp. 37-41, Oct. 1996. - Simulation aspects of a thermal accelerometer
U.A. Dauerstadt; P.H.S. de Vries; R. Hiratsuka; J.G. Korvink; P.M. Sarro; H. Baltes; S. Middelhoek;
Sensors and Actuators A,
Volume 55 (1996), pp. 3-6, 1996. - Suspended membrane inductors and capacitors for application in silicon MMICs
Y. Sun; H.W. van Zeijl; J.L. Tauritz; R.G.F. Baets;
In IEEE 1996 Microwave and Millimeter-wave Monolithic Circuits Symposium,
San Francisco, pp. 99-102, Jun. 1996. - Integrated ultraviolet sensor system with on-chip 1 Gohm Transimpedance Amplifier
D. Bolliger; P. Malcovati; A. Haberli; P.M. Sarro; F. Malobert; H. Baltes;
In ISSC 96 Digest of Technical Papers,
San Francisco, CA, pp. 328-329, Feb. 1996. - Anisotropic etching of silicon in saturated TMAHW solutions for IC-compatible micromachining
P.M. Sarro; S.Brida; C.M.A.Ashruf; W. van d.Vlist; H. van Zeijl;
In Proc. ASDAM '96 Conf.,
Smolenice, Slovakia, pp. 293-296, Oct. 1996. - A LaF3:Nd(10%) scintillator detector with microgap gas chamber read-out for the detection of x- rays
J. van der Marel; V.R. Bom; C.W.E. van Eijk; R.W. Hollander; P.M. Sarro;
In Proc. 4th International Conference on Position-Sensitive Detectors,
Manchester, UK, Sept. 1996. - RF Components Implemented in an Analog SiGe Bipolar Technology
J.N. Burghartz; M. Soyuer; K.A. Jenkins; M. Kies; P. Dolan; K. Stein; J. Malinowski; D.L. Harame;
In Proc. Bipolar/BiCMOS Circuit and Technology Meeting (BCTM),
pp. 138-141, 1996. - An 11-GHz 3-V SiGe Voltage-Controlled Oscillator with integrated Resonator
M. Soyuer; J.N. Burghartz; H.A. Ainspan; K.A. Jenkins; P. Xiao; A. Shahani; D.L. Harame;
In Proc. Bipolar/BiCMOS Circuits and Technology Meeting (BCTM),
pp. 169-172, 1996. - A new method for determining the propagation delay in CML bipolar switching
R. Tinti; H.C. de Graaff; E. Klinkenberg; J.L. Tauritz;
In Proc. ESSDERC 96,
Sept. 1996. - An integrated silicon interferometric temperature sensor
G. Cocorullo; F.G. Della Corte; M. Iodice; I. Rendina; P.M. Sarro;
In Proc. Eurosensors '96 Conf.,
Leuven, Belgium, pp. 1413-1416, Sep. 1996. - An integrated charge amplifier for a pyroelectric sensor
D. Setiadi; A. Armitage; T.D. Binnie; P.P.L. Regtien; P.M. Sarro;
In Proc. Eurosensors '96 Conf.,
Leuven, Belgium, pp. 355-358, Sep. 1996. - Role of plasma deposition temperature and post-deposition annealing in fabrication of high quality a-SiGe:H alloys
V.I. Kuznetsov; M. Zeman; L.L.A. Vosteen; B.S. Girwar; J.W. Metselaar;
In International PVSEC-9,
Miyasaki, Japan, pp. 707-708, 1996. - Monolithic narrow-band active inductors using suspended membrane passive components on silicon substrate
Y. Sun; F.E. van Vliet; J.L. Tauritz; R.G.F. Baets;
In The 4th IEEE International Workshop on High Performance Devices for Microwave and Optoelectronic Applications (EDMO 96),
Leeds, UK, pp. 79-83, Nov. 1996. - Current matching in a-Si:H alloy tandem cells on textured substrates
M. Zeman; V.I. Kuznetsov; L.L.A. Vosteen; J.A. Willemen; J.W. Metselaar; R.E.I. Schropp;
In International PVSEC-9,
Miyasaki, Japan, pp. 647-648, 1996. - Sensitivity study of a-Si:H solar cell model parameters
J.A. Willemen; M. Zeman; J.W. Metselaar;
In International PVSEC-9,
Miyasaki, Japan, pp. 359-360, 1996. - Monolithic Spiral Inductors fabricated using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates
J.N. Burghartz; D.C. Edelstein; K.A. Jenkins; C. Jahnes; C. Uzoh; E.J. O Sullivan; K.K. Chan; M. Soyuer; P. Roper; S. Cordes;
In IEEE International Electron Devices Meeting (IEDM),
pp. 99-102, 1996. - RF and Microwave Building Blocks in a Standard BiCMOS Technology
M. Soyuer; J.N. Burghartz; K.A. Jenkins; H.A. Ainspan,F.J. Canora;
In Proceedings of the IEEE Symposium on Circuits and Systems (ISCAS),
pp. 89-92, 1996. - Micromachined mirror with a variable focal distance
G.Vdovin; S. Middelhoek; P.M. Sarro;
In Tech. Digest EOS Free Space Micro-Optical Systems,
Engelberg, Switzerland, pp. 28-29, Apr. 1996. - Thin-film free-space optical components micromachined in silicon
G.Vdovin; S. Middelhoek; P.M. Sarro;
In Techn Digest IEEE/LEOS Summer Topical Meeting Optical MEMS and Their Applications,
Keystone, Colorado, USA, pp. 5-6, Aug. 1996. - Kelvin test structure for measuring contact resistance of shallow junctions
L.K. Nanver; E.J.G. Goudena; J. Slabbekoorn;
In Proceedings IEEE Intl. Conf. on Microelectronics Test Structures, ICMTS 1996,
Trento, Italy, Mar. 1996. - NMOS Voltage-Controlled Oscialltor with Integrated Resonator
M. Soyuer; J.N. Burghartz; H. Ainspan; K. Jenkins; P. Xiao; A. Shahani; M. Dolan; D. Harame;
In Proceedings of the Bipolar/BiCMOS Circuit and Technology Meeting (BCTM),
pp. 169-172, 1996. - System performance of a 4-channel PHASAR WDM receiver operating at 1.2 Gbit/s
C.A.M. Steenbergen; M.O. van Deventer; L.C.N. de Vreede; C. van Dam; M.K. Smit; B.H. Verbeek;
In Proc. OFC 1996,
San Jose, CA, USA, pp. 310-311, Feb. 1996. - X ray diffraction analysis of self-organized InAs quantum dots
Y. ZY. Huang.T. Wang; W.Q. Ma; W. Wang; X.P. Yang; Z.G. Chen; D.S. Jiang; H.Z. Zheng;
In Proc.SPIE,
pp. 75, 1996. - Silicon drift detectors for the detection of X- and g- rays
H.Valk; E.A.Hijzen; J.Huizenga; C.W. van Eijk; R.W.Hollander; L.K.Nanver; P.M. Sarro; A. van d.Bogaard; J.Slabbekoorn;
In Proc. National Sensor Conference,
Delft, The Netherlands, pp. 103-107, Mar. 1996. - Aluminum passivation in saturated TMAHW solutions for IC-compatible microstructures and device isolation
P.M. Sarro; S. Brida; W. van der Vlist;
In Proc.SPIE Micromachining and Microfabrication �96 Symposium,
Austin, Texas, USA, SPIE, pp. 242-250, Oct. 1996. - Temperature monitoring with a fully integrable on chip interferometric silicon micro-sensor based on the thermo-optic effect
G. Cocorullo; F.G. Della Corte; M. Iodice; I. Rendina; P.M. Sarro;
In Proc. MELECON '96,
Bari, Italy, pp. 1321-1323, May 1996. - Fabrication of SiGe Base HBT with Lateral Colector Contact on ThSOI
Joachim N. Burghartz;
Patent No. US 5,583,059, Dec 1996. - HF Silicon ICs for Wide-band Communication Systems
L.C.N. de Vreede;
PhD thesis, Delft University of Technology, Jun 1996.
document - The role of surface charge in low-voltage electrophotography
W. P. M. Willems; P. L. J. Welten; F. W. Marland; R.A.C.M.M. van Swaaij;
J. Electrochem. Soc.,
Volume 142, pp. 1615, 1995. - Realization of an integrated VDF/TrFE copolymer-on-silicon pyroelectric sensor
D. Setiadi; P.P.L. Regtien; P.M. Sarro;
Microelectronic Engineering,
Volume 29, Issue 1-4, pp. 85-88, Dec. 1995. - Silicon accelerometer based on thermopiles
U.A. Dauderstadt; P.H.S. de Vries; R. Hiratsuka; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 46, Issue 1-3, pp. 201-204, Jan.-Feb. 1995. - In-plane x-ray scattering of epitaxial structures
S.F. Cui; Y.T. Wang; Y. Zhuang; M. Li; Z.H. Mai;
Journal of Crystal Growth,
Volume 152, pp. 354, 1995. - Electrophotographic discharge of CdS explained by a surface-depletion discharge model
R.A.C.M.M. van Swaaij; W. P. M. Willems; J. P. Lokker; J. Bezemer; W. F. van der Weg;
J. Appl. Phys.,
Volume 77, pp. 1635, 1995. - Multilevel Monolithic Inductors in Silicon Technology
M. Soyuer; J.N. Burghartz; K.A. Jenkins; S. Ponnapalli; J.F. Ewen; W.E. Pence;
Electronics Letters,
Volume 31, Issue 5, pp. 359-360, 1995. - Dopant Interaction During Diffusion of Arsenic and Boron in Opposite Directions in Polycrystalline/Monocrystalline Silicon Structures
J.N. Burghartz; C.L. Stanis; P.A. Ronsheim;
Applied Physics Letters,
Volume 67, Issue 21, pp. 3156-3158, 1995. - 4-channel wavelength flattened demultiplexer integrated with photodetectors
C. A. M. Steenbergen; C van Dam; T. L. M. Scholtes; A. H. de Vreede; L. Shi; J.J.G.M van der Tol; P. Demeester; M.K. Smit;
In Proc. 7th Eur. Conf. on Int. Opt. (ECIO �95),
1995. - Integrated 1 GHz 4-channel InP phasar based WDM-receiver with Si bipolar frontend array
C.A.M. Steenbergen; L.C.N. de Vreede; C. van Dam; T.L.M. Scholtes; M.K. Smit; J.L. Tauritz; J.W. Pedersen; I. Moerman; B.H. Verbeek; R.G.F. Baets;
In Proc. ECOC 1995,
Brussels, Belgium, pp. 211-214, Sept. 1995. - CAD-tool for integrated optics
X.J.M. Leijtens; L.H. Spiekman; C. van Dam; L.C.N. de Vreede; M.K. Smit; J.L. Tauritz;
In Proc. ECIO 1995,
Delft, The Netherlands, pp. 463-466, Apr. 1995. - Extension of the collector charge description for compact bipolar epilayer models
L.C.N. de Vreede; H.C. de Graaff; J.L. Tauritz; R.G.F. Baets;
In Proc. ESSDERC 1995,
The Hague, The Netherlands, pp. 229-232, Sep. 1995. - Opportunities for Standard Silicon Technology in RFµwave Applications
J.N. Burghartz; M. Soyuer; K.A. Jenkins; Y.H. Kwark; S. Ponnapalli; J.F. Ewen; W.E. Pence;
In Proceedings of the European Solid-State Device Research Conference (ESSDERC),
pp. 363-367, 1995. - Technology characterization and application of adaptive mirrors fabricated with IC-compatible micromachining
G. Vdovin; S. Middelhoek; M. Bartek; P.M. Sarro; D. Solomatine;
In Proc. SPIE,
San Diego, CA, USA, pp. 116-129, Jun. 1995. - X-ray diffraction studies of quantum wire heterostructures
L. Tapfer; L. De Caro; Y. Zhuang; P. Sciacovelli;
In Semiconductor Heteroepitaxy Growth, Characterization and Device Applications,
1995. - High-Q Inductors in Standard Silicon Interconnect Technology and Applicationn to an Integrated RF Power Amplifier
J.N. Burghartz; M. Soyuer; K.A. Jenkins; M.D. Hulvey;
In IEEE International Electron Devices Meeting (IEDM),
pp. 1015-1018, 1995. - SiGe Thin Film or SOI MOSFET and Method for Making the Same
Joachim N. Burghartz; Bernard S. Meyerson; Yuan-Chen Sun;
Patent No. US 5,461,250, Oct 1995. - Accurate generation rate profiles in a-Si :H solar cells with textured TCO substrates
G. Tao; M. Zeman; J.W. Metselaar;
Solar Energy Materials and Solar Cells,
Volume 34, Issue 1-4, pp. 359-366, Sep. 1994. - Evaluation of liquid properties using a silicon lamb wave sensor
M.J. Vellekoop; G.W. Lubking; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 43, Issue 1-3, pp. 175-180, May 1994. - Integrated-circuit-compatible design and technology of acoustic-wave-based microsensors
M.J. Vellekoop; G.W. Lubking; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 44, Issue 3, pp. 249-263, Sep. 1994. - Liquid and gas micro-calorimeters for (bio)chemical measurements
A. W. van Herwaarden; P.M. Sarro; J.W. Gardner; P. Bataillard;
Sensors and Actuators A: Physical,
Volume 43, Issue 1-3, pp. 24-30, May 1994. - Application of electrostatic feedback to critical damping of an integrated silicon capacitive accelerometer
R.P. van Kampen; M.J. Vellekoop; P.M. Sarro; R.F. Wolffenbuttel;
Sensors and Actuators A: Physical,
Volume 43, Issue 1-3, pp. 100-106, May 1994. - A silicon-silicon nitride membrane fabrication process for smart thermal sensors
P.M. Sarro; A.W. van Herwaarden; W. van der Vlist;
Sensors and Actuators A: Physical,
Volume 42, Issue 1-3, pp. 666-671, Apr. 1994. - Application of VDF/TrFE copolymer for pyroelectric image sensors
D. Setiadi; P.P.L. Regtien; P. M. Sarro;
Sensors and Actuators A: Physical,
Volume 42, Issue 1-3, pp. 585-592, Apr. 1994. - Random-matrix theory of parametric correlations in the spectra of disordered metals and chaotic billiards
C.W.J. Beenakker; B. Rejaei;
Physica A: Statistical and Theoretical Physics,
Volume 203, Issue 1, pp. 61-90, Feb. 1994. - X-ray scattering from a rough surface and damaged layer of polished wafer
M. Li; Z.H. Mai; S.F. Cui; J.H. Li; Y.S. Gu; Y.T. Wang; Y. Zhuang;
J. Phys. D,
Volume 27, Issue 9, pp. 1929, 1994. - Exact solution for the distribution of transmission eigenvalues in a disordered wire and comparison with random-matrix theory
C.W.J. Beenakker; B. Rajaei;
Phys. Re. B,
pp. 7499-7510, 1994. - Determination of surface roughness of InP (001) wafers by x-ray scattering
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J. Appl. Phys.,
Volume 76, Issue 7, pp. 4154, 1994. - Scaling theory of conduction through a normal-superconductor microbridge
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Phys. Re. Lett.,
Volume 72, pp. 2470-2473, 1994. - A high gain silicon AGC amplifier with a 3 dB bandwidth of 4 GHz
L.C.N. de Vreede; A.C. Dambrine; J.L. Tauritz; R.G.F. Baets;
IEEE Transactions on Microwave Theory and Techniques,
Volume 42, Issue 4, pp. 546-552, Apr. 1994. - Local structure and bonding states in a-Si1-xCx:H
R.A.C.M.M. van Swaaij; A. J. M. Berntsen; W. G. J. H. M. van Sark; H. Herremans; J. Bezemer; W. F. van der Weg;
J. Appl. Phys.,
Volume 76, Issue 251, 1994. - A Low-Capacitance Bipolar/BiCMOS Isolation Technology, II - Circuit Performance and Device Self-Heating
J.N. Burghartz; A.O. Cifuentes; J.D. Warnock;
IEEE Transactions on Electron Devices,
Volume 41, Issue 8, pp. 1388-1395, 1994. - A Low-Capacitance Bipolar/BiCMOS Isolation Technology, II - Concept, Fabrication Process, and Characterization
J.N. Burghartz; R.C. McIntosh; C.L. Stanis;
IEEE Transactions on Electron Devices,
Volume 41, Issue 8, pp. 1379-1387, 1994. - High-Performance Emitter-Up/Down SiGe HBTs
J.N. Burghartz; K.A. Jenkins; D.A. Grutzmacher; T.O. Sedgwick; C.L. Stanis;
IEEE Electron Device Letters,
Volume 15, Issue 9, pp. 360-362, 1994. - Extraction of amorphous silicon solar cell parameters by inverse modelling
M. Zeman; J.A. Willemen; S. Solntsev; J.W. Metselaar;
Acta Physica Slovaca,
Volume 50, Issue 4, pp. 559, 1994. - A figure of merit for the high-frequency noise behavior of bipolar transistors
L.C.N. de Vreede; H.C. de Graaff; G.A.M. Hurkx; J.L. Tauritz; R.G.F. Baets;
IEEE Journal of Solid State Circuits,
Volume 29, Issue 10, pp. 1220-1226, Oct. 1994. - Surface scattering of x-ray from InP (001) wafers
J.H. Li; S.F. Cui; M. Li; C.R. Li; Z.H. Mai; Y. ZY. Huang.T. Wang;
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Volume 65, Issue 26, pp. 3317, 1994. - Optical modeling of a-Si:H based solar cells on textured substrates
G. Tao; M. Zeman; J.W. Metselaar;
In 1994 IEEE First World Conference on Photovoltaic Energy Conversion,
pp. 666-669, 1994. - Supporting Early Development of Advanced High-Performance Logic with Synchroton Orbital Radiation Lithography
L.W. Liebmann; A.T. Pomerene; D. deMayand T. Donohue; A. Lamberti; J.N. Burghartz;
In Advanced Technology Proceedings SPIE, Symposium on Microlithography,
1994. - Low Temperature Atmospheric Pressure Chemical Vapour Desposition for Epitaxial Growth of SiGe Bipolar Transistors
T.O. Sedgwick; J.N. Burghartz; D.A. Gruetzmacher;
In Electrochemical Society Proceedings Series, 7th Symposium on Silicon Materials, Science and Technology,
1994. - Advanced modelling of distortion effects in bipolar transistors using the Mextram model
L.C.N. de Vreede; H.C. de Graaff; K. Mouthaan; M. de Kok; J.L. Tauritz; R.G.F. Baets;
In Proc. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 1994),
Minneapolis, MN, USA, pp. 48-51, Oct. 1994. - Monte Carlo modelling of electrophotographic dark discharge
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In Mater. Res. Soc. Symp. Proc.,
1994. - Hole carrier drift mobility and valence band tail states in amorphous silicon carbide
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In proceedings of the 8th International School on Condensed Matter Physics,
Varna, Bulgaria, 1994. - Amorphous Silicon Photoconductive Films for Electrophotography
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PhD thesis, Utrecht University, 1994. - Single-electron tunneling in the fractional quantum Hall effect regime
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Physica B: Condensed Matter,
Volume 189, Issue 1-4, pp. 147-156, Jun. 1993. - Nonlogarithmic repulsion of transmission eigenvalues in a disordered wire
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Phys. Re. Lett.,
Volume 71, pp. 3689-3692, 1993. - Reliability Imposed Design Aspects of Submicrometer Polysilicon Bipolar Transistors
J.N. Burghartz; Y.-J. Mii;
IEEE Electron Devices Letters,
Volume 14, Issue 7, pp. 363-365, 1993. - A pyroelectric matrix sensor using PVDF on silicon containing FET readout circuitry
P.C.A. Hammes; P.P.L. Regtien; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 37-38, pp. 290-295, Jun.-Aug. 1993. - Quasi-Landau-level structure in the fractional quantum Hall effect
B. Rejaei;
Phys. Re. B,
Volume 48, pp. 18016-18023, 1993. - A transmission electron microscopy study of interphase dislocation between decagonal quasicrystalline and crystalline phase in Al75Ni10Fe15 alloy
Y. Zhuang; Z. Zhang; D.B. Williams;
Journal of Non-crystalline Solids,
1993. - A High-Speed Complementary Silicon Bipolar Technology with 12-fJ Power-Delay Product
J.D. Cressler; J. Warnock; D.L. Harame; J.N. Burghartz; K.A. Jenkins; C.T. Chuang;
IEEE Electron Device Letters,
Volume 14, Issue 11, pp. 523-526, 1993. - Optimisation of base-link in fully-implanted NPNs
L.K. Nanver; E.J.G. Goudena; H.W. van Zeijl;
Electronics Letters,
Volume 29, Issue 16, pp. 1451-1452, Aug. 1993. - Investigation of the interface properties of hydrogenated amorphous silicon p-i junctions
M. Trijssenaar; M. Zeman; J.W. Metselaar;
Journal of Non-Crystalline Solids,
Volume 164-166, pp. 667-670, Dec. 1993. - Experimental dark discharge of a-Si1-xCx:H films and its comparison to Monte Carlo simulations
R.A.C.M.M. van Swaaij; S. J. Elmer; W. P. M. Willems; J. Bezemer; J. M. Marshall; A. R. Hepburn;
J. Non-Cryst. Solids,
Volume 164-166, pp. 533, 1993. - Study of the temperature and field dependence of electron drift mobility in a-Si1-xCx:H using the time-of-flight technique
P. A. Bayley; A. K. Browne; J. M. Marshall; R.A.C.M.M. van Swaaij; A. R. Hepburn;
J. Non-Cryst. Solids,
Volume 164-166, pp. 521, 1993. - Submicron Gate Electrode Discontinuity: Electrical Signature and Effect on Circuit Speed
K.A. Jenkins; J.N. Burghartz; P.D. Agnello; D.F. Heidel; C.Y. Wong;
In IEEE International Electron Devices Meeting (IEDM),
pp. 891-894, 1993. - Degradation of amorphous silicon based photoconductors by corona discharge
R.A.C.M.M. van Swaaij; W. P. M. Willems; J. Bezemer; H. J. P. Lokker; W. F. van der Weg;
In MRS Spring Meeting,
San Francisco CA, Apr. 1993. - APCVD-Grown Self-Aligned SiGe-Base HBTs
J.N. Burghartz; T.O. Sedgwick; D.A. Grutzmacher; D. Nguyen-Ngoc; K.A. Jenkins;
In Proceedings Bipolar/BiCMOS Circuit and Technology Meeting (BCTM),
pp. 55-62, 1993. - A figure of merit for the high-frequency noise behaviour of bipolar transistors
H.C. de Graaff; L.C.N. de Vreede; G.A.M. Hurkx; J.L. Tauritz; R.G.F. Baets;
In Proc. 1993 IEEE BCTM,
Minneapolis, USA, pp. 118-121, Oct. 1993. - A High-Performance 0.15 um CMOS
G.G. Shahidi; J. Warnock; A. Acovic; P. Agnello; C. Blair; A. Burghartz; et al;
In Symposium on VLSI Technology,
pp. 93-94, 1993. - The density of states in a-Si:C:H revealed by electrophotography
R.A.C.M.M. van Swaaij; W. P. M. Willems; J. Bezemer; M. B. von der Linden; W. F. van der Weg;
In Mater. Res. Soc. Symp. Proc.,
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R.A.C.M.M. van Swaaij; W. P. M. Willems; J. Bezemer; H. J. P. Lokker; W. F. van der Weg;
In Mater. Res. Soc. Symp. Proc.,
1993. - High-Performance Complementary Bipolar Technology
J. Warnock; J.D. Cressler; J.N. Burghartz; D.L. Harame; K.A. Jenkins; C.T. Chuang;
In Symposium on VLSI Technology,
pp. 75-76, 1993. - An Ultra-Low Thermal Budget SiGe-Base Bipolar Technology
J.N. Burghartz; D.A. Grutzmacher; T.O. Sedgwick; K.A. Jenkins; A.C. Megdanis; J.M. Cotte; D. Nguyen-Ngoc; S.S. Iyer;
In Symposium on VLSI Technology,
pp. 59-60, 1993. - SPIRIT - A Bipolar/BiCMOS Isolation Technology for High-Performance VLSI
J.N. Burghartz; A.O. Cifuentes; J. Warnock; R.C. McIntosh; C.L. Stanis; J.D. Warnock; J.Y.-C. Sun; J.H. Comfort; K.A. Jenkins;
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pp. 143-144, 1993. - Design considerations for the thermal accelerometer
R. Hiratsuka; D.C. van Duyn; T. Otaredian; P. de Vries; P.M. Sarro;
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Volume 32, Issue 1-3, pp. 380-385, Apr. 1992. - Vector-mean-field theory of the fractional quantum Hall effect
B. Rejaei; C.W.J. Beenakker;
Phys. Re. B,
Volume 46, pp. 15566-15569, 1992. - Sensor technology strategy in silicon
P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 31, Issue 1-3, pp. 138-143, Mar. 1992. - Identification of Perimeter Depletion and Emitter Plug Effects in Submicrometer Shallow-Junction Polysilicon Bipolar Transistors
J.N. Burghartz; J.Y.C. Sun; C.L. Stanis; S.R. Mader; J.D. Warnock;
IEEE Transactions on Electron Devices,
Volume 39, Issue 6, pp. 1477-1489, 1992. - A high frequency model based on the physical structure of the ceramic multilayer capacitor
de L.C.N. de Vreede Kok; M.; van Dam; C.; J.L. Tauritz;
Microwave Theory and Techniques, IEEE Transactions on ,,
Volume 40, Issue 7, pp. 1584-1587, Jul. 1992. - A transmission electron microscopy study of dislocations in Al70Ni10Co20 and Al75Ni10Fe15 decagonal quasicrystals
Z. Zhang; Y. Zhuang;
Philosophical Magazine Letters,
Volume 65, Issue 4, pp. 2039, 1992. - Novel bipolar transistor isolation structure using combined selective epitaxial growth and planarization technique
J.N. Burghartz; J. Warnock; J.D. Cressler; C.L. Stanis; R.C. McIntosh; J.Y.C. Sun; J.H. Comfort; J.M.C. Stork; K.A. Jenkins; E.F. Crabbe; et al.;
Microelectronic Engineering,
Volume 19, Issue 1-4, pp. 531-534, Sep. 1992. - Structural, compositional and optical properties of hydrogenated amorphous silicon-carbon alloys
H. Herremans; W. Grevendonk; R.A.C.M.M. van Swaaij; W. G. J. M. van Sark; A. J. M. Berntsen; W. M. Arnold Bik; J. Bezemer;
Philos. Mag. B,
Volume 66, Issue 787, 1992. - A Scaled 0.25-um Bipolar Technology Using Full E-Beam Technology
J.D. Cressler; J.D. Warnock; P.J. Coane; M.E. Rothwell; K.A. Jenkins; E.J. Petrillo; N.J. Mazzeo; A.C. Megdanis; F.J. Hohn; M.G.R. Thompson; J.Y.C. Sun; D.D. Tang;
IEEE Electron Device Letters,
Volume 13, Issue 5, pp. 956-958, 1992. - Partial SOI Isolation Structure for Reduced Bipolar Transistor Parasitics
J.N. Burghartz; J.D. Cressler; J.D. Warnock; R.C. McIntosh; K.A. Jenkins; J.Y.C. Sun; J.H. Comfort; J.M.C. Stork; C.L. Stanis; W. Lee; D.D. Danner;
IEEE Electron Device Letters,
Volume 13, Issue 8, pp. 424-426, 1992. - A High-Performance Epitaxial SiGe-Base ECL BiCMOS Technology
D.L. Harame; E.F. Crabbe; J.D. Cressler; J.H. Comfort; J.Y.-C. Sun; S.R. Stiffler; E. Kobeda; J.N. Burghartz; et al;
In IEEE International Electron Devices Meeting (IEDM),
pp. 19-22, 1992. - Novel Bipolar Transistor Isolation Structure Using Combined Selective Epitaxial Growth and Planarization Technique
J.N. Burghartz; J. Warnock; J.D. Cressler; C.L. Stanis; R.C. McIntosh; et al;
In Proceedings of the European Solid-State Device Research Conference (ESSDERC),
pp. 531-534, 1992. - Thickness related effects in p-type amorphous silicon thin films
W. G. J. H. M. van Sark; J. W. Smit; W. M. Arnold Bik; R.A.C.M.M. van Swaaij; M. B. von der Linden; R. E. I. Schropp; J. Bezemer; W. F. van der Weg;
In Proceedings of the 11th European Photovoltaic Solar Energy Conference,
Montreux, Switzerland, 1992. - nfluence on de DOS profile in a-Si:H of bandgap variations with and without carbon alloying
M. B. von der Linden; R. E. I. Schropp; R. Balkema; R.A.C.M.M. van Swaaij; J. Daey Ouwens; W. G. J. H. M. van Sark; J. Bezemer; W. F. van der Weg;
In Proceedings of the 11th European Photovoltaic Solar Energy Conference,
Montreux, Switzerland, 1992. - Quantitative determination of Si��_Hx bonding configurations in a-Si:C:H
R.A.C.M.M. van Swaaij; W. G. J. H. M. van Sark; W. M. Arnoldbik; J. Bezemer; W. F. van der Weg;
In N. Kirov; J. M. Mars (Ed.), Electronic and Opto-electronic Materials into the 21st Century', proceedings of the 7th International School on Condensed Matter Physics,
Varna, Bulgaria, 1992. - Design considerations for a permanent-rotor-charge-excited micromotor with an electrostatic bearing
R.F. Wolffenbuttel; J.F.L. Goosen; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 27, Issue 1-3, pp. 597-603, May 1991. - Superconductivity in the mean-field anyon gas
B. Rejaei; C.W.J. Beenakker;
Phys. Re. B,
Volume 43, pp. 11392-11395, 1991. - Device Design Issues for a High-Performance Bipolar Technology with Si or SiGe Base -
J.N. Burghartz; J.D. Cressler; K.A. Jenkins; J.Y.C. Sun; J.M.C. Stork; J.H. Comfort; T.A. Brunner; C.L. Stanis;
Microelectronic Engineering,
Volume 15, Issue 1-4, pp. 11-14, Oct. 1991. - The effect of hydrogen on the plasma deposition and hydrogen plasma etching of a-SiGe:H thin films
M. Zeman; M.J. Geerts; J. Siegl; J.W. Metselaar;
Solar Energy Materials,
Volume 23, Issue 2-4, pp. 265-272, Dec. 1991. - The effect of hydrogen dilution on glow discharge a-SiGe:H alloys
M. Zeman; I. Ferreira; M.J. Geerts; J.W. Metselaar;
Solar Energy Materials,
Volume 21, Issue 4, pp. 255-265, Jan. 1991. - Self-Aligned Bipolar Epitaxial Base NPN Transistors with Selective Epitaxial Emitter Window (SEEW) Technology
J.N. Burghartz; S.R. Mader; B.J. Ginsberg; B.S. Meyerson; J.M.C. Stork; C.L. Stanis; J.Y.C. Sun; M.R. Polcari;
IEEE Transactions on Electron Devices,
Volume 38, Issue 2, pp. 378-385, 1991. - Novel In-Situ Doped PolysiliconEmitter Process with Buried Diffusion Source (BDS)
J.N. Burghartz; A.C. Megdanis; J.D. Cressler; J.Y.C. Sun; C.L. Stanis; J.H. Comfort; K.A. Jenkins; F. Cardone;
IEEE Electron Device Letters,
Volume 12, Issue 12, pp. 679-681, 1991. - Selective Epitaxial Growth of Silicon and Some Potential Applications
B.J. Ginsberg; J.N. Burghartz; G.B. Bronner; S.R. Mader;
IBM Journal of Research and Development,
Volume 35, Issue 2, pp. 1-13, 1991. - Single Crystal Emitter Cap for Epitaxial Si- and SiGe-Base Transistors
J.H. Comfort; E.F. Crabbe; J.D. Cressler; W. Lee; J.Y.-C. Sun; J. Malinowski; M.M. DAgostino; J.N. Burghartz; J.M.C. Stork; B.S. Meyerson;
In IEEE International Electron Devices Meeting (IEDM),
pp. 857-860, 1991. - Advanced Bipolar Technology for the 1990s
J.Y.-C. Sun; J.H. Comfort; J.D. Warnock; J.D. Cressler; G. Patton; J.M.C. Stork; J.N. Burghartz; D.L. Harame; E.F. Crabbe; P.-F. Lu; M. Arienzo; B.S. Meyerson;
In Proceedings of the Symposium on VLSI Technology, Systems, and Applications,
pp. 269-273, 1991. - A Full E-Beam 0.25 um Bipolar Technology with Sub-25 ps ECL Gate Delay
J. Warnock; J.D. Cressler; P.J. Coane; K.N. Chiong; M.E. Rothwell; K.A. Jenkins; J.N. Burghartz et al;
In IEEE International Electron Devices Meeting (IEDM),
pp. 956-958, 1991. - Ion-Implanted Base SiGe PNP Self-Aligned SEEW Transistors
D. Nguyen-Ngoc; D.L. Harame; J.N. Burghartz; R.C. McIntosh; E.F. Crabbe; J.D. Warnock; C.L. Stanis; B.S. Meyerson; J.M. Cotte; J.H. Comfort;
In Proc. Bipolar Circuit and Technology Meeting (BCTM),
pp. 75-78, 1991. - Device Design for a High-Performance Bipolar Technology with Si or SiGe Epitaxial Base
J.N. Burghartz; J.D. Cressler; K.A. Jenkins; J.Y.-C. Sun; J.M.C. Stork; J.H. Comfort; T.A. Brunner; C.L. Stanis;
In Proceedings of the European Solid-State Device Research Conference (ESSDERC),
pp. 11-14, 1991. - Method of Forming Bipolar Transistor having Self-Aligned Emitter-Base using Selective and Non-Selective Epitaxy
Joachim N. Burghartz; Barry J. Ginsberg; Siegfried Mader;
Patent No. US 5,059,544, Oct 1991. - Compatibility of zinc oxide with silicon IC processing
M.J. Vellekoop; C.C.G. P. Visser.M. Sarro;
Sensors and Actuators A: Physical,
Volume 23, Issue 1-3, pp. 1027-1030, Apr. 1990. - 75 GHz f-sub-T SiGe-Base Heterojunction Bipolar Transistors
G.L. Patton; J.H. Comfort; B.S. Meyerson; E.F. Crabbe; G.J. Scilla; E. de Fresart; J.M.C. Stork; J.Y.C. Sun; D.L. Harame; J.N. Burghartz;
IEEE Electron Device Letters,
Volume 11, Issue 4, pp. 171-173, 1990. - The influence of deposition parameters on the growth of a-SiGe:H alloys in a plasma CVD system
M. Zeman; I. Ferreira; M. J. Geerts; J.W. Metselaar;
Applied Surface Science,
Volume 46, Issue 1-4, pp. 245-248, Dec. 1990. - Self-Aligned SiGe-Base Heterojunction Bipolar Transistors by Selective Epitaxy Emitter Window (SEEW) Technology
J.N. Burghartz; J.H. Comfort; G.L. Patton; B.S. Meyerson; J.Y.C. Sun; J.M.C. Stork; C.L. Stanis; G.J. Scilla; B.J. Ginsberg;
IEEE Electron Device Letters,
Volume 11, Issue 7, pp. 288-290, 1990. - SiGe Heterojunction Bipolar Transistors
J.H. Comfort; G.L. Patton; J.N. Burghartz; E.F. Crabbe; J.Y.-C. Sun; J.M.C. Stork; B.S. Meyerson;
In Proceedings of the American Vacuum Society Meeting,
1990. - Sub-30 ps ECL Circuits Using High-f-sub-T Si and SiGe Epitaxial Base Transistors
J.N. Burghartz; J.H. Comfort; G.L. Patton; J.D. Cressler; B.S. Meyerson; B.S. Meyerson; J.Y.-C. Sun; G. Scilla; J. Warnock et al;
In IEEE International Electron Devices Meeting (IEDM),
pp. 297-300, 1990. - Profile Leverage in Self-Aligned Epitaxial Si or SiGe Base Bipolar Transistors
J.H. Comfort; G.L. Patton; J.D. Cressler; W. Lee; E.F. Crabbe; B.S. Meyerson; J.Y.-C. Sun; J.M.C. Stork; P.-F. Lu; J.N. Burghartz; et al;
In IEEE International Electron Devices Meeting (IEDM),
pp. 21-24, 1990. - 63-75 GHz f-sub-T SiGe-Base Heterojunction Bipolar Technology
G.L. Patton; J.H. Comfort; B.S. Meyerson; E.F. Crabbe; G.J. Scilla; E. de Fresart; J.M.C. Sork; J.Y.-C. Sun; D.L. Harame; J.N. Burghartz;
In Symposium on VLSI Technology,
pp. 49-50, 1990. - Perimeter and Plug Effects in Deep Submicrometer Polysilicon Emitter Transistors
J.N. Burghartz; J.Y.-C. Sun; S.R. Mader; C.L. Stanis; B.J. Ginsberg;
In Symposium on VLSI Technology,
pp. 55-56, 1990. - Exchange interaction in type-II quantum wells
B. Rejaei Salmassi; G. E. W. Bauer;
Phys. Re. B 39,
pp. 1970-1972, 1989. - Integrated thermopile sensors
A.W. van Herwaarden; D.C. van Duyn; B.W. van Oudheusden; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 22, Issue 1-3, pp. 621-630, Jun. 1989. - FM radio receiver front-end circuitry with on-chip SAW filters
P.T.M. van Zijl; J.H. Visser; L.K. Nanver;
IEEE Transactions on Consumer Electronics,
Volume 35, Issue 3, pp. 512-519, 1989. - Determination of the electric field at interfaces in amorphous-silicon devices using time-of-flight measurements
H.M. Wentinck; W. Crans;
IEEE Transactions on Electron Devices,
Volume 36, Issue 12, pp. 2803-2809, Dec. 1989. - Selective Epitaxial Refill for In-Trench Device Fabrication
J.N. Burghartz; J.D. Warnock; S.R. Mader; B.J. Ginsberg;
Electronics Letters,
Volume 25, Issue 20, pp. 1337-1338, 1989. - Sensor array with A/D conversion based on flip-flops
W. Lian; S.E. Wouters; D.A. Aupers; P.M. Sarro;
Sensors and Actuators A: Physical,
Volume 22, Issue 1-3, pp. 592-597, Jun. 1989. - New Technology for Bipolar Emitters in the Deep Sub-Micron Range
J.N. Burghartz; B.J. Ginsberg; S.R. Mader;
In Symposium on VLSI Technology,
pp. 57-58, 1989. - A 27 GHz 20 ps PNP Technology
J. Warnock; P. Lu; T. Chen; K.Y. Toh; J.D. Cressler; K.A. Jenkins; D.D. Tang; J.N. Burghartz; J.Y.-C. Sun; C.T. Chuang; G.P. Li; T.H. Ning;
In IEEE International Electron Devices Meeting (IEDM),
pp. 903-905, 1989. - Self-Aligned Bipolar NPN Transistor with 60 nm Epitaxial Base
J.N. Burghartz; S.R. Mader; B.S. Meyerson; B.J. Ginsberg; J.M.C. Stork; J.Y.-C. Sun;
In IEEE International Electron Devices Meeting (IEDM),
pp. 229-232, 1989. - Design considerations for integrated high-frequency p-channel JFETs
L.K. Nanver; E.J.G. Goudena;
IEEE Transactions on Electron Devices,
Volume 35, Issue 11, pp. 1924-1934, 1988. - Selective Epitaxy Base Transistor
J.N. Burghartz; B.J. Ginsberg; S.R. Mader; T.-C. Chen; D.L. Harame;
IEEE Electron Device Letters,
Volume 9, Issue 5, pp. 259-261, 1988. - Selective Epitaxy Base for Bipolar Transistors
J.N. Burghartz; B.J. Ginsberg; S.R. Mader; T.C. Chen; D.L. Harame;
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