prof.dr. Kouchi Zhang

Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Solid state lighting, IC packaging, reliability

Themes: Micro/Nano System Integration and Reliability

ET4277 Microelectronics reliability

Reliability issues involved in electronic components and system

ET4391 Advanced microelectronics packaging

Basics and state-of-the-art of semiconductor packaging

High Performance Vehicle Computer and Communication System for Autonomous Driving

Solid State Lighting reliability for automotive application

GaN-based PiN Diodes for RF Power Limiter Application

Monolithically integrated SiC sun sensor for Space

Advanced packaging technology of SiC power module

High performance devices based on advanced materials

IoSense

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

2D materials-based Heat Waste Recovery of LED

Gallium nitride (GaN) on silicon system integration

Projects history

Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature

Thermal management in 3d heterogeneous integration

LED Luminaire Colour Shift

Smart Optics

Quick reliability assessment for mid-power white-light LED packages

3D System-in-package Design Using Stacked Silicon Submount Technology

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module

  1. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
    Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; Kouchi Zhang; Rong Sun; Chingping Wong;
    ACS Applied Materials & Interfaces,
    2019.

  2. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; Kouchi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

  3. Degradation of optical materials in solid-state lighting systems
    M. Yazdan Mehr; A. Bahrami; W.D. van Driel; X.J. Fan; J. L. Davis; Kouchi Zhang;
    International Materials Reviews,
    2019.

  4. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019.

  5. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Ruisheng Xu; Yang Liu; Hao Zhang; Zhao Li; Fenglian Sun; Kouchi Zhang;
    Journal of Electronic Materials,
    Volume 48, Issue 3, pp. 1758-1765, 2019.

  6. Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
    Jian Zhang; Robert Sokolovskij; Ganhui Chen; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Wenmao Li; Kouchi Zhang; Yu-Long Jiang; Hongyu Yu;
    Sensors and Actuators, B: Chemical,
    Volume 280, pp. 138-143, 2019.

  7. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; Kouchi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019.

  8. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; Kouchi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019.

  9. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; Kouchi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019.

  10. Compressive response of pristine and superconductor coated MWCNT pillars
    A. M. Gheytaghi; S. Vollebregt; R.H. Poelma; H. W. Zeijl; Kouchi Zhang;
    In IEEE MEMS,
    2019.

  11. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; Kouchi Zhang;
    In EurosimE,
    2019.

  12. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
    Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; Kouchi Zhang; Pasqualina M. Sarro;
    Small,
    Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614

  13. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; Kouchi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  14. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
    Amir Mirza Gheytaghi; Hamid Saffari; Kouchi Zhang;
    Heat Transfer Engineering,
    2018.

  15. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
    H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; Kouchi Zhang;
    ETV Maxwell,
    Volume 21.2, 2018.

  16. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
    Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; Kouchi Zhang; Xuejun Fan;
    Applied Mechanics Reviews,
    Volume 70, Issue 2, pp. 020803-1-16, 2018.

  17. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

  18. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  19. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
    Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; Kouchi Zhang;
    Applied Energy,
    Volume 228, pp. 1454-1472, 2018.

  20. A review on discoloration and high accelerated testing of optical materials in LED based-products
    M. Yazdan Mehr; M.R. Toroghinejad; F. Karimzadeh; W.D. van Driel and Kouchi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 136-142, 2018.

  21. A stochastic process based reliability prediction method for LED driver
    Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; Kouchi Zhang;
    Reliability Engineering and System Safety,
    Volume 178, pp. 140-146, 2018.

  22. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
    Amir Mirza Gheitaghy; Hamid Saffari; Kouchi Zhang;
    Heat Transer Engineering,
    2018.

  23. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; Kouchi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

  24. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  25. Germanene on single layer ZnSe substrate: Novel electronic and optical properties
    H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; Kouchi Zhang;
    Physical Chemistry Chemical Physics,
    Volume 20, Issue 23, pp. 16067-16076, 2018.

  26. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
    Maryam Yazdan Mehr; Willem Dirk van Driel; Kouchi Zhang;
    In Solid State Lighting Reliability Part 2,
    Springer, 2018.

  27. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; Kouchi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  28. Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
    Amir Mirza Gheytaghi; Huaiyu Ye; Kouchi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    2018.

  29. Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
    Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; Kouchi Zhang;
    In IEEE Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, 2018.

  30. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
    Zhen Cui; Yingying Zhang; Qun Yang; Kouchi Zhang; Xianping Chen;
    In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
    2018.

  31. Shining light on cardiac tachyarrhythmias
    Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; Kouchi Zhang; de Vries A AF; Pijnappels D A;
    In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
    2018.

  32. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; Kouchi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  33. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; Kouchi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  34. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  35. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
    Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014
    Keywords: ... BPA-PC, LED-based products, Optics, Oxidation, Yellowing.

  36. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
    Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; Kouchi Zhang;
    Journal of Electronic Materials,
    Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8
    Keywords: ... graphene, Light-emitting diode, reliability, remote phosphor.

  37. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
    Y Liu; H Fu; H Zhang; F Sun; X Wang; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 24, pp. 19113-19120, 2017.

  38. Phosphor–silicone interaction effects in high power white light emitting diode packages
    J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 23, pp. 17557-17569, 2017.

  39. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
    H Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 197-204, 2017.

  40. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
    C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; Kouchi Zhang;
    Materials,
    Volume 10, Issue 10, pp. 1181, 2017.

  41. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    F Hou; T Lin; L Cao; F Liu; J Li; X Fan; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

  42. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
    Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; Kouchi Zhang;
    Sensors and Actuators A: Physical,
    Volume 263, pp. 622-632, 2017.

  43. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
    Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; Kouchi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
    Small,
    Volume 13, Issue 29, pp. 1604150, 2017.

  44. Modeling nonlinear moisture diffusion in inhomogeneous media
    L Chen; J Zhou; H Chu; Kouchi Zhang; X Fan;
    Microelectronics Reliability,
    Volume 75, pp. 162-170, 2017.

  45. Humidity sensor based on the ionic polymer metal composite
    E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; Kouchi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 247, pp. 498-504, 2017.

  46. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
    HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; Kouchi Zhang; XP Chen;
    IEEE Electron Device Letters,
    Volume 38, Issue 8, pp. 1139-1142, 2017.

  47. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
    J Fan; MG Mohamed; C Qian; X Fan; Kouchi Zhang; M Pecht;
    Materials 10,
    Volume 7, pp. 819, 2017.

  48. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
    J Xiao; QQ Wei; DG Yang; P Zhang; N He; Kouchi Zhang; XP Chen;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 23, Issue 4, 2017.

  49. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
    FF Hu; HY Tang; CJ Tan; HY Ye; XP Chen; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 7, pp. 983-986, 2017.

  50. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
    J Fan; C Yu; C Qian; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 179-185, 2017.

  51. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
    C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 173-178, 2017.

  52. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
    Bo Sun; X Fan; L Li; H Ye; W van Driel; Kouchi Zhang;
    IEEE Transactions on Components and Packaging and Manufacturing Technology,
    Volume 7, Issue 7, pp. 1081-1088, 2017.

  53. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
    Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; Kouchi Zhang;
    Reliability Engineering & System Safety,
    Volume 163, pp. 14-21, 2017.

  54. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
    XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 5, pp. 661-664, 2017.

  55. Integrated virtual impactor enabled PM 2.5 sensor
    Mingzhi Dong; E Iervolino; F Santagata; G Zhang; Kouchi Zhang;
    IEEE Sensors Journal,
    Volume 17, Issue 9, pp. 2814-2821, 2017.

  56. Monolithically integrated light feedback control circuit for blue/UV LED smart package
    Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; Kouchi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 2, pp. 1-13, 2017.

  57. Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
    J Dong; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 3, pp. 2215-2225, 2017.

  58. Color shift modeling of light-emitting diode lamps in step-loaded stress testing
    M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; Kouchi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 1, pp. 1-14, 2017.

  59. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    HY Tang; HY Ye; XP Chen; C Qian; XJ Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 16459-16468, 2017.

  60. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
    C Qian; J Fan; X Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 24054-24061, 2017.

  61. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    Hongyu Tang; Huaiyu Ye; X.P. Chen; C. Qian; X.J. Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, Issue 5, pp. 16459-16468, 2017.

  62. Solid State Lighting Reliability Part 2: Components to Systems
    WD Van Driel; X Fan; Kouchi Zhang (Ed.);
    Springer, , 2017.

  63. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
    C Tan; Q Yang; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  64. Smart Systems Integration in the era of Solid State Lighting
    Kouchi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M. R.Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

  65. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
    Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; Kouchi Zhang; Pasqualina M Sarro;
    In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
    pp. 266-269, 2017.

  66. Luminous flux modeling for high power LED automotive headlamp module
    C Yu; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  67. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
    C Jiang; W Guo; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  68. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
    R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; Kouchi Zhang;
    In Proceedings of Eurosensors,
    pp. 463, 2017.

  69. Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
    A Prisacaru; A Palczynska; PJ Gromala; B Han; Kouchi Zhang;
    In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
    2017.

  70. A PoF and statistics combined reliability prediction for LED arrays in lamps
    B Sun; X Fan; J Fan; C Qian; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  71. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
    Y Zhang; K Zheng; X Chen; Kouchi Zhang; C Tan; Q Yang; J Jiang; H Ye;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  72. SnS monolayer as gas sensors: Insights from a first-principles investigation
    F Hu; C Tan; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  73. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
    I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; Kouchi Zhang; X Fan;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  74. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
    K Zheng; H Ye; Kouchi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  75. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
    Q Yang; C Tan; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  76. Adsorption of gases on monolayer GeSe: A first principle study
    L Liu; Q Yang; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  77. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
    J Fan; C Xie; C Qian; X Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  78. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
    C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  79. Prognostics and health monitoring of electronic system: A review
    A Prisacaru; PJ Gromala; MB Jeronimo; B Han; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  80. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
    Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; Kouchi Zhang;
    In EurosimE,
    2017.

  81. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
    Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 37, Issue 4, 2016.

  82. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
    C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; Kouchi Zhang;
    Reliability Engineering and System Safety,
    Volume 147, pp. 84-92, 2016.

  83. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

  84. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 63, pp. 2807-2814, 2016.

  85. Silicon microfabrication based particulate matter sensor
    Mingzhi Dong; Elina Iervolino; Fabio Santagata; Kouchi Zhang;
    Sensors and Actuators A: Physical,
    Volume 247, pp. 115-124, 2016.

  86. Output blue light evaluation for phosphor based smart white LED wafer level packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; Kouchi Zhang;
    Optics Express,
    Volume 24, Issue 4, pp. 174-177, 2016.

  87. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
    A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; Kouchi Zhang;
    Micro and Nano Letters,
    Volume 11, Issue 8, pp. 412, 2016.

  88. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
    Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; Kouchi Zhang; Pasqualina M. Sarro;
    Nanoscale,
    Volume 8, pp. 8266-8275, 2016.
    document

  89. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; Ren H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; Kouchi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

  90. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; Kouchi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  91. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  92. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
    Bo Sun; Xuejun Fan; van Driel, Willem; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
    Keywords: ... Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

  93. Lumen Decay Prediction in LED Lamps
    Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
    Keywords: ... Reliability, LED Lamp, Lumen Decay Prediction.

  94. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
    Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; Kouchi Zhang;
    In IEEE 66th Electronic Components and Technology Conference (ECTC),
    2016.
    document

  95. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; Kouchi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
    document

  96. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; Kouchi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
    document

  97. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
    R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; Kouchi Zhang;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1094-1097, 2016.

  98. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
    A. M. Gheitaghy; H. Saffari; Kouchi Zhang;
    In 18th International Conference on Thermal Engineering,
    2016.

  99. Thermal analysis and optimization of IGBT power electronic module based on layout model
    Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; Kouchi Zhang;
    In ICEPT,
    2016.

  100. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
    Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 36, Issue 6, 2015.

  101. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; Kouchi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

  102. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
    H. Wu; J. Dong; G. Qi; Kouchi Zhang;
    Journal of the Optical Society of America A,
    Volume 32, Issue 7, pp. 1262-1270, 2015.

  103. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
    R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 5, pp. 055017, 2015.

  104. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
    R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; Kouchi Zhang;
    Journal of Crystal Growth,
    Volume 426, pp. 228-233, 2015.

  105. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
    F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; Kouchi Zhang;
    IEEE Photonics Technology Letters,
    Volume 27, Issue 13, pp. 1430-1433, 2015.

  106. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
    Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 478-485, 2015.

  107. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
    Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 55, Issue 2654-2662, 2015.

  108. Degradation modeling of mid-power white-light LEDs by using Wiener process
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    Optics Express,
    Volume 23, pp. A966-A978, 2015.

  109. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
    Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 2, pp. 220-228, 2015.

  110. Highly selective and responsive ultra-violet detection using an improved phototransistor
    R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; Kouchi Zhang;
    Applied Physics Letters,
    Volume 106, Issue 23, pp. 231102, 2015.

  111. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  112. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  113. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

  114. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
    R. H. Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
    Springer, 2015.

  115. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; Kouchi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

  116. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; Kouchi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

  117. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
    Maryam Yazdan Mehr; W. D. van Driel; H. Udono; Kouchi Zhang;
    Optical Materials,
    Volume 37, pp. 155-159, 2014.

  118. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  119. Thermal and mechanical effects of voids within flip chip soldering in LED packages
    Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; Kouchi Zhang; Fenglian Sun; Liangliang Luo;
    Microelectronics Reliability,
    Volume 54, Issue 9-10, pp. 2028-2033, 2014.

  120. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, Kouchi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  121. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  122. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  123. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 1, pp. 138-142, 2014.

  124. Reliability and optical properties of LED lens plates under high temperature stress
    Maryam Yazdan Mehr; van Driel, WD; Koh, SW; Kouchi Zhang;
    Microelectronics Reliability,
    2014.

  125. Accelerated life time testing and optical degradation of remote phosphor plates
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 8, pp. 1544-1548, 2014.

  126. Multi-physics reliability simulation for solid state lighting drivers
    Tarashioon, S; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1212-1222, 2014.

  127. Fracture toughness of Cu-EMC interfaces in pressurized steam
    Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; Kouchi Zhang;
    International Journal of Adhesion and Adhesives,
    Volume 49, pp. 73-79, 2014.

  128. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
    Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 25, Issue 11, pp. 4954-4959, 2014.

  129. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
    Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
    Springer, 2014.

  130. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
    Guangjun Lu; Yuan, C; Fan, X; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-3, 2014.

  131. Reliability of LED-based Products is a Matter of Balancing Temperatures
    Maryam Yazdan Mehr; W.D. van Driel; Kouchi Zhang;
    In Therminic Conference,
    2014.

  132. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
    H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; Kouchi Zhang;
    In nanoFIS 2014 - Functional Integrated nanoSystems,,
    2014.

  133. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
    W. D. v. Driel; Maryam Yazdan Mehr; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  134. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; Kouchi Zhang;
    In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
    pp. 174-177, 2014.

  135. A novel design of heatsink-less LED base fluorescent lamp retrofit
    Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; Kouchi Zhang;
    In ICEPT2014,
    2014.

  136. Adapting LED lighting to compensate the influence of ambient light on the light color
    J.D.H. Wu; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  137. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; Kouchi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

  138. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
    C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In IEEE Sensors,
    pp. 827-830, 2014.
    document

  139. Colour shift in remote phosphor based LED products
    Maryam Yazdan Mehr; Driel, WD van; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1477-1481, 2014.

  140. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
    Tang, H; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1198-1201, 2014.

  141. Investigation of lumen degradation mechanisms of mid-power LED by HAST
    Jianlin Huang; Koh, SW; Xueming Li; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1437-1441, 2014.

  142. A model in predicting color of LED packages with different phosphor layer dimensions
    Wong, CKY; Leung, SYY; Xiong, YJ; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  143. Reliability and accelerated test methods for plastic materials in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  144. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
    Venkatesh, MR; Liu, P; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  145. Thermal performance of embedded heat pipe in high power density LED streetlight module
    Tang, H; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  146. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

  147. CNT bundles growth on microhotplates for direct measurement of their thermal properties
    C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
    San Francisco, USA, Jan. 2014.
    document

  148. High aspect ratio lithography for litho-defined wire bonding
    Esfahani, ZK; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1556-1561, 2014.

  149. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  150. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  151. Numerical modeling of flexible actuator for dynamic lighting
    Teng Ma; Xueming Li; Jia Wei; Kouchi Zhang; P. M. Sarro;
    In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
    2014.

  152. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; Kouchi Zhang;
    Dutch patent, 2014.

  153. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  154. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
    Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; Kouchi Zhang;
    Optical Materials,
    Volume 35, pp. 504-508, 2013.

  155. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; Kouchi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

  156. Cause analysis on highly depreciated indoor LED product in CSA020
    Guangjun Lu; Yuan C; Tang H; Wong C; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  157. Validation of the methodology of lumen depreciation acceleration of LED lighting
    Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  158. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

  159. Carbon Nanotube based heat-sink for solid state lighting
    F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; Kouchi Zhang; P.M. Sarro;
    In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
    pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

  160. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; Kouchi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

  161. An approach to Design for Reliability in solid state lighting systems at high temperatures
    S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

  162. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian; S. Koh; Kouchi Zhang;
    Microelectronics Reliability Journal,
    Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

  163. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
    A. Khiat; R.H. Poelma; Kouchi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

  164. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

  165. Analytical large deflection method for carbon nanotube youngs modulus determination
    N. Tolou; A. Khiat; Kouchi Zhang; J.L. Herder;
    International Journal of Nonlinear Sciences and Numerical Simulation,
    Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

  166. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
    J. Dong; A. Pandharipande; W. van Driel; Kouchi Zhang;
    IEEE Transactions on Signal Processing,
    Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

  167. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
    S. Koh; A. Saxena; W.D. van Driel; Kouchi Zhang; R. Tummala;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

  168. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

  169. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; Kouchi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  170. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
    D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; Kouchi Zhang;
    In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

  171. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; Kouchi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

  172. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
    J. Wei; C. Yue; Kouchi Zhang; J.F. Dijksman; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 2172-2175, Oct 2012.

  173. System approach for reliability of low-power power electronics: How to break down into their constructed parts
    S. Tarashioon; W.D. van Driel; Kouchi Zhang;
    In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
    Nuremberg, Germany, pp. 1-5, Mar. 2012.

  174. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

  175. Thermal and moisture degradation in SSL system
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

  176. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  177. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
    X. Chen; C. Yuan; C. Wong; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

  178. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
    X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; Kouchi Zhang;
    Molecular Simulation,
    Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

  179. A review of passive thermal management of LED module
    H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

  180. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
    X.P. Chen; C.A. Yuan; C.K.. Wong; Kouchi Zhang;
    Journal of Molecular Modeling,
    pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

  181. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
    R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

  182. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
    X.P. Chen; C.K.Y. Wong; C.A. Yuan; Kouchi Zhang;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

  183. Thermal analysis of HB LED packages and advanced materials
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; Kouchi Zhang;
    In ChinaSSL 2012, China,
    2011.

  184. Buckling analysis of carbon nanotubes and the influence of defect position
    R.H. Poelma; H. Sadeghian; S.W. Koh; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

  185. Co-design of wafer level thin film package assembly
    J.J.M. Zaal; F. Santagata; W.D. van Driel; Kouchi Zhang; J.F. Creemer; P.M. Sarro;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
    document

  186. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

  187. Degradation of epoxy lens materials in LED systems
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

  188. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

BibTeX support

Last updated: 15 Apr 2019