prof.dr. GuoQi Zhang

Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Heterogenous system integration, 2D materials and devices, wide bandgap semiconductor sensors, digital twin and reliability, multi-scale and multi-physics modeling

Themes: Micro/Nano System Integration and Reliability

Biography

Dr. G.Q. Zhang is IEEE Fellow, chair professor for "Micro/Nanoelectronics System Integration and Reliability" of Delft University of Technology (TUD). His research interests cover multi-level heterogeneous system integration and packaging; multi-physics and multiscale modelling and optimization of micro/nanoelectronics; digital twin and designing for reliability; wide-bandgap semiconductors sensors and components; SSL technology; and their applications mainly in healthcare, energy and mobility.

He authored/co-authored more than 450 scientific publications; chaired /co-chaired several international conferences; serves as chief editor for Springer book series "SSL Technology and Applications", chief editor for Science Partner Journal “BioMedical Engineering Frontiers” and associated editor for three other international journals. He serves as deputy director of European Center for Micro- and Nanoreliability (EUCEMAN); co-chair of Advisory Board of International Solid-State Lighting Alliance (ISA); secretary-general of IEEE ITRW (International Technology Roadmap of Wide bandgap power semiconductors).

He chaired the Strategic Research Agenda of “More than Moore” of European’s technology platform for micro/nanoelectronics; served as co-chair of the academic council of Dutch national innovation program “Point-One” on “Micro/nanoelectronics and embedded system”; he was the founding person for MEMSLand, the NL national MEMS research consortium. Before becoming full-time professor of TUD, he worked for NXP Semiconductors as Senior Director of Technology Strategy until 2009, Philips Research Fellow until May 2013. He was also a part-time professor of Technical University of Eindhoven from 2001 and part-time professor of TUD from 2005.

ET4277 Microelectronics reliability

Reliability issues involved in electronic components and system

ET4391 Advanced microelectronics packaging

Basics and state-of-the-art of semiconductor packaging

Restoring Cardiac Mechanical Function by Polymeric Artificial Muscular Tissue

Challenging environments tolerant smart systems for IoT

In-vehicle health monitoring

Intelligent Reliability 4.0

Internet of Things (IoT) security through machine learning and data sharing

Power2Power

European research project Power2Power for more efficient power semiconductors

High Performance Vehicle Computer and Communication System for Autonomous Driving

Solid State Lighting reliability for automotive application

GaN-based PiN Diodes for RF Power Limiter Application

Monolithically integrated SiC sun sensor for Space

Advanced packaging technology of SiC power module

High performance devices based on advanced materials

IoSense

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

2D materials-based Heat Waste Recovery of LED

Projects history

Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature

Thermal management in 3d heterogeneous integration

Gallium nitride (GaN) on silicon system integration

LED Luminaire Colour Shift

Smart Optics

Quick reliability assessment for mid-power white-light LED packages

3D System-in-package Design Using Stacked Silicon Submount Technology

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module

  1. Review of Packaging Schemes for Power Modules
    Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
    IEEE Journal of Emerging and Selected Topics in Power Electronics,
    Volume 8, Issue 1, pp. 223-238, 2020.

  2. Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
    Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
    IEEE Journal of Emerging and Selected Topics in Power Electronics,
    Volume 8, Issue 1, pp. 367-380, 2020.

  3. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
    Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; Guoqi Zhang;
    IEEE Transactions on Power Electronics,
    Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

  4. Towards Multi-Functional SiO2@YAG:Ce Core–Shell Optical Nanoparticles for Solid State Lighting Applications
    Mahdi Kiani Khouzani; Abbas Bahrami; Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
    Nanomaterials,
    Volume 10, Issue 1, pp. 153, 2020. DOI: https://doi.org/10.3390/nano10010153

  5. Maintaining Transparency of a Heated MEMS Membrane for Enabling Long-Term Optical Measurements on Soot-Containing Exhaust Gas
    Luke M. Middelburg; Mohammadamir Ghaderi; David Bilby; Jaco H. Visser; GuoQi Zhang; Per Lundgren; Peter Enoksson; Reinoud F. Wolffenbuttel;
    MDPI Sensors,
    Volume 20, 2020. DOI: https://doi.org/10.3390/s20010003

  6. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: https://doi.org/10.1016/j.apsusc.2020.145251

  7. Degradation of optical materials in solid-state lighting systems
    M. Yazdan Mehr; A. Bahrami; W.D. van Driel; Xuejun Fan; J. L. Davis; GuoQi Zhang;
    International Materials Reviews,
    Volume 65, Issue 2, pp. 102-128, 2020.

  8. Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time
    Amir Mirza Gheytaghia; Amir Ghaderi; Sten Vollebregt; Majid Ahmadic; Reinoud Wolffenbuttel; GuoQi Zhang;
    Materials Research Bulletin,
    2020. DOI: https://doi.org/10.1016/j.materresbull.2020.110821

  9. Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration
    L.M. Middelburg; H.W. van Zeijl; S. Vollebregt; B. Morana; GuoQi Zhang;
    IEEE Sensors,
    2020. DOI: 10.1109/JSEN.2020.2998915

  10. Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
    Amir Mirza Gheitaghy; René H. Poelma; Leandro Sacco; Sten Vollebregt; GuoQi Zhang;
    MDPI Nanomaterials,
    Volume 10, Issue 6, pp. 1189, 2020. DOI: https://doi.org/10.3390/nano10061189

  11. Ultraviolet Sensing in WBG: SiC
    Brahim el Mansouri; W.D. van Driel; GuoQi Zhang;
    Springer, , pp. 397-425, 2020.

  12. From Si Towards SiC Technology for Harsh Environment Sensing
    L. M. Middelburg; W. D. van Driel; GuoQi Zhang;
    Springer, , 2020.

  13. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

  14. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: https://doi.org/10.1109/TCPMT.2018.2884032

  15. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
    Ruisheng Xu; Yang Liu; Hao Zhang; Zhao Li; Fenglian Sun; GuoQi Zhang;
    Journal of Electronic Materials,
    Volume 48, Issue 3, pp. 1758-1765, 2019. DOI: https://doi.org/10.1007/s11664-018-06865-1

  16. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater
    Jianwen Sun; Robert Sokolovskij; Elina Iervolino; Fabio Santagata; Zewen Liu; Pasqualina M. Sarro; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    2019. DOI: https://doi.org/10.1109/TED.2019.2936912
    document

  17. First principles study of gas molecules adsorption on monolayered β-SnSe
    Liu, T.; Qin, H.; Yang, D.; GuoQi Zhang;
    Coatings,
    2019. DOI: https://doi.org/10.3390/COATINGS9060390

  18. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs
    Cai, M.; Liang, Y.; Yun, M.; Chen, X-Y.; Yan, H.; Yu, Z.; Yang, D.; GuoQi Zhang;
    IEEE Access,
    2019. DOI: https://doi.org/10.1109/ACCESS.2019.2900361

  19. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer
    Venkatesh, M. R.; Sachdeva, S.; El Mansouri, B.; Wei, J.; Bossche, A.; Bosma, D.; de Smet; L. C. P. M.; Sudhölter, E. J. R.; GuoQi Zhang;
    Sensors (Basel, Switzerland),
    2019. DOI: https://doi.org/10.3390/s19040888

  20. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
    Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
    Microsystems & Nanoengineering,
    Volume 5, 2019.
    document

  21. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
    Lin, P.; Xie, X.; Wang, Y.; Lian, B.; GuoQi Zhang;
    Microsystem Technologies,
    2019. DOI: https://doi.org/10.1007/s00542-018-4249-8

  22. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer
    Niu, F.; Cai, M.; Pang, J.; Li, X.; GuoQi Zhang, G.; Yang, D.;
    Surface Science,
    2019. DOI: https://doi.org/10.1016/j.susc.2019.02.008

  23. Degradation of optical materials in solid-state lighting systems
    Yazdan Mehr, M.; Bahrami, A.; van Driel, W. D.; Fan, X. J.; Davis, J. L.; GuoQi Zhang;
    International Materials Reviews,
    2019. DOI: https://doi.org/10.1080/09506608.2019.1565716

  24. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
    Fengze Hou; Wang, W.; Zhang, H.; Chen, C.; Chen, C.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    Applied Thermal Engineering,
    Volume 163, pp. 114338, 2019. DOI: https://doi.org/10.1016/j.applthermaleng.2019.1143

  25. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers
    Feng, C.; Qin, H.; Yang, D.; GuoQi Zhang;
    Materials,
    2019. DOI: https://doi.org/10.3390/ma12040676

  26. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity
    Ye, H.; Liu, L.; Xu, Y.; Wang, L.; Chen, X.; Zhang, K.; Liu, Y.; Koh, S.; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: https://doi.org/10.1016/j.apsusc.2019.03.346

  27. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes
    Fan, J.; Wang, Z.; Zhang, X.; Deng, Z.; Fan, X.; GuoQi Zhang;
    Polymers,
    2019. DOI: https://doi.org/10.3390/polym11081277

  28. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array
    Bashirpour, M.; Poursafar, J.; Kolahdouz, M.; Hajari, M.; Forouzmehr, M.; Neshat, M.; Hajihoseini, H.; Fathipour, M.; Kolahdouz, Z.; GuoQi Zhang;
    Optics and Laser Technology,
    2019. DOI: https://doi.org/10.1016/j.optlastec.2019.105726

  29. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance
    Hongyu Tang; Qu, Z.,; Wang, L.; Ye, H.; GuoQi Zhang; Fan, X.;
    Physical Chemistry Chemical Physics,
    2019. DOI: https://doi.org/10.1039/c9cp03381e

  30. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
    Chen, W.; Fan, J.; Qian, C.; Pu, B.; Fan, X.; GuoQi Zhang;
    IEEE Access,
    2019. DOI: https://doi.org/10.1109/ACCESS.2019.2916878

  31. Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source
    E C A Nyns; R H Poelma; L Volkers; C I Bart; T J Van Brakel; K Zeppenfeld; M J Schalij; GuoQi Zhang; A A F De Vries; D A Pijnappels;
    European Heart Journal,
    Volume 40, Issue 1, 2019. DOI: https://doi.org/10.1093/eurheartj/ehz748.0090

  32. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
    Emile C. A. Nyns; René H. Poelma; Linda Volkers; Jaap J. Plomp; Cindy I. Bart; Annemarie M. Kip; Thomas J. van Brakel; Katja Zeppenfeld; Martin J. Schalij; GuoQi Zhang; Antoine A. F. de Vries; Daniël A. Pijnappels;
    Science Translational Medicine,
    Volume 11, Issue 481, 2019. DOI: 10.1126/scitranslmed.aau6447

  33. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
    Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; GuoQi Zhang; Rong Sun; Chingping Wong;
    ACS Applied Materials & Interfaces,
    2019.

  34. 循环电载荷下大功率LED金引线疲劳断裂寿命预测
    Fan, J.; Li, L.; Qian, C.; Hu, A.; Fan, X.; GuoQi Zhang;
    Journal of Beijing University of Aeronautics and Astronautics,
    2019. DOI: https://doi.org/10.13700/j.bh.1001-5965.2018.0401

  35. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
    Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
    ACS Applied Materials and Interfaces,
    pp. 40850-40859, 2019. DOI: https://doi.org/10.1021/acsami.9b13773

  36. Characterization of PCB Embedded Package Materials for SiC MOSFETs
    Fengze Hou; Wang, W.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 9, Issue 6, pp. 1054-1061, 2019. DOI: https://doi.org/10.1109/TCPMT.2019.2904533

  37. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun; GuoQi Zhang;
    Journal of Luminescence,
    2019. DOI: https://doi.org/10.1016/j.jlumin.2019.116874

  38. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater
    Jianwen Sun; Teng Zhan; Zewen Liu; Junxi Wang; Xiaoyan Yi; Lina Sarro; GuoQi Zhang;
    Optics Express,
    Volume 27, Issue 25, 2019.
    document

  39. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response
    Chenshan Gao; Yingying Zhang; Huiru Yang; Yang Liu; Yufei Liu; Jihe Dua; Huaiyu Ye; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: https://doi.org/10.1016/j.apsusc.2019.07.067

  40. Suspended AlGaN/GaN HEMT NO2 Gas Sensor Integrated with Micro-heater
    Jianwen Sun; Robert Sokolovskija; Elina Iervolino; Zewen Liu; Pasqualina M. Sarro; GuoQi Zhang;
    Journal of Microelectromechanical Systems,
    2019.
    document

  41. Impact of high temperature H2 pre-treatment on Pt-AlGaN/GaN HEMT sensor for H2S detection
    Jian Zhang; Robert Sokolovskij; Ganhui Chen; Yumeng Zhu; Yongle Qi; Xinpeng Lin; Wenmao Li; GuoQi Zhang; Yu-Long Jiang; Hongyu Yu;
    Sensors and Actuators, B: Chemical,
    Volume 280, pp. 138-143, 2019. DOI: https://doi.org/10.1016/j.snb.2018.10.052

  42. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019. DOI: https://doi.org/10.1108/SSMT-01-2018-0005

  43. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019. DOI: https://doi.org/10.1016/j.rinp.2018.12.026

  44. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019. DOI: https://doi.org/10.1063/1.5065376

  45. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: https://doi.org/10.1109/TRANSDUCERS.2019.8808192

  46. Degradation Prediction of Electronic Packages using Machine Learning
    Prisacaru, A.; Guerrero, E. O.; Gromala, P. J.; Han, B.; GuoQi Zhang;
    In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724523

  47. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability
    Wang, S.; Tan, C.; Wang, L.; Luo, H.; GuoQi Zhang; Chen, X.;
    In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EDTM.2019.8731110

  48. Compressive response of pristine and superconductor coated MWCNT pillars
    A. M. Gheytaghi; S. Vollebregt; R.H. Poelma; H. W. Zeijl; GuoQi Zhang;
    In IEEE MEMS,
    2019.

  49. A SPICE-based transient thermal-electronic model for LEDs
    Bo Sun; Fan, J.; Fan, X.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724555

  50. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions
    Mehr, M. Y.; Van Driel, W.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724524

  51. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap
    Zhang, Y.; Tao, L.; Li, X.; GuoQi Zhang; Chen, X.;
    In Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE,
    IEEE, 2019. DOI: https://doi.org/10.1109/EDTM.2019.8731255

  52. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process
    Jing, Z.; Ibrahim, M. S.; Fan, J.; Fan, X.; GuoQi Zhang;
    In 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE,
    2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724571

  53. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    IEEE, IEEE, 2019. DOI: https://doi.org/10.1109/EuroSimE.2019.8724549

  54. A review on discoloration and high accelerated testing of optical materials in LED based-products
    M. Yazdan Mehr; M.R. Toroghinejad; F. Karimzadeh; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 136-142, 2018.

  55. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

  56. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  57. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation
    Amir Mirza Gheytaghi; Hamid Saffari; GuoQi Zhang;
    Heat Transfer Engineering,
    2018.

  58. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
    H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
    ETV Maxwell,
    Volume 21.2, 2018.

  59. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
    Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; GuoQi Zhang; Xuejun Fan;
    Applied Mechanics Reviews,
    Volume 70, Issue 2, pp. 020803-1-16, 2018.

  60. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
    Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
    Small,
    Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614

  61. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  62. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

  63. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  64. A stochastic process based reliability prediction method for LED driver
    Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; GuoQi Zhang;
    Reliability Engineering and System Safety,
    Volume 178, pp. 140-146, 2018.

  65. Germanene on single layer ZnSe substrate: Novel electronic and optical properties
    H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; GuoQi Zhang;
    Physical Chemistry Chemical Physics,
    Volume 20, Issue 23, pp. 16067-16076, 2018.

  66. High Selective Gas Detection for small molecules based on Germanium selenide monolayer
    Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 575-581, 2018. DOI: https://doi.org/10.1016/j.apsusc.2017.10.084

  67. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
    Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    2018. DOI: https://doi.org/10.1016/j.snb.2018.08.015

  68. In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
    Prisacaru, A.; Palczynska, A.; Theissler, A.; Gromala, P.; Han, B.; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 750-763, 2018. DOI: https://doi.org/10.1109/TCPMT.2018.2816259

  69. Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
    Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; GuoQi Zhang;
    Crystals,
    2018. DOI: https://doi.org/10.3390/cryst8110428

  70. Study on the Degradation of Optical Silicone Exposed to Harsh Environments
    Yazdan Mehr, M.; van Driel, W.; De Buyl, F.; GuoQi Zhang;
    Materials,
    2018. DOI: https://doi.org/10.3390/ma11081305

  71. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
    Yang, N.; Yang, D.; GuoQi Zhang; Chen, L.; Liu, D.; Cai, M.; Fan, X.;
    Sensors,
    2018. DOI: https://doi.org/10.3390/s18020422

  72. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
    Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Results in Physics,
    2018. DOI: https://doi.org/10.1016/j.rinp.2018.10.005

  73. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
    Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    pp. 13167-13175, 2018. DOI: https://doi.org/10.1007/s10854-018-9440-2

  74. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
    Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 554-561, 2018. DOI: https://doi.org/10.1016/j.apsusc.2018.08.014

  75. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
    Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; GuoQi Zhang;
    Applied Energy,
    Volume 228, pp. 1454-1472, 2018.

  76. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
    Bo Sun; Fan, X.; van Driel, W. D. (ed.); GuoQi Zhang;
    Springer, , 2018. DOI: https://doi.org/10.1007/978-3-319-58175-0_16

  77. LED-Based Luminaire Color Shift Acceleration and Prediction
    Lu, G.; van Driel, W. D. (ed.); Fan, X.; Fan, J.; GuoQi Zhang;
    Springer, , pp. 201-219, 2018. DOI: https://doi.org/10.1007/978-3-319-58175-0_9

  78. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
    Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
    In Solid State Lighting Reliability Part 2,
    Springer, 2018.

  79. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
    Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
    In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
    pp. 1365- 1370, 2018.

  80. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  81. Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
    Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    2018.

  82. Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
    Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
    In IEEE Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, 2018.

  83. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  84. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  85. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
    Fan, J.; Hu, A.; Pecht, M.; Chen, W.; Fan, X.; Xu, D.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, pp. pp. 1642-1648, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480748

  86. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
    Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
    In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480781

  87. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
    Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
    In Proc. IEEE Sensors,
    2018. DOI: https://doi.org/10.1109/ICSENS.2018.8589630

  88. The performance of sintered nanocopper interconnections for high temperature device
    Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480591

  89. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
    Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
    In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
    2018. DOI: https://doi.org/10.1109/EDTM.2018.8421434

  90. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
    Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C.; Fan, X.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, pp. 525-530, 2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480566

  91. Shining light on cardiac tachyarrhythmias
    Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; GuoQi Zhang; de Vries A AF; Pijnappels D A;
    In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
    2018. DOI: https://doi.org/10.1089/hum.2018.29077.abstracts

  92. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
    Prisacaru, A.; Sun, Y.; Gromala, P. J.; Han, B.; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE,
    IEEE, pp. 1-3, 2018. DOI: https://doi.org/10.1109/EuroSimE.2018.8369955

  93. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
    Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
    Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

  94. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
    HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
    IEEE Electron Device Letters,
    Volume 38, Issue 8, pp. 1139-1142, 2017.

  95. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  96. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
    Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; GuoQi Zhang;
    Journal of Electronic Materials,
    Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8
    Keywords: ... graphene, Light-emitting diode, reliability, remote phosphor.

  97. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
    Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014
    Keywords: ... BPA-PC, LED-based products, Optics, Oxidation, Yellowing.

  98. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
    Y Liu; H Fu; H Zhang; F Sun; X Wang; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 24, pp. 19113-19120, 2017.

  99. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
    Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 197-204, 2017.

  100. Phosphor–silicone interaction effects in high power white light emitting diode packages
    J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 23, pp. 17557-17569, 2017.

  101. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
    C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
    Materials,
    Volume 10, Issue 10, pp. 1181, 2017.

  102. Modeling nonlinear moisture diffusion in inhomogeneous media
    L Chen; J Zhou; H Chu; GuoQi Zhang; X Fan;
    Microelectronics Reliability,
    Volume 75, pp. 162-170, 2017.

  103. Humidity sensor based on the ionic polymer metal composite
    E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 247, pp. 498-504, 2017.

  104. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
    Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
    Small,
    Volume 13, Issue 29, pp. 1604150, 2017.

  105. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
    Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
    Sensors and Actuators A: Physical,
    Volume 263, pp. 622-632, 2017.

  106. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
    J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 23, Issue 4, 2017.

  107. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

  108. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
    J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 179-185, 2017.

  109. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
    FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 7, pp. 983-986, 2017.

  110. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
    C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 173-178, 2017.

  111. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
    Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
    IEEE Transactions on Components and Packaging and Manufacturing Technology,
    Volume 7, Issue 7, pp. 1081-1088, 2017.

  112. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
    Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
    Reliability Engineering & System Safety,
    Volume 163, pp. 14-21, 2017.

  113. Integrated virtual impactor enabled PM 2.5 sensor
    Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
    IEEE Sensors Journal,
    Volume 17, Issue 9, pp. 2814-2821, 2017.

  114. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
    XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 5, pp. 661-664, 2017.

  115. Color shift modeling of light-emitting diode lamps in step-loaded stress testing
    M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 1, pp. 1-14, 2017.

  116. Monolithically integrated light feedback control circuit for blue/UV LED smart package
    Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 2, pp. 1-13, 2017.

  117. Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
    J Dong; GuoQi Zhang;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 3, pp. 2215-2225, 2017.

  118. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
    C Qian; J Fan; X Fan; GuoQi Zhang;
    IEEE Access,
    Volume 5, pp. 24054-24061, 2017.

  119. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
    IEEE Access,
    Volume 5, Issue 5, pp. 16459-16468, 2017.

  120. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
    J Fan; MG Mohamed; C Qian; X Fan; GuoQi Zhang; M Pecht;
    Materials 10,
    Volume 7, pp. 819, 2017.

  121. High aspect ratio spiral resonators for process variation investigation and MEMS applications
    L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
    In Proc. IEEE Sensors,
    2017.

  122. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
    C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  123. Smart Systems Integration in the era of Solid State Lighting
    GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M. R.Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

  124. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
    Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; GuoQi Zhang; Pasqualina M Sarro;
    In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
    pp. 266-269, 2017.

  125. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
    C Jiang; W Guo; J Fan; C Qian; X Fan; GuoQi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  126. Luminous flux modeling for high power LED automotive headlamp module
    C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  127. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
    R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
    In Proceedings of Eurosensors,
    pp. 463, 2017.

  128. Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
    A Prisacaru; A Palczynska; PJ Gromala; B Han; GuoQi Zhang;
    In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
    2017.

  129. A PoF and statistics combined reliability prediction for LED arrays in lamps
    B Sun; X Fan; J Fan; C Qian; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  130. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
    Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  131. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
    I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  132. SnS monolayer as gas sensors: Insights from a first-principles investigation
    F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  133. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
    K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  134. Adsorption of gases on monolayer GeSe: A first principle study
    L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  135. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
    Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  136. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
    J Fan; C Xie; C Qian; X Fan; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  137. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
    C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  138. Prognostics and health monitoring of electronic system: A review
    A Prisacaru; PJ Gromala; MB Jeronimo; B Han; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  139. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
    Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    2017.

  140. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
    C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; GuoQi Zhang;
    Reliability Engineering and System Safety,
    Volume 147, pp. 84-92, 2016.

  141. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

  142. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
    Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 37, Issue 4, 2016.

  143. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 63, pp. 2807-2814, 2016.

  144. Silicon microfabrication based particulate matter sensor
    Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
    Sensors and Actuators A: Physical,
    Volume 247, pp. 115-124, 2016.

  145. Output blue light evaluation for phosphor based smart white LED wafer level packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
    Optics Express,
    Volume 24, Issue 4, pp. 174-177, 2016.

  146. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
    A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; GuoQi Zhang;
    Micro and Nano Letters,
    Volume 11, Issue 8, pp. 412, 2016.

  147. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
    Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
    Nanoscale,
    Volume 8, pp. 8266-8275, 2016.
    document

  148. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

  149. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  150. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  151. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
    Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
    Keywords: ... Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

  152. Lumen Decay Prediction in LED Lamps
    Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
    Keywords: ... Reliability, LED Lamp, Lumen Decay Prediction.

  153. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

  154. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
    Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
    In IEEE 66th Electronic Components and Technology Conference (ECTC),
    2016.
    document

  155. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
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  156. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
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  157. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
    R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1094-1097, 2016.

  158. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
    A. M. Gheitaghy; H. Saffari; GuoQi Zhang;
    In 18th International Conference on Thermal Engineering,
    2016.

  159. Thermal analysis and optimization of IGBT power electronic module based on layout model
    Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
    In ICEPT,
    2016.

  160. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
    R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 5, pp. 055017, 2015.

  161. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
    H. Wu; J. Dong; G. Qi; GuoQi Zhang;
    Journal of the Optical Society of America A,
    Volume 32, Issue 7, pp. 1262-1270, 2015.

  162. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
    Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 36, Issue 6, 2015.

  163. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

  164. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
    Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 478-485, 2015.

  165. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
    F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; GuoQi Zhang;
    IEEE Photonics Technology Letters,
    Volume 27, Issue 13, pp. 1430-1433, 2015.

  166. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
    R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; GuoQi Zhang;
    Journal of Crystal Growth,
    Volume 426, pp. 228-233, 2015.

  167. Degradation modeling of mid-power white-light LEDs by using Wiener process
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
    Optics Express,
    Volume 23, pp. A966-A978, 2015.

  168. Highly selective and responsive ultra-violet detection using an improved phototransistor
    R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; GuoQi Zhang;
    Applied Physics Letters,
    Volume 106, Issue 23, pp. 231102, 2015.

  169. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
    Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 55, Issue 2654-2662, 2015.

  170. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
    Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 2, pp. 220-228, 2015.

  171. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  172. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

  173. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  174. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
    R. H. Poelma; GuoQi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
    Springer, 2015.

  175. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

  176. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

  177. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  178. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
    Maryam Yazdan Mehr; W. D. van Driel; H. Udono; GuoQi Zhang;
    Optical Materials,
    Volume 37, pp. 155-159, 2014.

  179. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  180. Thermal and mechanical effects of voids within flip chip soldering in LED packages
    Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
    Microelectronics Reliability,
    Volume 54, Issue 9-10, pp. 2028-2033, 2014.

  181. Reliability and optical properties of LED lens plates under high temperature stress
    Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
    Microelectronics Reliability,
    2014.

  182. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  183. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 1, pp. 138-142, 2014.

  184. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  185. Accelerated life time testing and optical degradation of remote phosphor plates
    Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 8, pp. 1544-1548, 2014.

  186. Multi-physics reliability simulation for solid state lighting drivers
    Tarashioon, S; van Driel, WD; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1212-1222, 2014.

  187. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
    Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 25, Issue 11, pp. 4954-4959, 2014.

  188. Fracture toughness of Cu-EMC interfaces in pressurized steam
    Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
    International Journal of Adhesion and Adhesives,
    Volume 49, pp. 73-79, 2014.

  189. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
    Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
    Springer, 2014.

  190. Reliability of LED-based Products is a Matter of Balancing Temperatures
    Maryam Yazdan Mehr; W.D. van Driel; GuoQi Zhang;
    In Therminic Conference,
    2014.

  191. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
    H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
    In nanoFIS 2014 - Functional Integrated nanoSystems,,
    2014.

  192. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
    Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-3, 2014.

  193. Numerical modeling of flexible actuator for dynamic lighting
    Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
    In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
    2014.

  194. A novel design of heatsink-less LED base fluorescent lamp retrofit
    Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
    In ICEPT2014,
    2014.

  195. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; GuoQi Zhang;
    In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
    pp. 174-177, 2014.

  196. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
    W. D. v. Driel; Maryam Yazdan Mehr; GuoQi Zhang;
    In 11th China SSL conference,
    2014.

  197. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
    C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
    In IEEE Sensors,
    pp. 827-830, 2014.
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  198. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

  199. Colour shift in remote phosphor based LED products
    Maryam Yazdan Mehr; Driel, WD van; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1477-1481, 2014.

  200. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
    Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1198-1201, 2014.

  201. Investigation of lumen degradation mechanisms of mid-power LED by HAST
    Jianlin Huang; Koh, SW; Xueming Li; GuoQi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1437-1441, 2014.

  202. Reliability and accelerated test methods for plastic materials in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  203. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
    Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  204. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

  205. Thermal performance of embedded heat pipe in high power density LED streetlight module
    Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  206. High aspect ratio lithography for litho-defined wire bonding
    Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1556-1561, 2014.

  207. CNT bundles growth on microhotplates for direct measurement of their thermal properties
    C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
    In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
    San Francisco, USA, Jan. 2014.
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  208. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  209. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  210. Adapting LED lighting to compensate the influence of ambient light on the light color
    J.D.H. Wu; GuoQi Zhang;
    In 11th China SSL conference,
    2014.

  211. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
    Dutch patent, 2014.

  212. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
    Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; GuoQi Zhang;
    Optical Materials,
    Volume 35, pp. 504-508, 2013.

  213. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  214. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

  215. Cause analysis on highly depreciated indoor LED product in CSA020
    Guangjun Lu; Yuan C; Hongyu Tang; Wong C; Fan XJ; GuoQi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  216. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

  217. Validation of the methodology of lumen depreciation acceleration of LED lighting
    Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; GuoQi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  218. Carbon Nanotube based heat-sink for solid state lighting
    F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
    In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
    pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

  219. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

  220. An approach to �Design for Reliability� in solid state lighting systems at high temperatures
    S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

  221. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
    Microelectronics Reliability Journal,
    Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

  222. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
    A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

  223. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

  224. Analytical large deflection method for carbon nanotube young�s modulus determination
    N. Tolou; A. Khiat; GuoQi Zhang; J.L. Herder;
    International Journal of Nonlinear Sciences and Numerical Simulation,
    Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

  225. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
    J. Dong; A. Pandharipande; W. van Driel; GuoQi Zhang;
    IEEE Transactions on Signal Processing,
    Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

  226. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

  227. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
    S. Koh; A. Saxena; W.D. van Driel; GuoQi Zhang; R. Tummala;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

  228. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  229. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
    D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
    In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

  230. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
    J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 2172-2175, Oct 2012.

  231. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

  232. Thermal and moisture degradation in SSL system
    S. Koh; W.D. van Driel; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

  233. System approach for reliability of low-power power electronics: How to break down into their constructed parts
    S. Tarashioon; W.D. van Driel; GuoQi Zhang;
    In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
    Nuremberg, Germany, pp. 1-5, Mar. 2012.

  234. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  235. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

  236. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
    X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

  237. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
    X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
    Molecular Simulation,
    Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

  238. A review of passive thermal management of LED module
    H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

  239. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
    R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

  240. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
    X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
    Journal of Molecular Modeling,
    pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

  241. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
    X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

  242. Thermal analysis of HB LED packages and advanced materials
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
    In ChinaSSL 2012, China,
    2011.

  243. Buckling analysis of carbon nanotubes and the influence of defect position
    R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

  244. Co-design of wafer level thin film package assembly
    J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
    document

  245. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

  246. Degradation of epoxy lens materials in LED systems
    S. Koh; W.D. van Driel; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

  247. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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